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Thick Film Devices Market - Growth, Trends, and Forecast (2020 - 2025)

  • ID: 4557785
  • Report
  • January 2020
  • 120 pages
  • Mordor Intelligence
UP TO OFF
until Mar 31st 2020
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FEATURED COMPANIES

  • AVX Corporation
  • General Electric Company
  • Panasonic Corporation
  • Rohm Semiconductor GmbH
  • Sharp Corporation
  • TE Connectivity Ltd
  • MORE
Market Overview

The thick film devices market has been valued at USD 83.21 billion in 2019 and is expected to register a CAGR of 14.04% during the forecast period (2020 - 2025) to reach USD 177.13 billion by 2025. The rising demand for solar cells and flexible devices, such as sensors are expected to propel the thick film devices market growth. For instance, in March 2018, Saudi Arabia and Japanese SoftBank signed an MoU to build the world’s largest photovoltaic (PV), USD 200 billion, solar project by 2030. The drive for harnessing solar energy and cut the carbon emission augmented with declining solar panel price per unit area is expected to be among driving factor for demand.
  • Thick film technology is widely used in the manufacturing process of the devices, such as electronic and electrical devices. However, the technical aspect of both the technologies over devices is radiantly different.
  • The tolerance and temperature coefficient of thick film devices are higher than that of a thin film, which is likely to boost the market growth. Furthermore, thick films are relatively more resistant to the moisture owing to their glass-like structure which is expected to bolster the market growth over the projected period.
  • For use in applications in the aerospace, military, communications, medical, and industrial market segments, thick-film elements have a higher surge tolerance than thin-film, also improving reliability. Therefore, forcing vendors to adopt thick film technology. For instance, in April 2018, TT Electronics announced the latest versions of these thick-film chip resistors that are smaller in size and hence, offer massive opportunities for use in compact circuits, where guaranteed performance and footprint size are critical.
Scope of the Report

Thick film devices are single-layered or multi-layered structures that are made up by the deposition of a formulated paste on a substrate. The substrate is made of different materials such as ceramic, polymer, and metals. The layer deposited on the substrate facilitates mechanical, electrical, and chemical functionality for the device, in which the layer is fabricated. Thick film devices are widely used in energy devices such as photovoltaic cells and fuel cells as well as in the electronic devices such as capacitors and circuit devices. Moreover, the thick film devices find their use in mechanical and chemical devices, which consist of optical sensors and piezoelectric devices.

Key Market Trends

Growing Demand for Electronic and Electrical Components
  • Adoption of electrical and electronic devices are booming across the globe wherein the utilization of thick film devices is vital owing to which it is expected to witness high demand. Moreover, the rising demand for solar cells and flexible devices such as sensors are expected to propel the thick film devices market growth.
  • The growing production of automotive is a major factor driving the market growth, a huge amount of electrical and electronic devices are used in automotive manufacturing. This adoption is further exponentially increasing, with the trend of electric vehicles globally.
  • For instance, Datec Coating Corporation was awarded up to USD 1.3 million from Innovation, Science and Economic Development Canada for Automotive Supplier Innovation Program, especially for electric and hybrid vehicles.
  • Additionally, the government across the globe is highly focused on investment in infrastructure and communication projects which will certainly fuel the demand for thick film devices thereby fostering the market growth. For instance, the UK government will spend 6849.9 GBP million towards national infrastructure and construction pipeline project in communication sector which will create a huge market for thick film devices.
Asia-Pacific to Witness the Highest Growth
  • Asia Pacific countries such as India and China are rigorously investing in their public and private infrastructure and communication system, which is expected to have a positive impact on the market growth over the forecast period. India is promoting “Make in India” campaign encouraging 100% foreign direct investment, which can be an opportunity to penetrate into the thick film devices market.
  • The consumption of semiconductors is rapidly increasing in China, compared to other countries, owing to the continuing transfer of global, diverse electronic equipment to China, wherein the product is a necessary component. Also, the country is home to three of the top five largest smartphone companies in the world, posing tremendous opportunities for thick film device market.
  • According to India Electronics and Semiconductor Association, the semiconductor component market in the country is expected to be worth USD 32.35 billion by 2025, displaying CAGR of 10.1% (2018 -2025). The report states that the country is a lucrative destination for global R&D centers. Thus, ongoing Make in India initiative by the government is expected to result in investments in the semiconductor industry in the country, further providing ample opportunities for the market. 2025”, is highly focused on the strategy to build a robust manufacturing nation, across the world.
Competitive Landscape

The thick film devices market is consolidated due to a major share of the market is occupied by top players. Moreover, the new player finds it difficult to enter the market due to the strong dominance of existing players. Some of the key players include General Electric Company, Panasonic Corporation, Samsung Electronics Co. Ltd, Sharp Corporation, Vishay Intertechnology Inc., TE Connectivity Ltd, KOA Speer Electronics, Inc., AVX Corporation, among others.

January 2019 - AVX Corporation, a leading manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions, introduced a new line of ultraminiature, thin-film transmission line capacitors for high-frequency links, DC blocking in the UHF range (300MHz – 3GHz), and other high-performance microwave and RF applications. The new capacitors have a novel metal-insulator-metal (MIM) structure, copper traces for optimal circuit conductivity, a transmission line wire-bond pad, and a gold-metalized backside ground, and can be supplied on a variety of low-loss substrates, including quartz, alumina, glass, and silicon. The new transmission line capacitors are also available in a wide range of capacitance values: 0.3-50pF with a ±20% tolerance, and each is made using a high-frequency structure simulator (HFSS) to proactively address any electromagnetic challenges and provide the highest possible RF performance and reliability.

January 2018 - Ferro Techniek launched FTH XL, a flow-through heater based on thick film technology, which has a max capacity of 3400W at 230V. This is expected to attract a wide range of consumers and bring a high influx of revenue.

Reasons to Purchase this report:
  • The market estimate (ME) sheet in Excel format.
  • Report customization as per the client's requirements.
  • 3 months of analyst support.
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • AVX Corporation
  • General Electric Company
  • Panasonic Corporation
  • Rohm Semiconductor GmbH
  • Sharp Corporation
  • TE Connectivity Ltd
  • MORE
1 INTRODUCTION
1.1 Study Deliverables
1.2 Study Assumptions
1.3 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS
4.1 Market Overview
4.2 Market Drivers
4.2.1 Growing Demand For Electronic And Electrical Components
4.3 Market Restraints
4.3.1 Stringent Government Regulations And High Investment Cost
4.4 Industry Value Chain Analysis
4.5 Industry Attractiveness - Porter's Five Force Analysis
4.5.1 Bargaining Power of Suppliers
4.5.2 Bargaining Power of Buyers/Consumers
4.5.3 Threat of New Entrants
4.5.4 Threat of Substitute Products
4.5.5 Intensity of Competitive Rivalry
4.6 Technology Snapshot

5 MARKET SEGMENTATION
5.1 By Application
5.1.1 Capacitors
5.1.2 Thermistors
5.1.3 Photovoltaic cells
5.1.4 Heaters
5.1.5 Circuit devices
5.1.6 Other Applications (Rigid displays, Flexible displays, Piezoelectric devices)
5.2 By End-user Vertical
5.2.1 Automotive
5.2.2 Healthcare
5.2.3 Consumer Electronics
5.2.4 Medical
5.2.5 Infrastructure
5.2.6 Other End-user Verticals (Computers and Peripherals)
5.3 Geography
5.3.1 North America
5.3.2 Europe
5.3.3 Asia-Pacific
5.3.4 Rest of the World

6 COMPETITIVE LANDSCAPE
6.1 Company Profiles
6.1.1 General Electric Company
6.1.2 Panasonic Corporation
6.1.3 Samsung Electronics Co. Ltd
6.1.4 Sharp Corporation
6.1.5 Vishay Intertechnology Inc.
6.1.6 Rohm Semiconductor GmbH
6.1.7 TE Connectivity Ltd
6.1.8 KOA Speer Electronics Inc.
6.1.9 AVX Corporation

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS
Note: Product cover images may vary from those shown
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  • General Electric Company
  • Panasonic Corporation
  • Samsung Electronics Co. Ltd
  • Sharp Corporation
  • Vishay Intertechnology Inc.
  • Rohm Semiconductor GmbH
  • TE Connectivity Ltd
  • KOA Speer Electronics Inc.
  • AVX Corporation
Note: Product cover images may vary from those shown
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