Global Interposer and Fan-Out WLP Market to Reach $26.5 Billion by 2027
Amid the COVID-19 crisis, the global market for Interposer and Fan-Out WLP estimated at US$6.2 Billion in the year 2020, is projected to reach a revised size of US$26.5 Billion by 2027, growing at a CAGR of 23.1% over the analysis period 2020-2027. Through-Silicon Vias (TSVs), one of the segments analyzed in the report, is projected to record a 24.3% CAGR and reach US$16.1 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the Interposers segment is readjusted to a revised 22.1% CAGR for the next 7-year period.
The U.S. Market is Estimated at $1.7 Billion, While China is Forecast to Grow at 29.1% CAGR
The Interposer and Fan-Out WLP market in the U.S. is estimated at US$1.7 Billion in the year 2020. China, the world's second largest economy, is forecast to reach a projected market size of US$6.5 Billion by the year 2027 trailing a CAGR of 29% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 18% and 21.2% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 19.8% CAGR.
Fan-out Wafer-Level Packaging (FOWLP) Segment to Record 20.2% CAGR
In the global Fan-out Wafer-Level Packaging (FOWLP) segment, USA, Canada, Japan, China and Europe will drive the 19.5% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$771.7 Million in the year 2020 will reach a projected size of US$2.7 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$4 Billion by the year 2027, while Latin America will expand at a 21.5% CAGR through the analysis period.
Select Competitors (Total 45 Featured):
Amid the COVID-19 crisis, the global market for Interposer and Fan-Out WLP estimated at US$6.2 Billion in the year 2020, is projected to reach a revised size of US$26.5 Billion by 2027, growing at a CAGR of 23.1% over the analysis period 2020-2027. Through-Silicon Vias (TSVs), one of the segments analyzed in the report, is projected to record a 24.3% CAGR and reach US$16.1 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the Interposers segment is readjusted to a revised 22.1% CAGR for the next 7-year period.
The U.S. Market is Estimated at $1.7 Billion, While China is Forecast to Grow at 29.1% CAGR
The Interposer and Fan-Out WLP market in the U.S. is estimated at US$1.7 Billion in the year 2020. China, the world's second largest economy, is forecast to reach a projected market size of US$6.5 Billion by the year 2027 trailing a CAGR of 29% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 18% and 21.2% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 19.8% CAGR.
Fan-out Wafer-Level Packaging (FOWLP) Segment to Record 20.2% CAGR
In the global Fan-out Wafer-Level Packaging (FOWLP) segment, USA, Canada, Japan, China and Europe will drive the 19.5% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$771.7 Million in the year 2020 will reach a projected size of US$2.7 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$4 Billion by the year 2027, while Latin America will expand at a 21.5% CAGR through the analysis period.
Select Competitors (Total 45 Featured):
- Amkor Technology, Inc.
- ASE Group
- Broadcom Ltd.
- Infineon Technologies AG
- Intel Corporation
- Jiangsu Changjiang Electronics Technology Co., Ltd.
- Qualcomm, Inc.
- Samsung Electronics Co., Ltd.
- STMicroelectronics NV
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Texas Instruments, Inc.
- Toshiba Corporation
- United Microelectronics Corporation
Note: Product cover images may vary from those shown
I. METHODOLOGY
II. EXECUTIVE SUMMARY
IV. COMPETITION
II. EXECUTIVE SUMMARY
- Influencer Market Insights
- World Market Trajectories
- Impact of Covid-19 and a Looming Global Recession
IV. COMPETITION
- Total Companies Profiled: 45
Note: Product cover images may vary from those shown
