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Innovations in Wearables, Heads-up Displays, SoC, VCSEL, E-textiles, Augmented Reality, Micro-LED, 5G Chipsets, and Semiconductor Lasers

  • ID: 4773076
  • Report
  • Region: Global
  • 15 Pages
  • Frost & Sullivan
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This Microelectronics TechVision Opportunity Engine (TOE) profiles developments in profiles developments in wearables, heads-up displays, SoCs, VCSELs, E-textiles, augmented reality, Micro-LEDs, 5G chipsets, and semiconductor lasers. Innovations include reconfigurable hardware platform with integrated SoC and FPGA, Graphene-enabled terahertz photodetector that can absorb a wide range of wavelengths, heads-up wearable display technology that aids metrics tracking for swimmers, wearable personal thermostat that can adjust human body temperature, wafer processing technology for improved VCSEL yield, low cost and high performance smart fabric for body sensing, intelligent AR solution for industrial workforce support, color conversion technology for micro-LED displays, single-crystal aluminum nitride-based filter technology, indium phosphide-based infrared diode lasers, a hardware platform for 5G communication, and a multimode 5G modem for 5G communication networks.

The Microelectronics TechVision Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility, and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).

Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid-state lighting, advanced displays, nanoelectronics, wearable electronics, brain-computer interface, advanced displays, near field communication, and next-generation data storage or memory.

Note: Product cover images may vary from those shown
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Advances in Wearables, Heads-up Displays, SoC, VCSEL, E-textiles, Augmented Reality, Micro-LED, 5G Chipsets, and Semiconductor Lasers

  • Reconfigurable Hardware Platform with Integrated SoC (system-on-chip) and FPGA (field-programmable gate array)
  • Application Diversity and Analyst Viewpoint
  • Graphene-enabled Terahertz Photodetector Can Absorb a Wide Range of Wavelengths
  • Application Diversity and Analyst Viewpoint
  • Heads-up Wearable Display Technology Aids Metrics Tracking for Swimmers
  • Application Diversity and Analyst Viewpoint
  • Wearable Personal Thermostat that can Adjust Human Body Temperature
  • Application Diversity and Analyst Viewpoint
  • Wafer Processing Technology for Improved VCSEL Yield
  • Applications of VCSELs
  • Low Cost and High-Performance Smart Fabric for Body Sensing
  • Applications of Smart Textiles
  • Intelligent AR Solution for Industrial Workforce Support
  • Applications of Augmented Reality Solutions
  • Color Conversion Technology for Micro-LED Displays
  • Applications of E-textiles
  • High Purity Aluminium Nitride-based Micro-filter Technology
  • Impact Across Various Industries and Growth Opportunities
  • Indium Phosphide-based Infrared Diode Lasers
  • Impact Across Various Industries and Growth Opportunities
  • Novel Hardware Platform for 5G Communication
  • Impact Across Various Industries and Growth Opportunities
  • Multimode 5G Modem for 5G Communication Networks
  • Impact Across Various Industries and Growth Opportunities
  • Key Contacts
Note: Product cover images may vary from those shown
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