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Semiconductor and IC Packaging Materials - Global Strategic Business Report

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    Report

  • 452 Pages
  • September 2023
  • Region: Global
  • Global Industry Analysts, Inc
  • ID: 4806016

Quick Summary:

In a rapidly advancing digital world, the global Semiconductor and IC Packaging Materials market stands poised for significant expansion. As these components underpin the foundations of technological innovations, the potency of this sector cannot be overstated. Estimated to grow from US$28.5 Billion in 2022 to a projected $72.8 Billion by 2030, this industry offers a robust opportunity for keen investors looking to capitalize on industrial upswing.

This comprehensive market research report provides critical insights into the terrain of this burgeoning market, interpreting the implications of current trends and future projections. With notable growth in key regions such as the United States and China, the report enables a granular understanding of regional dynamics and potential. In addition, the profiling of leading competitors provides a strategic edge, pivotal for navigating this booming industry. Invest in this report to remain ahead of the curve and capitalize on the accelerated growth of the Semiconductor and IC Packaging Materials market.

Economic Outlook

The global economic outlook is improving, and growth recovery, albeit on the lower side, is expected for this year and the next. The United States although witnessing slowing GDP growth in response to tight monetary and financial conditions, has nevertheless overcome the recession threat. Easing of headline inflation in Euro area is helping boost real incomes and is contributing to pick-up in economic activity. China is expected to see strong increases in GDP in the coming year as the pandemic threat recedes and the government sheds its zero-COVID policy. With optimistic GDP projections, India remains on-course to emerge into a US$6 trillion economy by 2030, surpassing Japan and Germany.

The upturn, however, remains fragile and a number of interlocking challenges continue to run in parallel, such as continued uncertainty around the war in Ukraine; slower than expected decline in global headline inflation; continuation of food and fuel inflation as a persistent economic problem for most developing countries; and still high retail inflation and its impact on consumer confidence and spending. Countries and their governments are showing signs of weathering these challenges, which helps lift market sentiments. As governments continue to combat inflation to get it down to more economically conformable levels by raising interest rates, new job creation will slowdown and impact economic activity. Stricter regulatory environment and pressure to mainstream climate change into economic decisions will compound the complexity of challenges faced.

Although corporate investments can likely be held back by inflation worries and weaker demand, rise of new technologies will reverse partially this prevailing investment sentiment. Rise of generative AI; applied AI; industrializing machine learning; next-generation software development; Web3; cloud and edge computing; quantum technologies; electrification and renewables and climate technologies beyond electrification and renewables, will open up the global investment landscape. The technologies hold the potential to drive sizeable incremental growth and value to global GDP in the coming years. The short-term is expected to be a mixed bag of challenges and opportunities for both consumers and investors alike. There is always opportunity for businesses and their leaders who can chart a path forward with resilience and adaptability.

Global Semiconductor and IC Packaging Materials Market to Reach $72.8 Billion by 2030

The global market for Semiconductor and IC Packaging Materials estimated at US$28.5 Billion in the year 2022, is projected to reach a revised size of US$72.8 Billion by 2030, growing at a CAGR of 12.4% over the analysis period 2022-2030. Organic Substrates, one of the segments analyzed in the report, is projected to record 13.4% CAGR and reach US$22 Billion by the end of the analysis period. Growth in the Bonding Wires segment is estimated at 14.5% CAGR for the next 8-year period.

The U.S. Market is Estimated at $1.9 Billion, While China is Forecast to Grow at 14.5% CAGR

The Semiconductor and IC Packaging Materials market in the U.S. is estimated at US$1.9 Billion in the year 2022. China, the world's second largest economy, is forecast to reach a projected market size of US$17.6 Billion by the year 2030 trailing a CAGR of 14.5% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 10.9% and 6.9% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 9.4% CAGR.

Select Competitors (Total 106 Featured)

  • BASF SE
  • 3M Company
  • Analog Devices, Inc.
  • Amkor Technology, Inc.
  • ams AG
  • Atotech Deutschland GmbH
  • Canatu Oy
  • Adtech Ceramics
  • Carsem (M) Sdn. Bhd.
  • Ceramtec GmbH
  • Chaozhou Three-Circle (Group) Co., Ltd.
  • AMETEK Electronic Components & Packaging
  • Chipbond Technology Corporation
  • California Fine Wire Co.
  • Amtech Microelectronics, Inc.

What`s New?

  • Special discussions on the global economic climate and market sentiment
  • Coverage on global competitiveness and key competitor percentage market shares
  • Market presence analysis across multiple geographies - Strong/Active/Niche/Trivial
  • Online interactive peer-to-peer collaborative bespoke updates
  • Access to digital archives and trademarked research platform
  • Complimentary updates for one year
  • Access to curated YouTube video transcripts of market sentiments shared by CEOs, domain experts and market influencers via interviews, podcasts, press statements and event keynotes

Table of Contents

I. METHODOLOGYII. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
  • Semiconductor ICs & Packaging Materials, Definition, Scope, Importance & Types
  • As “Digitalization of Everything” Creeps Through Every Facet of Modern Life, Semiconductors the Lifeblood of the Whole Concept Becomes the Most Chased After Commodity
  • The Semiconductor Decade is on its Way Guided by the Digitalization Wave: Digital Transformation (DX) Spending of Business Practices, Products & Organization (In US$ Billion) for Years 2021 Through 2025
  • Digital Transformation Across Networking & Communications, Data Processing, Industrial, Consumer Electronics, Automotive, Aerospace, Healthcare, Retail, Media & Entertainment Shapes a Robust Semiconductor Industry Vital to the Continued Evolution of Human Civilization: Global Semiconductor Industry (In US$ Billion) for Years 2022, 2024, 2026, 2028, and 2030
  • What’s Ahead for Businesses & Markets?
  • Shaken by the War, Global Oil Prices Spiral & Feed Inflationary Pressures: Global Average Annual Brent Crude Oil Price (In US$ Per Barrel) for Years 2017 through 2022
  • War-Induced Commodity Price Increases & Broad Based Price Pressures Mark the Return of Global Inflation in 2022: Global Inflation Rates (In %) for the Years 2019 Through 2022
  • After the Pandemic, Global Economic Uncertainty Surges Amidst War, Inflation, Political Tensions & Supply Chain Disruptions Aggravated by China’s Slowdown: World Economic Growth Projections (Real GDP, Annual % Change) for the Years 2020, 2021, 2022 and 2023
  • Competition
  • Semiconductor and IC Packaging Materials - Global Key Competitors Percentage Market Share in 2021 (E)
  • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2021 (E)
  • Semiconductor ICs & Packaging Materials: Introduction, Types, Market Structure
  • World Brands
  • Recent Market Activity
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
  • As Global Chip Shortage Continues Into the Year 2022, It is Time to Review the Implications for Semiconductor Materials & Consumables
  • Rising Semiconductor Demand, Favorable Regulations & Robust Demand for Advanced Packaging Drives Growth of Packaging Materials
  • Roust Outlook for Semiconductor Advanced Packaging Technologies to Brighten Opportunities in the Upstream Packaging Materials Market: Global Semiconductor Advanced Packaging Market by Technology (In US$ Million) for Years 2022, 2024, and 2026
  • Emergence of Quantum Computing Drives the Importance of Semiconductors From Design to Materials
  • As Quantum Hardware Emerges Into an Active Area of Research, New Opportunities to Open for All in the Semiconductor Value Chain: Global Market for Quantum Computing (In US$ Million) for Years 2022, 2024, 2026 & 2028
  • Growing Demand for New Generation Smart ICs for Emerging Technologies like AI Bodes Well for Market Growth
  • Growing Focus on AI Chip Development & Production Opens a Parallel Growth Avenue for Chip Packaging Materials: Global Market for AI Chips (In US$ Billion) for Years 2022, 2024, 2026, 2028 and 2030
  • Vehicle Electronification & Autonomous Driving to Bring the Automotive Industry Into the Spotlight as One of the Fastest Growing End-Uses Sector
  • The Exciting Journey Towards Autonomous Driving is Littered with Opportunities for Automotive Semiconductors: Global Autonomous Vehicle Sales (In Units) for Years 2022, 2024 & 2026
  • 3D Packaging Emerges As a Key Driver of Growth & Innovation in the Market
  • Development New Packaging Technologies Bodes Well for Market Growth
  • IoT Ecosystem to Rev Up Opportunities for Semiconductor Advanced Packaging Technologies & Materials
  • Growing Ecosystem of IoT Devices Bodes Well for IoT Hardware Including ICs/Chips & Modules: Global Number of IoT Connected Devices (In Billion) for Years 2015, 2017, 2019, 2021, 2023, and 2025
  • Connected Aircraft to Drive the Aerospace End-Use Industry’s Appetite for Semiconductor Chips & Packaging Materials
  • Robust Outlook for the Future of Connected Aviation to Open Up Opportunities to New Generation Semiconductor Solutions: Global Number of Connected Aircraft (In Units) for the Years 2021, 2025 & 2029
  • A Quick Review of Key Market Challenges
4. GLOBAL MARKET PERSPECTIVE
  • TABLE 1: World Semiconductor and IC Packaging Materials Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
  • TABLE 2: World Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • TABLE 3: World Historic Review for Semiconductor and IC Packaging Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • TABLE 4: World 16-Year Perspective for Semiconductor and IC Packaging Materials by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2014, 2023 & 2030
  • TABLE 5: World Recent Past, Current & Future Analysis for Organic Substrates by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • TABLE 6: World Historic Review for Organic Substrates by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • TABLE 7: World 16-Year Perspective for Organic Substrates by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • TABLE 8: World Recent Past, Current & Future Analysis for Bonding Wires by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • TABLE 9: World Historic Review for Bonding Wires by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • TABLE 10: World 16-Year Perspective for Bonding Wires by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • TABLE 11: World Recent Past, Current & Future Analysis for Lead frames by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • TABLE 12: World Historic Review for Lead frames by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • TABLE 13: World 16-Year Perspective for Lead frames by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • TABLE 14: World Recent Past, Current & Future Analysis for Ceramic Packages by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • TABLE 15: World Historic Review for Ceramic Packages by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • TABLE 16: World 16-Year Perspective for Ceramic Packages by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • TABLE 17: World Recent Past, Current & Future Analysis for Encapsulation Resins by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • TABLE 18: World Historic Review for Encapsulation Resins by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • TABLE 19: World 16-Year Perspective for Encapsulation Resins by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • TABLE 20: World Recent Past, Current & Future Analysis for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • TABLE 21: World Historic Review for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • TABLE 22: World 16-Year Perspective for Other Types by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • TABLE 23: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • TABLE 24: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • TABLE 25: World 16-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • TABLE 26: World Recent Past, Current & Future Analysis for Communications & Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • TABLE 27: World Historic Review for Communications & Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • TABLE 28: World 16-Year Perspective for Communications & Telecom by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • TABLE 29: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • TABLE 30: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • TABLE 31: World 16-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • TABLE 32: World Recent Past, Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • TABLE 33: World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • TABLE 34: World 16-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • TABLE 35: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • TABLE 36: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • TABLE 37: World 16-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
III. MARKET ANALYSIS
  • UNITED STATES
  • Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2023 (E)
  • CANADA
  • JAPAN
  • CHINA
  • EUROPE
  • Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2023 (E)
  • FRANCE
  • GERMANY
  • ITALY
  • UNITED KINGDOM
  • REST OF EUROPE
  • ASIA-PACIFIC
  • Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2023 (E)
  • SOUTH KOREA
  • TAIWAN
  • REST OF ASIA-PACIFIC
  • REST OF WORLD
IV. COMPETITION

Companies Mentioned

A selection of companies mentioned in this report includes:

  • Amkor Technology, Inc.
  • BASF SE
  • DuPont de Nemours, Inc.
  • eChem Solutions Corp.
  • Henkel AG & Co. KGaA
  • Honeywell International Inc.
  • Kyocera Chemical Co. Ltd.
  • LG Chemical Ltd.
  • Mitsui High-Tec., Inc.
  • Showa Denko Materials Co., Ltd.
  • Sumitomo Bakelite Co., Ltd.
  • Tanaka Holdings Co., Ltd.
  • Toppan Printing Co., Ltd.
  • Toray Industries Inc.