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Results for tag: "IC Packaging"

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Underfill Dispensers - Global Strategic Business Report - Product Thumbnail Image

Underfill Dispensers - Global Strategic Business Report

  • Report
  • April 2024
  • 304 Pages
  • Global
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3D Semiconductor Packaging - Global Strategic Business Report - Product Thumbnail Image

3D Semiconductor Packaging - Global Strategic Business Report

  • Report
  • April 2024
  • 293 Pages
  • Global
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3D IC and 2.5D IC Packaging Global Market Report 2024 - Product Thumbnail Image

3D IC and 2.5D IC Packaging Global Market Report 2024

  • Report
  • February 2024
  • 175 Pages
  • Global
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The IC Packaging market is a segment of the semiconductor industry that involves the design, manufacture, and sale of integrated circuit (IC) packages. IC packages are used to protect and connect ICs to other components in a system. They are also used to provide electrical and thermal performance, as well as to reduce the size of the system. The IC Packaging market is driven by the increasing demand for miniaturization and higher performance of electronic devices. The market is also driven by the increasing demand for consumer electronics, such as smartphones, tablets, and laptops. The IC Packaging market is highly competitive, with a number of companies offering a wide range of products. Some of the major players in the market include Amkor Technology, ASE Technology, STATS ChipPAC, and Jiangsu Changjiang Electronics Technology. Other prominent players include Advanced Semiconductor Engineering, Kinsus Interconnect Technology, and Siliconware Precision Industries. Show Less Read more