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Interposer and Fan-Out WLP - Market Analysis, Trends, and Forecasts

  • ID: 4805669
  • Report
  • 259 pages
  • Global Industry Analysts, Inc
1 of 3

FEATURED COMPANIES

  • Amkor Technology
  • Ase Group
  • Broadcom
  • Infineon Technologies Ag
  • Intel Corporation
  • Qualcomm
  • MORE
Interposer and Fan-Out WLP market worldwide is projected to grow by US$20.3 Billion, driven by a compounded growth of 26.7%. Through-Silicon Vias (TSVs), one of the segments analyzed and sized in this study, displays the potential to grow at over 27.9%. The shifting dynamics supporting this growth makes it critical for businesses in this space to keep abreast of the changing pulse of the market. Poised to reach over US$15.1 Billion by the year 2025, Through-Silicon Vias (TSVs) will bring in healthy gains adding significant momentum to global growth.

Representing the developed world, the United States will maintain a 24.5% growth momentum. Within Europe, which continues to remain an important element in the world economy, Germany will add over US$860.5 Million to the region's size and clout in the next 5 to 6 years. Over US$900.7 Million worth of projected demand in the region will come from other emerging Eastern European markets. In Japan, Through-Silicon Vias (TSVs) will reach a market size of US$713.3 Million by the close of the analysis period. As the world’s second largest economy and the new game changer in global markets, China exhibits the potential to grow at 31.9% over the next couple of years and add approximately US$4.8 Billion in terms of addressable opportunity for the picking by aspiring businesses and their astute leaders. Presented in visually rich graphics are these and many more need-to-know quantitative data important in ensuring quality of strategy decisions, be it entry into new markets or allocation of resources within a portfolio. Several macroeconomic factors and internal market forces will shape growth and development of demand patterns in emerging countries in Asia-Pacific, Latin America and the Middle East. All research viewpoints presented are based on validated engagements from influencers in the market, whose opinions supersede all other research methodologies.

Competitors identified in this market include the following, among others:
  • Amkor Technology, Inc. (USA)
  • ASE Group (Taiwan)
  • Broadcom Ltd. (Singapore)
  • Infineon Technologies AG (Germany)
  • Intel Corporation (USA)
  • Jiangsu Changjiang Electronics Technology Co., Ltd. (China)
  • Qualcomm, Inc. (USA)
  • Samsung Electronics Co., Ltd. (Korea)
  • STMicroelectronics NV (Switzerland)
  • Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
  • Texas Instruments, Inc. (USA)
  • Toshiba Corporation (Japan)
  • United Microelectronics Corporation (Taiwan)
Note: Product cover images may vary from those shown
2 of 3

FEATURED COMPANIES

  • Amkor Technology
  • Ase Group
  • Broadcom
  • Infineon Technologies Ag
  • Intel Corporation
  • Qualcomm
  • MORE

I. METHODOLOGY

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

Global Competitor Market Shares

Interposer and Fan-Out WLP Competitor Market Share Scenario Worldwide (in %): 2019 & 2025

Global Competitor Market Shares by Segment

Through-Silicon Vias (TSVs) (Packaging Technology) Global Competitor Market Share Positioning for 2019 & 2025

Interposers (Packaging Technology) Market Share Breakdown of Key Players: 2019 & 2025

Fan-out Wafer-Level Packaging (FOWLP) (Packaging Technology) Competitor Revenue Share (in %): 2019 & 2025

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE

TABLE 1: Interposer and Fan-Out WLP Global Market Estimates and Forecasts in US$ Million by Region/Country: 2018-2025

TABLE 2: Interposer and Fan-Out WLP Market Share Shift across Key Geographies Worldwide: 2019 VS 2025

TABLE 3: Consumer Electronics (End-Use) Demand Potential Worldwide in US$ Million by Region/Country: 2018-2025

TABLE 4: Consumer Electronics (End-Use) Share Breakdown Review by Region/Country: 2019 VS 2025

TABLE 5: Telecommunication (End-Use) Worldwide Latent Demand Forecasts in US$ Million by Region/Country: 2018-2025

TABLE 6: Telecommunication (End-Use) Distribution of Global Sales by Region/Country: 2019 VS 2025

TABLE 7: Industrial Sector (End-Use) Sales Estimates and Forecasts in US$ Million by Region/Country for the Years 2018 through 2025

TABLE 8: Industrial Sector (End-Use) Global Market Share Distribution by Region/Country for 2019 and 2025

TABLE 9: Automotive (End-Use) Global Opportunity Assessment in US$ Million by Region/Country: 2018-2025

TABLE 10: Automotive (End-Use) Percentage Share Breakdown of Global Sales by Region/Country: 2019 VS 2025

TABLE 11: Military and Aerospace (End-Use) Worldwide Sales in US$ Million by Region/Country: 2018-2025

TABLE 12: Military and Aerospace (End-Use) Market Share Shift across Key Geographies: 2019 VS 2025

TABLE 13: Other End-Uses (End-Use) Global Market Estimates & Forecasts in US$ Million by Region/Country: 2018-2025

TABLE 14: Other End-Uses (End-Use) Market Share Breakdown by Region/Country: 2019 VS 2025

TABLE 15: Through-Silicon Vias (TSVs) (Packaging Technology) World Market by Region/Country in US$ Million: 2018 to 2025

TABLE 16: Through-Silicon Vias (TSVs) (Packaging Technology) Market Share Breakdown of Worldwide Sales by Region/Country: 2019 VS 2025

TABLE 17: Interposers (Packaging Technology) Potential Growth Markets Worldwide in US$ Million: 2018 to 2025

TABLE 18: Interposers (Packaging Technology) Market Sales Breakdown by Region/Country in Percentage: 2019 VS 2025

TABLE 19: Fan-out Wafer-Level Packaging (FOWLP) (Packaging Technology) Geographic Market Spread Worldwide in US$ Million: 2018 to 2025

TABLE 20: Fan-out Wafer-Level Packaging (FOWLP) (Packaging Technology) Market Share Distribution in Percentage by Region/Country: 2019 VS 2025

III. MARKET ANALYSIS

GEOGRAPHIC MARKET ANALYSIS

UNITED STATES

Market Facts & Figures

US Interposer and Fan-Out WLP Market Share (in %) by Company: 2019 & 2025

Through-Silicon Vias (TSVs) (Packaging Technology) Market Share Analysis (in %) of Leading Players in the US for 2019 & 2025

Interposers (Packaging Technology) Competitor Revenue Share (in %) in the US: 2019 & 2025

Fan-out Wafer-Level Packaging (FOWLP) (Packaging Technology) Market Share Breakdown (in %) of Major Players in the US: 2019 & 2025

TABLE 21: United States Interposer and Fan-Out WLP Latent Demand Forecasts in US$ Million by End-Use: 2018 to 2025

TABLE 22: Interposer and Fan-Out WLP Market Share Breakdown in the United States by End-Use: 2019 VS 2025

TABLE 23: United States Interposer and Fan-Out WLP Market Estimates and Projections in US$ Million by Packaging Technology: 2018 to 2025

TABLE 24: United States Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2019 VS 2025

CANADA

TABLE 25: Canadian Interposer and Fan-Out WLP Market Quantitative Demand Analysis in US$ Million by End-Use: 2018 to 2025

TABLE 26: Canadian Interposer and Fan-Out WLP Market Share Analysis by End-Use: 2019 VS 2025

TABLE 27: Canadian Interposer and Fan-Out WLP Market Estimates and Forecasts in US$ Million by Packaging Technology: 2018 to 2025

TABLE 28: Interposer and Fan-Out WLP Market in Canada: Percentage Share Breakdown of Sales by Packaging Technology for 2019 and 2025

JAPAN

TABLE 29: Japanese Demand Estimates and Forecasts for Interposer and Fan-Out WLP in US$ Million by End-Use: 2018 to 2025

TABLE 30: Interposer and Fan-Out WLP Market Share Shift in Japan by End-Use: 2019 VS 2025

TABLE 31: Japanese Market for Interposer and Fan-Out WLP: Annual Sales Estimates and Projections in US$ Million by Packaging Technology for the period 2018-2025

TABLE 32: Japanese Interposer and Fan-Out WLP Market Share Analysis by Packaging Technology: 2019 VS 2025

CHINA

TABLE 33: Chinese Demand for Interposer and Fan-Out WLP in US$ Million by End-Use: 2018 to 2025

TABLE 34: Chinese Interposer and Fan-Out WLP Market Share Breakdown by End-Use: 2019 VS 2025

TABLE 35: Chinese Interposer and Fan-Out WLP Market Growth Prospects in US$ Million by Packaging Technology for the Period 2018-2025

TABLE 36: Chinese Interposer and Fan-Out WLP Market by Packaging Technology: Percentage Breakdown of Sales for 2019 and 2025

EUROPE

Market Facts & Figures

European Interposer and Fan-Out WLP Market: Competitor Market Share Scenario (in %) for 2019 & 2025

Through-Silicon Vias (TSVs) (Packaging Technology) Market Share (in %) by Company in Europe: 2019 & 2025

Interposers (Packaging Technology) Market Share (in %) of Major Players in Europe: 2019 & 2025

Fan-out Wafer-Level Packaging (FOWLP) (Packaging Technology) Competitor Market Share Analysis (in %) in Europe: 2019 & 2025

TABLE 37: European Interposer and Fan-Out WLP Market Demand Scenario in US$ Million by Region/Country: 2018-2025

TABLE 38: European Interposer and Fan-Out WLP Market Share Shift by Region/Country: 2019 VS 2025

TABLE 39: European Interposer and Fan-Out WLP Addressable Market Opportunity in US$ Million by End-Use: 2018-2025

TABLE 40: European Interposer and Fan-Out WLP Market Share Analysis by End-Use: 2019 VS 2025

TABLE 41: European Interposer and Fan-Out WLP Market Estimates and Forecasts in US$ Million by Packaging Technology: 2018-2025

TABLE 42: European Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2019 VS 2025

FRANCE

TABLE 43: Interposer and Fan-Out WLP Quantitative Demand Analysis in France in US$ Million by End-Use: 2018-2025

TABLE 44: French Interposer and Fan-Out WLP Market Share Analysis: A 7-Year Perspective by End-Use for 2019 and 2025

TABLE 45: Interposer and Fan-Out WLP Market in France by Packaging Technology: Estimates and Projections in US$ Million for the Period 2018-2025

TABLE 46: French Interposer and Fan-Out WLP Market Share Analysis by Packaging Technology: 2019 VS 2025

GERMANY

TABLE 47: Interposer and Fan-Out WLP Market in Germany: Annual Sales Estimates and Forecasts in US$ Million by End-Use for the Period 2018-2025

TABLE 48: Interposer and Fan-Out WLP Market Share Distribution in Germany by End-Use: 2019 VS 2025

TABLE 49: Interposer and Fan-Out WLP Market in Germany: Recent Past, Current and Future Analysis in US$ Million by Packaging Technology for the Period 2018-2025

TABLE 50: German Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2019 VS 2025

ITALY

TABLE 51: Italian Demand for Interposer and Fan-Out WLP in US$ Million by End-Use: 2018 to 2025

TABLE 52: Italian Interposer and Fan-Out WLP Market Share Breakdown by End-Use: 2019 VS 2025

TABLE 53: Italian Interposer and Fan-Out WLP Market Growth Prospects in US$ Million by Packaging Technology for the Period 2018-2025

TABLE 54: Italian Interposer and Fan-Out WLP Market by Packaging Technology: Percentage Breakdown of Sales for 2019 and 2025

UNITED KINGDOM

TABLE 55: United Kingdom Demand Estimates and Forecasts for Interposer and Fan-Out WLP in US$ Million by End-Use: 2018 to 2025

TABLE 56: Interposer and Fan-Out WLP Market Share Shift in the United Kingdom by End-Use: 2019 VS 2025

TABLE 57: United Kingdom Market for Interposer and Fan-Out WLP: Annual Sales Estimates and Projections in US$ Million by Packaging Technology for the period 2018-2025

TABLE 58: United Kingdom Interposer and Fan-Out WLP Market Share Analysis by Packaging Technology: 2019 VS 2025

SPAIN

TABLE 59: Spanish Interposer and Fan-Out WLP Market Quantitative Demand Analysis in US$ Million by End-Use: 2018 to 2025

TABLE 60: Spanish Interposer and Fan-Out WLP Market Share Analysis by End-Use: 2019 VS 2025

TABLE 61: Spanish Interposer and Fan-Out WLP Market Estimates and Forecasts in US$ Million by Packaging Technology: 2018 to 2025

TABLE 62: Interposer and Fan-Out WLP Market in Spain: Percentage Share Breakdown of Sales by Packaging Technology for 2019 and 2025

RUSSIA

TABLE 63: Russian Interposer and Fan-Out WLP Latent Demand Forecasts in US$ Million by End-Use: 2018 to 2025

TABLE 64: Interposer and Fan-Out WLP Market Share Breakdown in Russia by End-Use: 2019 VS 2025

TABLE 65: Russian Interposer and Fan-Out WLP Market Estimates and Projections in US$ Million by Packaging Technology: 2018 to 2025

TABLE 66: Russian Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2019 VS 2025

REST OF EUROPE

TABLE 67: Rest of Europe Interposer and Fan-Out WLP Addressable Market Opportunity in US$ Million by End-Use: 2018-2025

TABLE 68: Rest of Europe Interposer and Fan-Out WLP Market Share Analysis by End-Use: 2019 VS 2025

TABLE 69: Rest of Europe Interposer and Fan-Out WLP Market Estimates and Forecasts in US$ Million by Packaging Technology: 2018-2025

TABLE 70: Rest of Europe Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2019 VS 2025

ASIA-PACIFIC

TABLE 71: Asia-Pacific Interposer and Fan-Out WLP Market Estimates and Forecasts in US$ Million by Region/Country: 2018-2025

TABLE 72: Asia-Pacific Interposer and Fan-Out WLP Market Share Analysis by Region/Country: 2019 VS 2025

TABLE 73: Interposer and Fan-Out WLP Quantitative Demand Analysis in Asia-Pacific in US$ Million by End-Use: 2018-2025

TABLE 74: Asia-Pacific Interposer and Fan-Out WLP Market Share Analysis: A 7-Year Perspective by End-Use for 2019 and 2025

TABLE 75: Interposer and Fan-Out WLP Market in Asia-Pacific by Packaging Technology: Estimates and Projections in US$ Million for the Period 2018-2025

TABLE 76: Asia-Pacific Interposer and Fan-Out WLP Market Share Analysis by Packaging Technology: 2019 VS 2025

AUSTRALIA

TABLE 77: Interposer and Fan-Out WLP Market in Australia: Annual Sales Estimates and Forecasts in US$ Million by End-Use for the Period 2018-2025

TABLE 78: Interposer and Fan-Out WLP Market Share Distribution in Australia by End-Use: 2019 VS 2025

TABLE 79: Interposer and Fan-Out WLP Market in Australia: Recent Past, Current and Future Analysis in US$ Million by Packaging Technology for the Period 2018-2025

TABLE 80: Australian Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2019 VS 2025

INDIA

TABLE 81: Indian Interposer and Fan-Out WLP Market Quantitative Demand Analysis in US$ Million by End-Use: 2018 to 2025

TABLE 82: Indian Interposer and Fan-Out WLP Market Share Analysis by End-Use: 2019 VS 2025

TABLE 83: Indian Interposer and Fan-Out WLP Market Estimates and Forecasts in US$ Million by Packaging Technology: 2018 to 2025

TABLE 84: Interposer and Fan-Out WLP Market in India: Percentage Share Breakdown of Sales by Packaging Technology for 2019 and 2025

SOUTH KOREA

TABLE 85: Interposer and Fan-Out WLP Market in South Korea: Recent Past, Current and Future Analysis in US$ Million by End-Use for the Period 2018-2025

TABLE 86: Interposer and Fan-Out WLP Market Share Distribution in South Korea by End-Use: 2019 VS 2025

TABLE 87: Interposer and Fan-Out WLP Market in South Korea: Recent Past, Current and Future Analysis in US$ Million by Packaging Technology for the Period 2018-2025

TABLE 88: Interposer and Fan-Out WLP Market Share Distribution in South Korea by Packaging Technology: 2019 VS 2025

REST OF ASIA-PACIFIC

TABLE 89: Rest of Asia-Pacific Demand Estimates and Forecasts for Interposer and Fan-Out WLP in US$ Million by End-Use: 2018 to 2025

TABLE 90: Interposer and Fan-Out WLP Market Share Shift in Rest of Asia-Pacific by End-Use: 2019 VS 2025

TABLE 91: Rest of Asia-Pacific Market for Interposer and Fan-Out WLP: Annual Sales Estimates and Projections in US$ Million by Packaging Technology for the period 2018-2025

TABLE 92: Rest of Asia-Pacific Interposer and Fan-Out WLP Market Share Analysis by Packaging Technology: 2019 VS 2025

LATIN AMERICA

TABLE 93: Latin American Interposer and Fan-Out WLP Market Trends by Region/Country in US$ Million: 2018-2025

TABLE 94: Latin American Interposer and Fan-Out WLP Market Percentage Breakdown of Sales by Region/Country: 2019 and 2025

TABLE 95: Latin American Demand for Interposer and Fan-Out WLP in US$ Million by End-Use: 2018 to 2025

TABLE 96: Latin American Interposer and Fan-Out WLP Market Share Breakdown by End-Use: 2019 VS 2025

TABLE 97: Latin American Interposer and Fan-Out WLP Market Growth Prospects in US$ Million by Packaging Technology for the Period 2018-2025

TABLE 98: Latin American Interposer and Fan-Out WLP Market by Packaging Technology: Percentage Breakdown of Sales for 2019 and 2025

ARGENTINA

TABLE 99: Argentinean Interposer and Fan-Out WLP Addressable Market Opportunity in US$ Million by End-Use: 2018-2025

TABLE 100: Argentinean Interposer and Fan-Out WLP Market Share Analysis by End-Use: 2019 VS 2025

TABLE 101: Argentinean Interposer and Fan-Out WLP Market Estimates and Forecasts in US$ Million by Packaging Technology: 2018-2025

TABLE 102: Argentinean Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2019 VS 2025

BRAZIL

TABLE 103: Interposer and Fan-Out WLP Quantitative Demand Analysis in Brazil in US$ Million by End-Use: 2018-2025

TABLE 104: Brazilian Interposer and Fan-Out WLP Market Share Analysis: A 7-Year Perspective by End-Use for 2019 and 2025

TABLE 105: Interposer and Fan-Out WLP Market in Brazil by Packaging Technology: Estimates and Projections in US$ Million for the Period 2018-2025

TABLE 106: Brazilian Interposer and Fan-Out WLP Market Share Analysis by Packaging Technology: 2019 VS 2025

MEXICO

TABLE 107: Interposer and Fan-Out WLP Market in Mexico: Annual Sales Estimates and Forecasts in US$ Million by End-Use for the Period 2018-2025

TABLE 108: Interposer and Fan-Out WLP Market Share Distribution in Mexico by End-Use: 2019 VS 2025

TABLE 109: Interposer and Fan-Out WLP Market in Mexico: Recent Past, Current and Future Analysis in US$ Million by Packaging Technology for the Period 2018-2025

TABLE 110: Mexican Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2019 VS 2025

REST OF LATIN AMERICA

TABLE 111: Rest of Latin America Interposer and Fan-Out WLP Latent Demand Forecasts in US$ Million by End-Use: 2018 to 2025

TABLE 112: Interposer and Fan-Out WLP Market Share Breakdown in Rest of Latin America by End-Use: 2019 VS 2025

TABLE 113: Rest of Latin America Interposer and Fan-Out WLP Market Estimates and Projections in US$ Million by Packaging Technology: 2018 to 2025

TABLE 114: Rest of Latin America Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2019 VS 2025

MIDDLE EAST

TABLE 115: The Middle East Interposer and Fan-Out WLP Market Estimates and Forecasts in US$ Million by Region/Country: 2018-2025

TABLE 116: The Middle East Interposer and Fan-Out WLP Market Share Breakdown by Region/Country: 2019 and 2025

TABLE 117: The Middle East Interposer and Fan-Out WLP Market Quantitative Demand Analysis in US$ Million by End-Use: 2018 to 2025

TABLE 118: The Middle East Interposer and Fan-Out WLP Market Share Analysis by End-Use: 2019 VS 2025

TABLE 119: The Middle East Interposer and Fan-Out WLP Market Estimates and Forecasts in US$ Million by Packaging Technology: 2018 to 2025

TABLE 120: Interposer and Fan-Out WLP Market in the Middle East: Percentage Share Breakdown of Sales by Packaging Technology for 2019 and 2025

IRAN

TABLE 121: Iranian Demand Estimates and Forecasts for Interposer and Fan-Out WLP in US$ Million by End-Use: 2018 to 2025

TABLE 122: Interposer and Fan-Out WLP Market Share Shift in Iran by End-Use: 2019 VS 2025

TABLE 123: Iranian Market for Interposer and Fan-Out WLP: Annual Sales Estimates and Projections in US$ Million by Packaging Technology for the period 2018-2025

TABLE 124: Iranian Interposer and Fan-Out WLP Market Share Analysis by Packaging Technology: 2019 VS 2025

ISRAEL

TABLE 125: Israeli Interposer and Fan-Out WLP Addressable Market Opportunity in US$ Million by End-Use: 2018-2025

TABLE 126: Israeli Interposer and Fan-Out WLP Market Share Analysis by End-Use: 2019 VS 2025

TABLE 127: Israeli Interposer and Fan-Out WLP Market Estimates and Forecasts in US$ Million by Packaging Technology: 2018-2025

TABLE 128: Israeli Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2019 VS 2025

SAUDI ARABIA

TABLE 129: Saudi Arabian Demand for Interposer and Fan-Out WLP in US$ Million by End-Use: 2018 to 2025

TABLE 130: Saudi Arabian Interposer and Fan-Out WLP Market Share Breakdown by End-Use: 2019 VS 2025

TABLE 131: Saudi Arabian Interposer and Fan-Out WLP Market Growth Prospects in US$ Million by Packaging Technology for the Period 2018-2025

TABLE 132: Saudi Arabian Interposer and Fan-Out WLP Market by Packaging Technology: Percentage Breakdown of Sales for 2019 and 2025

UNITED ARAB EMIRATES

TABLE 133: Interposer and Fan-Out WLP Market in the United Arab Emirates: Recent Past, Current and Future Analysis in US$ Million by End-Use for the Period 2018-2025

TABLE 134: Interposer and Fan-Out WLP Market Share Distribution in United Arab Emirates by End-Use: 2019 VS 2025

TABLE 135: Interposer and Fan-Out WLP Market in the United Arab Emirates: Recent Past, Current and Future Analysis in US$ Million by Packaging Technology for the Period 2018-2025

TABLE 136: Interposer and Fan-Out WLP Market Share Distribution in United Arab Emirates by Packaging Technology: 2019 VS 2025

REST OF MIDDLE EAST

TABLE 137: Interposer and Fan-Out WLP Market in Rest of Middle East: Annual Sales Estimates and Forecasts in US$ Million by End-Use for the Period 2018-2025

TABLE 138: Interposer and Fan-Out WLP Market Share Distribution in Rest of Middle East by End-Use: 2019 VS 2025

TABLE 139: Interposer and Fan-Out WLP Market in Rest of Middle East: Recent Past, Current and Future Analysis in US$ Million by Packaging Technology for the Period 2018-2025

TABLE 140: Rest of Middle East Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2019 VS 2025

AFRICA

TABLE 141: African Interposer and Fan-Out WLP Latent Demand Forecasts in US$ Million by End-Use: 2018 to 2025

TABLE 142: Interposer and Fan-Out WLP Market Share Breakdown in Africa by End-Use: 2019 VS 2025

TABLE 143: African Interposer and Fan-Out WLP Market Estimates and Projections in US$ Million by Packaging Technology: 2018 to 2025

TABLE 144: African Interposer and Fan-Out WLP Market Share Breakdown by Packaging Technology: 2019 VS 2025

IV. COMPETITION

ASE GROUP

AMKOR TECHNOLOGY

BROADCOM

INFINEON TECHNOLOGIES AG

INTEL CORPORATION

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY

QUALCOMM

STMICROELECTRONICS NV

SAMSUNG ELECTRONICS CO., LTD.

TAIWAN SEMICONDUCTOR MANUFACTURING

TEXAS INSTRUMENTS

TOSHIBA CORPORATION

UNITED MICROELECTRONICS CORPORATION

V. CURATED RESEARCH

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  • Ase Group
  • Amkor Technology
  • Broadcom
  • Infineon Technologies Ag
  • Intel Corporation
  • Jiangsu Changjiang Electronics Technology
  • Qualcomm
  • Stmicroelectronics Nv
  • Samsung Electronics Co., Ltd.
  • Taiwan Semiconductor Manufacturing
  • Texas Instruments
  • Toshiba Corporation
  • United Microelectronics Corporation
Note: Product cover images may vary from those shown
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