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Electrically Conductive Adhesives Market - Growth, Trends, COVID-19 Impact, and Forecasts (2022 - 2027)

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    Report

  • 150 Pages
  • August 2022
  • Region: Global
  • Mordor Intelligence
  • ID: 5025997
The electrically conductive adhesives market is expected to record a CAGR of less than 6% globally during the forecast period 2022-2027.

The COVID-19 pandemic had a negative impact on the market. However, the market is now estimated to have reached pre-pandemic levels.
  • The major factor driving the market studied is increasing application in power electronics.
  • Increasing applications of single-part and two-part epoxy adhesives in power electronics are expected to drive market growth during the forecast period.
  • Asia-Pacific is expected to dominate the global market with the most significant consumption from China, Japan, and India.

Key Market Trends


Epoxy Segment to Dominate the Market

  • Electrically conductive adhesives are adhesives that have filler components like pure silver, copper, aluminum, or iron, which provide excellent electrical conductivity, superior adhesion, and good physical strength.
  • These adhesives are used in circuit assembly applications and processes where heat curing or hot soldering can be altered.
  • The epoxy segment of electrically conductive adhesives is widely used in various applications like touch panels, coating, and bonding RFID chips, mounting LEDs, and others.
  • These adhesives provide electrical continuity similar to traditional soldering without the heat stress, and they adhere to many conductive polymers where adhesion with solder is not possible.
  • Epoxy offers the advantages of extended shelf life, room temperature storage, and much lower cure temperatures, which is increasing its application compared to other types.
  • Revenue from the consumer electronics market is likely to reach USD 1,056,693 million in 2022. The market is expected to observe a CAGR of 1.82% from 2022-2026.
  • Hence, based on the aforementioned factors, the epoxy segment is expected to dominate the market over the forecast period.


Asia-Pacific Region to Dominate the Market

  • Asia-Pacific is expected to dominate the global market for electrically conductive adhesives during the forecast period. Due to the high demand from countries like China, India, and Japan, the market for electrically conductive adhesives has been growing.
  • The largest producers of electrically conductive adhesives are located in Asia-Pacific. Some of the leading companies for the production of electrically conductive adhesives are Henkel AG & Co. KGaA, 3M, Dow, Aremco, and HB Fuller Company.
  • The “Made in China 2025” policy, incorporated by China, set specific targets to increase self-sufficiency in integrated circuits production to 40% in 2020 and 70% by 2025. This is expected to increase the scope of application for electrically conductive adhesives in circuit chips over the coming years.
  • ASEAN countries have also been observing the influx of electronics producing companies investing in the region for production facilities.
  • The aforementioned factors, coupled with government support, are expected to result in the Asia-Pacific region dominating the global market.


Competitive Landscape


The global electrically conductive adhesives market is fragmented, with most players accounting for a marginal share in the market. Some of the major companies include Henkel AG & Co. KGaA, 3M, Dow, Permabond.com, and HB Fuller Company, among others.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support


This product will be delivered within 2 business days.

Table of Contents

1 INTRODUCTION
1.1 Study Assumptions
1.2 Scope of the Study
2 RESEARCH METHODOLOGY3 EXECUTIVE SUMMARY
4 MARKET DYNAMICS
4.1 Drivers
4.1.1 Increasing Application in Power Electronics
4.1.2 Other Drivers
4.2 Restraints
4.2.1 Other Restraints
4.3 Industry Value Chain Analysis
4.4 Porter's Five Forces Analysis
4.4.1 Threat of New Entrants
4.4.2 Bargaining Power of Buyers
4.4.3 Bargaining Power of Suppliers
4.4.4 Threat of Substitute Products
4.4.5 Degree of Competition
5 MARKET SEGMENTATION
5.1 Chemistry Type
5.1.1 Epoxy
5.1.2 Silicone
5.1.3 Polyurethane
5.1.4 Acrylic
5.1.5 Other Chemistry Types
5.2 Type
5.2.1 Isotropic
5.2.2 Anisotropic
5.3 Application
5.3.1 Solar Cells
5.3.2 Automotive Electronics
5.3.3 LED Lighting
5.3.4 Printed Circuit Boards
5.3.5 LCD Displays
5.3.6 Other Applications
5.4 Geography
5.4.1 Asia-Pacific
5.4.1.1 China
5.4.1.2 India
5.4.1.3 Japan
5.4.1.4 South Korea
5.4.1.5 Rest of Asia-Pacific
5.4.2 North America
5.4.2.1 US
5.4.2.2 Canada
5.4.2.3 Mexico
5.4.3 Europe
5.4.3.1 Germany
5.4.3.2 UK
5.4.3.3 France
5.4.3.4 Italy
5.4.3.5 Rest of Europe
5.4.4 South America
5.4.4.1 Brazil
5.4.4.2 Argentina
5.4.4.3 Rest of South America
5.4.5 Middle-East and Africa
5.4.5.1 Saudi Arabia
5.4.5.2 South Africa
5.4.5.3 Rest of Middle-East and Africa
6 COMPETITIVE LANDSCAPE
6.1 Mergers and Acquisitions, Joint Ventures, Collaborations, and Agreements
6.2 Market Share (%)**/Ranking Analysis
6.3 Strategies Adopted by Leading Players
6.4 Company Profiles
6.4.1 3M
6.4.2 Aremco
6.4.3 Creative Materials Inc.
6.4.4 Dow
6.4.5 HB Fuller Company
6.4.6 Henkel AG & Co. KGaA
6.4.7 HITEK Electronic Materials Ltd
6.4.8 Master Bond Inc.
6.4.9 MG Chemicals
6.4.10 Panacol-Elosol GmbH
6.4.11 Parker Hannifin Corp.
6.4.12 Permabond
7 MARKET OPPORTUNITIES AND FUTURE TRENDS

Companies Mentioned

A selection of companies mentioned in this report includes:

  • 3M
  • Aremco
  • Creative Materials Inc.
  • Dow
  • HB Fuller Company
  • Henkel AG & Co. KGaA
  • HITEK Electronic Materials Ltd
  • Master Bond Inc.
  • MG Chemicals
  • Panacol-Elosol GmbH
  • Parker Hannifin Corp.
  • Permabond

Methodology

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