Worldwide OSAT (Outsourced Semiconductor Assembly and Test) companies who perform IC packaging and testing services registered significant shipment value growth in 2018, thanks to a continued increase in memory production and an advanced inventory replenishment in anticipation of potential tariff increases from the US-China trade war. Worldwide IC packaging and testing industry shipment value in 2018 totaled US$29.462 billion in 2018, up by 7.69% compared to 2017. This report reviews the performance of the worldwide IC packaging and testing industry in 2018 and analyzes its development in 2019 and beyond.
List of Topics
- Development of the global IC packaging and testing industry and includes shipment value and year-on-year growth rate for the period 2016-2019
- Analysis of leading OSAT (Outsourced Semiconductor Assembly and Test) companies, including Amkor, JCET, Tianshui Huatain Technology, Tongfu Microelectronics
Table of Contents
1. Worldwide Industry Shipment Value
1.1 Steady Growth in 2018
1.1.1 OSAT Companies Market Share Struck by Trade War
1.1.2 Worldwide OSAT Market Slows Down in 2019 with Shipment Value Similar to 2018
1.2 Taiwan Ranked No.1 in 2018 IC Packaging and Testing Shipment Value, Followed by China
1.2.1 Top Six OSAT Companies’ Spots Remain Unchanged While Gap between Top Three Narrowing
1.2.2 Taiwanese IC packaging and testing industry Posts Higher-than-Global-Average Growth at 8.4% in 2018
2. Development of Leading International OSAT Companies
2.1 Amkor Remain Steady Growth with Continued Focus on Automotive Electronics
2.2 JCET's M&A Continues to Deliver Synergy, Boosting High-end Packaging Share
2.3 Tianshui Huatian Technology Did Not Live Up to Expectation in 2018
2.4 Tongfu Microelectronics Maintains High Growth Fueled by International Customers
3. Development of Leading Taiwanese OSAT Companies
3.1 ASE Benefits from M&A Synergy with Focus on SiP Technology
3.1.1 ASE Aggressively Develops SiP to Help Customers Reduce Costs
3.2 PTI Strives for Product Diversification by Expanding Non-Memory Business
3.3 CoF Packaging Becomes Mainstream, Driving up Chipbond and Chipmos Revenues
4. Perspective
Appendix
Glossary of Terms
List of Companies
List of Tables
Table 1 M&A of Leading OSAT Companies over Past Five Years
Table 2 ASE Revenues by Business Types
Table 3 Milestones of ASE-SPIL Merger
Table 4 PTI Revenue by Business Type
List of Figures
Figure 1 Worldwide IC Packaging and Testing Industry Shipment Value and Growth Rates, 2016-2019
Figure 2 World's Top Ten OSAT Companies by Revenue in 2018
Figure 3 Taiwanese IC Packaging and Testing Industry Shipment Value and Growth Rates, 2016-2019
Samples
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Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- AMD
- Amkor
- ASE
- Asus
- Chipbond
- ChipMOS
- FCI
- Hisilicon
- Hynix
- J-Device
- JCET
- JSCK
- KYEC
- MediaTek
- Nanium
- NVidia
- Panasonic
- PTI
- Qorvo
- Qualcomm
- Samsung
- Sigurd
- SJSemi
- Skyworks
- SMIC
- SPIL
- STATS ChipPAC
- Tainshui Huatian Technology
- Tera Probe
- Tongu Microelectronics
- TSI
- Tsinghua Unigroup
- TSMC
- Unisem
- UTAC
- Winste
Methodology
Primary research with a holistic, cross-domain approach
The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.
Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:
Method
- Component supplier interviews
- System supplier interviews
- User interviews
- Channel interviews
- IPO interviews
- Focus groups
- Consumer surveys
- Production databases
- Financial data
- Custom databases
Methodology
- Technology forecasting and assessment
- Product assessment and selection
- Product life cycles
- Added value analysis
- Market trends
- Scenario analysis
- Competitor analysis
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