Critical Materials Report-Sputter Targets

3.1 Current Market Outlook
3.2 Electronics/Semiconductor Ecosystem
3.3 Global GDP Outlook
3.4 Electronic Systems
3.5 Semiconductor Industry Outlook
3.6 Capital Spending Outlook
3.7 200mm Fab Capacity Outlook
3.8 China Semiconductor Market
3.9 Wafer Start Forecast
3.10 Overview Summary

4.1 2018 Supplier Market Share
4.2 Target Production
4.3 China Perspective
4.4 Competitive Environment
4.5 Trade & Tariffs

5.1 Copper
5.2 Tantalum
5.3 Aluminum
5.4 Titanium
4.5 Tungsten
5.6 Cobalt
5.7 Precious Metals
5.8 Rare Earth Metals
5.9 Minor Metals- Scandium

6.1 Copper
6.2. Tantalum
6.3 Aluminum
6.4 Titanium
6.5 Tungsten
6.6 Other
6.7 Total Targets
6.8 Precious Metals

7.1 Wafer Size
7.2 Metallization Trends
7.3 Barrier Layers
7.4 Other Materials
7.5 PVD in Packaging

9.1 Furuya Metals
9.2 GO Element
9.3 Grikin
9.4 Honeywell
9.5 KFMI
9.6 JX Nippon
9.7 Materion
9.8 Pioneer Materials
9.9 Praxair
9.10 Sumitomo
9.11 Tanaka
9.12 Tosoh SMD
9.13 Umicore
9.14 VEM
9.15 Vital Materials

A Key Cost Components
A.1 Key Cost Drivers
A.2 Key Cost Drivers Copper Targets
A.3 Key Cost Drivers Tantalum Targets
A.4 Key Cost Drivers Aluminum Targets
A.5 Key Cost Drivers Titanium Targets
A.6 Key Cost Drivers Tungsten Targets
B Tantalum Smelters
C Tungsten Smelters
D Cobalt Smelters
E Regulatory Update (history)

Figure 1.1 Sputtering Target Total Revenue
Figure 3.1 Monthly WSTS Trends
Figure 3.2 Global Purchasing Managers Index
Figure 3.3: Global Electronics Supply Chain
Figure 3.4: Global Electronics Systems
Figure 3.5: Automotive Semiconductor Market
Figure 3.6: 2019 Semiconductor Market Growth
Figure 3.7: Semiconductor Unit Growth
Figure 3.8: 200mm Fab Capacity
Figure 3.9: China IC Production/Consumption
Figure 3.10: Wafer Start Forecast
Figure 4.1: 2018 Target Supplier Market Share
Figure 4.2: 2018 Target Unit Volume Production
Figure 5.1: 2018 Cu Mine Production
Figure 5.2: Global Refined Cu Production
Figure 5.3: LME Cu Price Chart
Figure 5.4: Cu Process Summary
Figure 5.5: 2018 Ta Mine Production
Figure 5.6: 2017 Ta Product Demand
Figure 5.7: Ta Process Summary
Figure 5.8: 2018 Al Smelting Production
Figure 5.9: 2017 Semi-Finished Al Demand
Figure 5.10: LME Al Price Chart
Figure 5.11: Al Process Summary
Figure 5.12: 2018 Global Ti Sponge Capacity
Figure 5.13: 2017 Ti Mill Product Output
Figure 5.14: Ti Process Summary
Figure 5.15: 2018 W Mine Production
Figure 5.16: 2016 W Demand
Figure 5.17: APT Price Chart
Figure 5.18: W Process Summary
Figure 5.19: 2018 Co Mine Production
Figure 5.20 International Cobalt’s NA Mines
Figure 5.21 : 2017 Co Demand
Figure 5.22: LME Co Price Chart
Figure 5.23 Precious Metals Price Chart
Figure 5.24: Ru Metal Fix Price
Figure 6.1: Cu Price Trends
Figure 6.2: Cu Target Revenue Forecast
Figure 6.3 Ta Price Trends
Figure 6.4: Ta Target Revenue Forecast
Figure 6.5 Al Price Trends
Figure 6.6: Al Target Revenue Forecast
Figure 6.7: Ti Price Trends
Figure 6.8: Ti Target Revenue Forecast
Figure 6.9: W Price Trend
Figure 6.10: W Target Revenue Forecast
Figure 6.11 Other Target Mat’ls Revenue Forecast
Figure 6.12 Total Sputtering Target Forecast
Figure 6.13 Total Sputtering Target by Mat’l Share
Figure 6.14 Precious Metal Target Forecast
Figure 7.1: MOL & BEOL Roadmap
Figure 7.2: AMAT Co Metallization Technology
Figure 7.3 Why Cobalt
Figure 7.4: 5nm BEOL Approaches
Figure 7.5: Barrier l Thickness Limits
Figure 7.6: AlSc Phase Diagram
Figure 7.7: ASE FO Chip on Substrate Process
Figure 7.8: FO Panel