Global Interposer and Fan-Out WLP Market to Reach $108.5 Billion by 2030
The global market for Interposer and Fan-Out WLP estimated at US$21.3 Billion in the year 2022, is projected to reach a revised size of US$108.5 Billion by 2030, growing at a CAGR of 22.5% over the analysis period 2022-2030. Through-Silicon Via, one of the segments analyzed in the report, is projected to record 23.7% CAGR and reach US$67.7 Billion by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the Interposers segment is readjusted to a revised 21.5% CAGR for the next 8-year period.
The U.S. Market is Estimated at $5.6 Billion, While China is Forecast to Grow at 28.5% CAGR
The Interposer and Fan-Out WLP market in the U.S. is estimated at US$5.6 Billion in the year 2022. China, the world's second largest economy, is forecast to reach a projected market size of US$30.1 Billion by the year 2030 trailing a CAGR of 28.5% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 17.1% and 20.3% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 18.9% CAGR.Select Competitors (Total 12 Featured) -
- Amkor Technology, Inc.
- ASE Group
- Broadcom Ltd.
- Infineon Technologies AG
- Intel Corporation
- Jiangsu Changjiang Electronics Technology Co., Ltd.
- Qualcomm, Inc.
- Samsung Electronics Co., Ltd.
- STMicroelectronics NV
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Texas Instruments, Inc.
- Toshiba Corporation
- United Microelectronics Corporation
What's New?
- Special coverage on Russia-Ukraine war; global inflation; easing of zero-Covid policy in China and its `bumpy` reopening; supply chain disruptions, global trade tensions; and risk of recession.
- Global competitiveness and key competitor percentage market shares
- Market presence across multiple geographies - Strong/Active/Niche/Trivial
- Online interactive peer-to-peer collaborative bespoke updates
- Access to digital archives and Research Platform
- Complimentary updates for one year
Table of Contents
I. METHODOLOGYII. EXECUTIVE SUMMARY2. FOCUS ON SELECT PLAYERS3. MARKET TRENDS & DRIVERSIII. MARKET ANALYSISSOUTH KOREAREST OF ASIA-PACIFICARGENTINABRAZILMEXICOREST OF LATIN AMERICAIRANISRAELSAUDI ARABIAUNITED ARAB EMIRATESREST OF MIDDLE EASTIV. COMPETITION
1. MARKET OVERVIEW
- Influencer Market Insights
- World Market Trajectories
- Interposer and Fan-Out WLP - Global Key Competitors Percentage Market Share in 2022 (E)
- Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2022 (E)
- Impact of Covid-19 and a Looming Global Recession
4. GLOBAL MARKET PERSPECTIVE
- Table 1: World Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
- Table 2: World 8-Year Perspective for Interposer and Fan-Out WLP by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2023 & 2030
- Table 3: World Recent Past, Current & Future Analysis for Interposers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
- Table 4: World 8-Year Perspective for Interposers by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2023 & 2030
- Table 5: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
- Table 6: World 8-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2023 & 2030
- Table 7: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
- Table 8: World 8-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2023 & 2030
- Table 9: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
- Table 10: World 8-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2023 & 2030
- Table 11: World Interposer and Fan-Out WLP Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
- Table 12: World Recent Past, Current & Future Analysis for Through-Silicon Via by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
- Table 13: World 8-Year Perspective for Through-Silicon Via by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2023 & 2030
- Table 14: World Recent Past, Current & Future Analysis for Fan-Out Wafer-Level Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
- Table 15: World 8-Year Perspective for Fan-Out Wafer-Level Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2023 & 2030
- Table 16: World Recent Past, Current & Future Analysis for Telecommunications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
- Table 17: World 8-Year Perspective for Telecommunications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2023 & 2030
- Table 18: World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
- Table 19: World 8-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2023 & 2030
- Table 20: World Recent Past, Current & Future Analysis for Military & Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
- Table 21: World 8-Year Perspective for Military & Aerospace by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2023 & 2030
UNITED STATES
- Interposer and Fan-Out WLP Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2023 (E)
- Table 22: USA Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by Packaging Technology - Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 23: USA 8-Year Perspective for Interposer and Fan-Out WLP by Packaging Technology - Percentage Breakdown of Value Sales for Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging for the Years 2023 & 2030
- Table 24: USA Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 25: USA 8-Year Perspective for Interposer and Fan-Out WLP by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2023 & 2030
CANADA
- Table 26: Canada Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by Packaging Technology - Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 27: Canada 8-Year Perspective for Interposer and Fan-Out WLP by Packaging Technology - Percentage Breakdown of Value Sales for Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging for the Years 2023 & 2030
- Table 28: Canada Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 29: Canada 8-Year Perspective for Interposer and Fan-Out WLP by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2023 & 2030
JAPAN
- Interposer and Fan-Out WLP Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2023 (E)
- Table 30: Japan Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by Packaging Technology - Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 31: Japan 8-Year Perspective for Interposer and Fan-Out WLP by Packaging Technology - Percentage Breakdown of Value Sales for Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging for the Years 2023 & 2030
- Table 32: Japan Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 33: Japan 8-Year Perspective for Interposer and Fan-Out WLP by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2023 & 2030
CHINA
- Interposer and Fan-Out WLP Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2023 (E)
- Table 34: China Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by Packaging Technology - Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 35: China 8-Year Perspective for Interposer and Fan-Out WLP by Packaging Technology - Percentage Breakdown of Value Sales for Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging for the Years 2023 & 2030
- Table 36: China Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 37: China 8-Year Perspective for Interposer and Fan-Out WLP by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2023 & 2030
EUROPE
- Interposer and Fan-Out WLP Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2023 (E)
- Table 38: Europe Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
- Table 39: Europe 8-Year Perspective for Interposer and Fan-Out WLP by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2023 & 2030
- Table 40: Europe Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by Packaging Technology - Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 41: Europe 8-Year Perspective for Interposer and Fan-Out WLP by Packaging Technology - Percentage Breakdown of Value Sales for Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging for the Years 2023 & 2030
- Table 42: Europe Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 43: Europe 8-Year Perspective for Interposer and Fan-Out WLP by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2023 & 2030
FRANCE
- Interposer and Fan-Out WLP Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2023 (E)
- Table 44: France Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by Packaging Technology - Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 45: France 8-Year Perspective for Interposer and Fan-Out WLP by Packaging Technology - Percentage Breakdown of Value Sales for Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging for the Years 2023 & 2030
- Table 46: France Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 47: France 8-Year Perspective for Interposer and Fan-Out WLP by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2023 & 2030
GERMANY
- Interposer and Fan-Out WLP Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2023 (E)
- Table 48: Germany Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by Packaging Technology - Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 49: Germany 8-Year Perspective for Interposer and Fan-Out WLP by Packaging Technology - Percentage Breakdown of Value Sales for Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging for the Years 2023 & 2030
- Table 50: Germany Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 51: Germany 8-Year Perspective for Interposer and Fan-Out WLP by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2023 & 2030
ITALY
- Table 52: Italy Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by Packaging Technology - Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 53: Italy 8-Year Perspective for Interposer and Fan-Out WLP by Packaging Technology - Percentage Breakdown of Value Sales for Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging for the Years 2023 & 2030
- Table 54: Italy Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 55: Italy 8-Year Perspective for Interposer and Fan-Out WLP by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2023 & 2030
UNITED KINGDOM
- Interposer and Fan-Out WLP Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2023 (E)
- Table 56: UK Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by Packaging Technology - Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 57: UK 8-Year Perspective for Interposer and Fan-Out WLP by Packaging Technology - Percentage Breakdown of Value Sales for Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging for the Years 2023 & 2030
- Table 58: UK Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 59: UK 8-Year Perspective for Interposer and Fan-Out WLP by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2023 & 2030
SPAIN
- Table 60: Spain Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by Packaging Technology - Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 61: Spain 8-Year Perspective for Interposer and Fan-Out WLP by Packaging Technology - Percentage Breakdown of Value Sales for Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging for the Years 2023 & 2030
- Table 62: Spain Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 63: Spain 8-Year Perspective for Interposer and Fan-Out WLP by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2023 & 2030
RUSSIA
- Table 64: Russia Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by Packaging Technology - Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 65: Russia 8-Year Perspective for Interposer and Fan-Out WLP by Packaging Technology - Percentage Breakdown of Value Sales for Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging for the Years 2023 & 2030
- Table 66: Russia Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 67: Russia 8-Year Perspective for Interposer and Fan-Out WLP by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2023 & 2030
REST OF EUROPE
- Table 68: Rest of Europe Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by Packaging Technology - Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 69: Rest of Europe 8-Year Perspective for Interposer and Fan-Out WLP by Packaging Technology - Percentage Breakdown of Value Sales for Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging for the Years 2023 & 2030
- Table 70: Rest of Europe Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 71: Rest of Europe 8-Year Perspective for Interposer and Fan-Out WLP by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2023 & 2030
ASIA-PACIFIC
- Interposer and Fan-Out WLP Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2023 (E)
- Table 72: Asia-Pacific Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
- Table 73: Asia-Pacific 8-Year Perspective for Interposer and Fan-Out WLP by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2023 & 2030
- Table 74: Asia-Pacific Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by Packaging Technology - Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 75: Asia-Pacific 8-Year Perspective for Interposer and Fan-Out WLP by Packaging Technology - Percentage Breakdown of Value Sales for Through-Silicon Via, Interposers and Fan-Out Wafer-Level Packaging for the Years 2023 & 2030
- Table 76: Asia-Pacific Recent Past, Current & Future Analysis for Interposer and Fan-Out WLP by End-Use - Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
- Table 77: Asia-Pacific 8-Year Perspective for Interposer and Fan-Out WLP by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Industrial, Automotive, Military & Aerospace and Other End-Uses for the Years 2023 & 2030
AUSTRALIA
- Interposer and Fan-Out WLP Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2023 (E)
INDIA
- Interposer and Fan-Out WLP Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2023 (E)
LATIN AMERICA
- Interposer and Fan-Out WLP Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2023 (E)
MIDDLE EAST
- Interposer and Fan-Out WLP Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2023 (E)
AFRICA
- Interposer and Fan-Out WLP Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2023 (E)
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Amkor Technology, Inc.
- ASE Group
- Broadcom Ltd.
- Infineon Technologies AG
- Intel Corporation
- Jiangsu Changjiang Electronics Technology Co., Ltd.
- Qualcomm, Inc.
- Samsung Electronics Co., Ltd.
- STMicroelectronics NV
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Texas Instruments, Inc.
- Toshiba Corporation
- United Microelectronics Corporation
Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 208 |
| Published | April 2024 |
| Forecast Period | 2022 - 2030 |
| Estimated Market Value ( USD | $ 21.3 Billion |
| Forecasted Market Value ( USD | $ 108.5 Billion |
| Compound Annual Growth Rate | 22.6% |
| Regions Covered | Global |
