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Global Power Management IC Packaging Market - Premium Insight, Competitive News Feed Analysis, Company Usability Profiles, Market Sizing & Forecasts to 2025

  • ID: 4807799
  • Report
  • June 2019
  • Region: Global
  • 104 pages
  • 360iResearch
UP TO OFF
until May 31st 2020
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FEATURED COMPANIES

  • 3D Plus, Inc.
  • ABLIC Inc.
  • Dialog Semiconductor
  • HANA Micron Inc.
  • Microchip Technology Inc
  • NXP Semiconductors N.V.
  • MORE
The Global Power Management IC Packaging Market is expected to grow from USD 39,821.57 Million in 2018 to USD 54,902.66 Million by the end of 2025 at a Compound Annual Growth Rate (CAGR) of 4.69%.

The positioning of the Global Power Management IC Packaging Market vendors in the FPNV Positioning Matrix are determined by Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) and placed into four quadrants (F: Forefront, P: Pathfinders, N: Niche, and V: Vital).

The report explores the recent significant developments by the leading vendors and innovation profiles in the Global Power Management IC Packaging Market including are NXP Semiconductors N.V., Semtech Corporation, Shenzhen Electronics Group Co., Ltd., Texas Instruments Incorporated, Wuxi China Resources Microelectronics Co. Ltd., 3D Plus, Inc., ABLIC Inc., Analog Devices / Linear Technology, Dialog Semiconductor, Good-Ark Semiconductor USA Corp., HANA Micron Inc., Jilin Sino-Microelectronics Co., Ltd., Maxim Integrated Products Inc, Microchip Technology Inc, ON Semiconductor Corporation, and Toshiba Corporation.

On the basis of Type, the Global Power Management IC Packaging Market is examined across BGA, HSOP32, HVNON10, HVQFN, QFN, and WLCSP.

On the basis of Solution, the Global Power Management IC Packaging Market is examined across Configurable PMICs, DC-to-DC Solutions, Linear Voltage Regulators, PMICs for Networking, PMICs for i.MX Application Processors, and Switching Regulators.

On the basis of Application, the Global Power Management IC Packaging Market is examined across Automotive Infotainment & Telematic Devices, Digital Cameras, Digital TV Processor, Fitness Trackers & Wearable Devices, Portable Industrial & Medical Devices, Portable Media Players & Readers, Smartphones, and Tablets & PCs.

For the detailed coverage of the study, the market has been geographically divided into the Americas, Asia-Pacific, and Europe, Middle East & Africa. The report provides details of qualitative and quantitative insights about the major countries in the region and taps the major regional developments in detail.

In the report, we have covered two proprietary models, the FPNV Positioning Matrix and Competitive Strategic Window. The FPNV Positioning Matrix analyses the competitive market place for the players in terms of product satisfaction and business strategy they adopt to sustain in the market. The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies. The Competitive Strategic Window helps the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. During a forecast period, it defines the optimal or favorable fit for the vendors to adopt successive merger and acquisitions strategies, geography expansion, research & development, new product introduction strategies to execute further business expansion and growth.

Research Methodology:

The market forecasting is based on a market model derived from market connectivity, dynamics, and identified influential factors around which assumptions about the market are made. These assumptions are enlightened by fact-bases, put by primary and secondary research instruments, regressive analysis and an extensive connect with industry people. Market forecasting derived from in-depth understanding attained from future market spending patterns provides quantified insight to support your decision-making process. The interview is recorded, and the information gathered in put on the drawing board with the information collected through secondary research.

The report provides insights on the following pointers:

1. Market Penetration: Provides comprehensive information on sulfuric acid offered by the key players in the Global Power Management IC Packaging Market
2. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and new product developments in the Global Power Management IC Packaging Market
3. Market Development: Provides in-depth information about lucrative emerging markets and analyzes the markets for the Global Power Management IC Packaging Market
4. Market Diversification: Provides detailed information about new products launches, untapped geographies, recent developments, and investments in the Global Power Management IC Packaging Market
5. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, and manufacturing capabilities of the leading players in the Global Power Management IC Packaging Market

The report answers questions such as:

1. What is the market size of the Power Management IC Packaging market?
2. What are the factors that affect the growth in the Global Power Management IC Packaging Market over the forecast period?
3. What is the competitive position in the Global Power Management IC Packaging Market?
4. Which are the best product areas to be invested in over the forecast period in the Global Power Management IC Packaging Market?
5. What are the opportunities in the Global Power Management IC Packaging Market?
6. What are the modes of entering the Global Power Management IC Packaging Market?
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • 3D Plus, Inc.
  • ABLIC Inc.
  • Dialog Semiconductor
  • HANA Micron Inc.
  • Microchip Technology Inc
  • NXP Semiconductors N.V.
  • MORE
1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Stakeholders

2. Research & Forecasting
2.1. Research Methodology
2.1.1. Research Process
2.1.2. Research Framework
2.1.3. Research Reliability & Validity
2.1.4. Research Assumptions
2.2. Forecasting Methodology
2.3. Research Outcome
2.3.1. Competitive Strategic Window
2.3.1.1. Leverage Zone
2.3.1.2. Vantage Zone
2.3.1.3. Speculative Zone
2.3.1.4. Bottleneck Zone
2.3.2. FPNV Positioning Matrix
2.3.2.1. Quadrants
2.3.2.1.1. Forefront
2.3.2.1.2. Pathfinders
2.3.2.1.3. Niche
2.3.2.1.4. Vital
2.3.2.2. Business Strategy
2.3.2.2.1. Business Growth
2.3.2.2.2. Industry Coverage
2.3.2.2.3. Financial Viability
2.3.2.2.4. Channel Support
2.3.2.3. Product Satisfaction
2.3.2.3.1. Value for Money
2.3.2.3.2. Ease of Use
2.3.2.3.3. Product Features
2.3.2.3.4. Customer Support

3. Executive Summary
3.1. Outlook in the Power Management IC Packaging Market
3.1.1. Incumbent vendors of power-management ICs can focus to improve efficiency and integration or lose market share to innovators
3.1.2. Battery-powered devices booming the adoption
3.2. Opportunities in the Power Management IC Packaging Market

4. Premium Insight
4.1. Market Connectivity
4.2. Market Dynamics
4.2.1. Drivers
4.2.1.1. Increasing demand of smart and wearbvle devices
4.2.1.2. Growing trend of minimization of device size and the integration of various components into a single device
4.2.1.3. Need for chip-embedded flexible packaging technology to ensure small size, rapid, and reliable devices
4.2.2. Restraints
4.2.2.1. Complex integration and packaging for multi-power domain SoCs of PMICs
4.2.3. Opportunities
4.2.3.1. 2.5DIC and 3.0DIC technologies evolving.
4.2.3.2. Investment in 3D packaging process design of next-generation smart devices
4.2.4. Challenges
4.2.4.1. limited investment in the unification of packaging standards
4.3. Porter's Five Forces Analysis
4.3.1. Threat of New Entrants
4.3.2. Threat of Substitutes
4.3.3. Bargaining Power of Customers
4.3.4. Bargaining Power of Suppliers
4.3.5. Industry Rivalry
4.4. Industry Trends
4.4.1. Evolution of integrated-circuit packaging since 1970
4.4.2. Value Chain Analaysis

5. Global Power Management IC Packaging Market, by Type
5.1. Overview
5.2. Market Sizing & Forecasting
5.3. BGA
5.4. HSOP32
5.5. HVNON10
5.6. HVQFN
5.7. QFN
5.8. WLCSP

6. Global Power Management IC Packaging Market, by Solution
6.1. Overview
6.2. Market Sizing & Forecasting
6.3. Configurable PMICs
6.4. DC-to-DC Solutions
6.5. Linear Voltage Regulators
6.6. PMICs for Networking
6.7. PMICs for i.MX Application Processors
6.8. Switching Regulators

7. Global Power Management IC Packaging Market, by Application
7.1. Overview
7.2. Market Sizing & Forecasting
7.3. Automotive Infotainment & Telematic Devices
7.4. Digital Cameras
7.5. Digital TV Processor
7.6. Fitness Trackers & Wearable Devices
7.7. Portable Industrial & Medical Devices
7.8. Portable Media Players & Readers
7.9. Smartphones
7.10. Tablets & PCs

8. Global Power Management IC Packaging Market, by Geography
8.1. Overview
8.2. Market Sizing & Forecasting
8.3. Americas
8.3.1. Overview
8.3.2. Market Sizing & Forecasting
8.3.3. Argentina
8.3.4. Brazil
8.3.5. Canada
8.3.6. Mexico
8.3.7. United States
8.4. Asia-Pacific
8.4.1. Overview
8.4.2. Market Sizing & Forecasting
8.4.3. Australia
8.4.4. China
8.4.5. India
8.4.6. Japan
8.5. Europe, Middle East & Africa
8.5.1. Overview
8.5.2. Market Sizing & Forecasting
8.5.3. France
8.5.4. Germany
8.5.5. Italy
8.5.6. Spain
8.5.7. United Kingdom

9. Competitive Landscape
9.1. FPNV Positioning Matrix for Global Power Management IC Packaging Market
9.2. Market Vendor Ranking Analysis for Global Power Management IC Packaging Market
9.3. Competitive News Feed Analysis for Global Power Management IC Packaging Market

10. Company Usability Profiles
10.1. NXP Semiconductors N.V.
10.1.1. Overview
10.1.2. Strategy
10.1.3. SWOT
10.2. Semtech Corporation
10.2.1. Overview
10.2.2. Strategy
10.2.3. SWOT
10.3. Shenzhen Electronics Group Co., Ltd.
10.3.1. Overview
10.3.2. Strategy
10.3.3. SWOT
10.4. Texas Instruments Incorporated
10.4.1. Overview
10.4.2. Strategy
10.4.3. SWOT
10.5. Wuxi China Resources Microelectronics Co. Ltd.
10.5.1. Overview
10.5.2. Strategy
10.5.3. SWOT
10.6. 3D Plus, Inc.
10.7. ABLIC Inc.
10.8. Analog Devices / Linear Technology
10.9. Dialog Semiconductor
10.10. Good-Ark Semiconductor USA Corp.
10.11. HANA Micron Inc.
10.12. Jilin Sino-Microelectronics Co., Ltd.
10.13. Maxim Integrated Products Inc
10.14. Microchip Technology Inc
10.15. ON Semiconductor Corporation
10.16. Toshiba Corporation

11. Appendix
11.1. Discussion Guide
11.2. Top Reports
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11.2.3. Global Payment Gateway Market - Premium Insight, Competitive News Feed Analysis, Company Usability Profiles, Market Sizing & Forecasts to 2025
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11.2.5. Global Varicose Vein Treatment Devices Market - Premium Insight, Competitive News Feed Analysis, Company Usability Profiles, Market Sizing & Forecasts to 2025
11.3. Author Details
Note: Product cover images may vary from those shown
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  • NXP Semiconductors N.V.
  • Semtech Corporation
  • Shenzhen Electronics Group Co., Ltd.
  • Texas Instruments Incorporated
  • Wuxi China Resources Microelectronics Co. Ltd.
  • 3D Plus, Inc.
  • ABLIC Inc.
  • Analog Devices / Linear Technology
  • Dialog Semiconductor
  • Good-Ark Semiconductor USA Corp.
  • HANA Micron Inc.
  • Jilin Sino-Microelectronics Co., Ltd.
  • Maxim Integrated Products Inc
  • Microchip Technology Inc
  • ON Semiconductor Corporation
  • Toshiba Corporation
Note: Product cover images may vary from those shown
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