Quick Summary:
In a rapidly advancing digital world, the global Semiconductor and IC Packaging Materials market stands poised for significant expansion. As these components underpin the foundations of technological innovations, the potency of this sector cannot be overstated. Estimated to grow from US$28.5 Billion in 2022 to a projected $72.8 Billion by 2030, this industry offers a robust opportunity for keen investors looking to capitalize on industrial upswing.
This comprehensive market research report provides critical insights into the terrain of this burgeoning market, interpreting the implications of current trends and future projections. With notable growth in key regions such as the United States and China, the report enables a granular understanding of regional dynamics and potential. In addition, the profiling of leading competitors provides a strategic edge, pivotal for navigating this booming industry. Invest in this report to remain ahead of the curve and capitalize on the accelerated growth of the Semiconductor and IC Packaging Materials market.
Economic Outlook
The global economic outlook is improving, and growth recovery, albeit on the lower side, is expected for this year and the next. The United States although witnessing slowing GDP growth in response to tight monetary and financial conditions, has nevertheless overcome the recession threat. Easing of headline inflation in Euro area is helping boost real incomes and is contributing to pick-up in economic activity. China is expected to see strong increases in GDP in the coming year as the pandemic threat recedes and the government sheds its zero-COVID policy. With optimistic GDP projections, India remains on-course to emerge into a US$6 trillion economy by 2030, surpassing Japan and Germany.The upturn, however, remains fragile and a number of interlocking challenges continue to run in parallel, such as continued uncertainty around the war in Ukraine; slower than expected decline in global headline inflation; continuation of food and fuel inflation as a persistent economic problem for most developing countries; and still high retail inflation and its impact on consumer confidence and spending. Countries and their governments are showing signs of weathering these challenges, which helps lift market sentiments. As governments continue to combat inflation to get it down to more economically conformable levels by raising interest rates, new job creation will slowdown and impact economic activity. Stricter regulatory environment and pressure to mainstream climate change into economic decisions will compound the complexity of challenges faced.
Although corporate investments can likely be held back by inflation worries and weaker demand, rise of new technologies will reverse partially this prevailing investment sentiment. Rise of generative AI; applied AI; industrializing machine learning; next-generation software development; Web3; cloud and edge computing; quantum technologies; electrification and renewables and climate technologies beyond electrification and renewables, will open up the global investment landscape. The technologies hold the potential to drive sizeable incremental growth and value to global GDP in the coming years. The short-term is expected to be a mixed bag of challenges and opportunities for both consumers and investors alike. There is always opportunity for businesses and their leaders who can chart a path forward with resilience and adaptability.
Global Semiconductor and IC Packaging Materials Market to Reach $72.8 Billion by 2030
The global market for Semiconductor and IC Packaging Materials estimated at US$28.5 Billion in the year 2022, is projected to reach a revised size of US$72.8 Billion by 2030, growing at a CAGR of 12.4% over the analysis period 2022-2030. Organic Substrates, one of the segments analyzed in the report, is projected to record 13.4% CAGR and reach US$22 Billion by the end of the analysis period. Growth in the Bonding Wires segment is estimated at 14.5% CAGR for the next 8-year period.The U.S. Market is Estimated at $1.9 Billion, While China is Forecast to Grow at 14.5% CAGR
The Semiconductor and IC Packaging Materials market in the U.S. is estimated at US$1.9 Billion in the year 2022. China, the world's second largest economy, is forecast to reach a projected market size of US$17.6 Billion by the year 2030 trailing a CAGR of 14.5% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 10.9% and 6.9% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 9.4% CAGR.Select Competitors (Total 106 Featured)
- BASF SE
- 3M Company
- Analog Devices, Inc.
- Amkor Technology, Inc.
- ams AG
- Atotech Deutschland GmbH
- Canatu Oy
- Adtech Ceramics
- Carsem (M) Sdn. Bhd.
- Ceramtec GmbH
- Chaozhou Three-Circle (Group) Co., Ltd.
- AMETEK Electronic Components & Packaging
- Chipbond Technology Corporation
- California Fine Wire Co.
- Amtech Microelectronics, Inc.
What`s New?
- Special discussions on the global economic climate and market sentiment
- Coverage on global competitiveness and key competitor percentage market shares
- Market presence analysis across multiple geographies - Strong/Active/Niche/Trivial
- Online interactive peer-to-peer collaborative bespoke updates
- Access to digital archives and trademarked research platform
- Complimentary updates for one year
- Access to curated YouTube video transcripts of market sentiments shared by CEOs, domain experts and market influencers via interviews, podcasts, press statements and event keynotes
Table of Contents
Companies Mentioned
A selection of companies mentioned in this report includes:
- Amkor Technology, Inc.
- BASF SE
- DuPont de Nemours, Inc.
- eChem Solutions Corp.
- Henkel AG & Co. KGaA
- Honeywell International Inc.
- Kyocera Chemical Co. Ltd.
- LG Chemical Ltd.
- Mitsui High-Tec., Inc.
- Showa Denko Materials Co., Ltd.
- Sumitomo Bakelite Co., Ltd.
- Tanaka Holdings Co., Ltd.
- Toppan Printing Co., Ltd.
- Toray Industries Inc.