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Global Flip Chip Market By Packaging Technology, By Bumping Technology, By End User, By Region, Industry Analysis and Forecast, 2020 - 2026

  • ID: 5137471
  • Report
  • July 2020
  • Region: Global
  • 244 pages
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
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FEATURED COMPANIES

  • 3M Company
  • Amkor Technology, Inc.
  • Apple, Inc.
  • Fujitsu Limited
  • IBM Corporation
  • Intel Corporation
  • MORE
The Global Flip Chip Market size is expected to reach $36.7 billion by 2026, rising at a market growth of 8.2% CAGR during the forecast period. Flip chip is a manufacturing system that interconnects the device and substrate of a product carrier with a bounce. Such bumps are mounted on the die surface and help to create an electrical connection between the device and the box substrate. Any surface of a flip chip can be used for interconnecting, generally by means of copper, nickel or solder metal bumps. Technological dominance over wire bond connections, growing demand for high connectivity devices, retaining high package density and increasing circuit durability are some of the factors driving the flip-chip market.

The demand for flip chip technology is currently undergoing a high growth owing to the advancement of copper pillar and micro bumping metallurgy and its extensive application of consumer electronics and mobile phones. Current bumping methods support the most advanced manufacturing techniques, such that the flip chip process can be modified to meet new challenges. Due to its increased performance capabilities, flip chip technology has become a commonly recognized medium-range and high-range technology. Increasing demand for mobile wireless, computer and consumer applications is pushing the market growth for flip-chip technology.

The rate of adoption of the flip chip is influenced by the cost of the bumping and assembly process. Key market players are focused on the introduction of efficient and advanced packaging solutions to sustain tough competition on the market. Flip chip finds its primary application in electronic packaging and electrical connections. The Copper Pillar Bump is a next-generation flip chip interconnect that provides advantages in design to meet current and future requirements for electronic devices. It is a remarkable interconnecting choice for applications such as transceivers, embedded processors and electrical processors.

Global flip-chip market revenue has seen significant growth in recent years; however, the market is experiencing a sudden decline as the critical electronics manufacturing industries have been temporarily shut down, primarily to minimize the spread of COVID-19. In addition, this pandemic has had a major impact on the global supply chain, both by impacting suppliers through shortages of components, materials and finished goods and by reducing consumer spending in China on semiconductor-dependent products such as consumer electronics, automobiles and others. Therefore, the semiconductor industry is compelled to change the global supply chain model, which in effect is expected to have a positive impact on the growth of the market in the near future.

Based on Packaging Technology, the market is segmented into 2.5D IC, 3D IC and 2D IC. Based on Bumping Technology, the market is segmented into Copper Pillar, Gold Bumping, Solder Bumping and Others. Based on End User, the market is segmented into Electronics, Industrial, IT & Telecom, Automotive, Healthcare & Life Sciences, Aerospace & Defense and Others. Based on Regions, the market is segmented into North America, Europe, Asia Pacific, and Latin America, Middle East & Africa.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple, Inc., Fujitsu Limited, Intel Corporation, IBM Corporation, Samsung Electronics Co., Ltd., Texas Instruments, Inc., and Taiwan Semiconductor Manufacturing Company.

Scope of the Study

Market Segmentation:

By Packaging Technology
  • 2.5D IC
  • 3D IC
  • 2D IC
By Bumping Technology
  • Copper Pillar
  • Gold Bumping
  • Solder Bumping
  • Others
By End User
  • Electronics
  • Industrial
  • IT & Telecom
  • Automotive
  • Healthcare & Life Sciences
  • Aerospace & Defense
  • Others
By Geography

North America
  • US
  • Canada
  • Mexico
  • Rest of North America
Europe
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe
Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific
LAMEA
  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA
Companies Profiled
  • 3M Company
  • Advanced Micro Devices, Inc.
  • Amkor Technology, Inc.
  • Apple, Inc.
  • Fujitsu Limited
  • Intel Corporation
  • IBM Corporation
  • Samsung Electronics Co., Ltd.
  • Texas Instruments, Inc.
  • Taiwan Semiconductor Manufacturing Company
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Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • 3M Company
  • Amkor Technology, Inc.
  • Apple, Inc.
  • Fujitsu Limited
  • IBM Corporation
  • Intel Corporation
  • MORE
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Global Flip Chip Market, by Packaging Technology
1.4.2 Global Flip Chip Market, by Bumping Technology
1.4.3 Global Flip Chip Market, by End User
1.4.4 Global Flip Chip Market, by Geography
1.5 Methodology for the research

Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.2 Executive Summary
2.1.3 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints

Chapter 3. Global Flip Chip Market by Packaging Technology
3.1 Global Flip Chip 2.5D IC Market by Region
3.2 Global Flip Chip 3D IC Market by Region
3.3 Global Flip Chip 2D IC Market by Region

Chapter 4. Global Flip Chip Market by Bumping Technology
4.1 Global Copper Pillar Flip Chip Market by Region
4.2 Global Gold Bumping Flip Chip Market by Region
4.3 Global Solder Bumping Flip Chip Market by Region
4.4 Global Other Bumping Technology Flip Chip Market by Region

Chapter 5. Global Flip Chip Market by End User
5.1 Global Electronics Flip Chip Market by Region
5.2 Global Industrial Flip Chip Market by Region
5.3 Global IT & Telecom Flip Chip Market by Region
5.4 Global Automotive Flip Chip Market by Region
5.5 Global Healthcare & Life Sciences Flip Chip Market by Region
5.6 Global Aerospace & Defense Flip Chip Market by Region
5.7 Global Others Flip Chip Market by Region

Chapter 6. Global Flip Chip Market by Region
6.1 North America Flip Chip Market
6.1.1 North America Flip Chip Market by Packaging Technology
6.1.1.1 North America Flip Chip 2.5D IC Market by Country
6.1.1.2 North America Flip Chip 3D IC Market by Country
6.1.1.3 North America Flip Chip 2D IC Market by Country
6.1.2 North America Flip Chip Market by Bumping Technology
6.1.2.1 North America Copper Pillar Flip Chip Market by Country
6.1.2.2 North America Gold Bumping Flip Chip Market by Country
6.1.2.3 North America Solder Bumping Flip Chip Market by Country
6.1.2.4 North America Other Bumping Technology Flip Chip Market by Country
6.1.3 North America Flip Chip Market by End User
6.1.3.1 North America Electronics Flip Chip Market by Country
6.1.3.2 North America Industrial Flip Chip Market by Country
6.1.3.3 North America IT & Telecom Flip Chip Market by Country
6.1.3.4 North America Automotive Flip Chip Market by Country
6.1.3.5 North America Healthcare & Life Sciences Flip Chip Market by Country
6.1.3.6 North America Aerospace & Defense Flip Chip Market by Country
6.1.3.7 North America Others Flip Chip Market by Country
6.1.4 North America Flip Chip Market by Country
6.1.4.1 US Flip Chip Market
6.1.4.1.1 US Flip Chip Market by Packaging Technology
6.1.4.1.2 US Flip Chip Market by Bumping Technology
6.1.4.1.3 US Flip Chip Market by End User
6.1.4.2 Canada Flip Chip Market
6.1.4.2.1 Canada Flip Chip Market by Packaging Technology
6.1.4.2.2 Canada Flip Chip Market by Bumping Technology
6.1.4.2.3 Canada Flip Chip Market by End User
6.1.4.3 Mexico Flip Chip Market
6.1.4.3.1 Mexico Flip Chip Market by Packaging Technology
6.1.4.3.2 Mexico Flip Chip Market by Bumping Technology
6.1.4.3.3 Mexico Flip Chip Market by End User
6.1.4.4 Rest of North America Flip Chip Market
6.1.4.4.1 Rest of North America Flip Chip Market by Packaging Technology
6.1.4.4.2 Rest of North America Flip Chip Market by Bumping Technology
6.1.4.4.3 Rest of North America Flip Chip Market by End User
6.2 Europe Flip Chip Market
6.2.1 Europe Flip Chip Market by Packaging Technology
6.2.1.1 Europe Flip Chip 2.5D IC Market by Country
6.2.1.2 Europe Flip Chip 3D IC Market by Country
6.2.1.3 Europe Flip Chip 2D IC Market by Country
6.2.2 Europe Flip Chip Market by Bumping Technology
6.2.2.1 Europe Copper Pillar Flip Chip Market by Country
6.2.2.2 Europe Gold Bumping Flip Chip Market by Country
6.2.2.3 Europe Solder Bumping Flip Chip Market by Country
6.2.2.4 Europe Other Bumping Technology Flip Chip Market by Country
6.2.3 Europe Flip Chip Market by End User
6.2.3.1 Europe Electronics Flip Chip Market by Country
6.2.3.2 Europe Industrial Flip Chip Market by Country
6.2.3.3 Europe IT & Telecom Flip Chip Market by Country
6.2.3.4 Europe Automotive Flip Chip Market by Country
6.2.3.5 Europe Healthcare & Life Sciences Flip Chip Market by Country
6.2.3.6 Europe Aerospace & Defense Flip Chip Market by Country
6.2.3.7 Europe Others Flip Chip Market by Country
6.2.4 Europe Flip Chip Market by Country
6.2.4.1 Germany Flip Chip Market
6.2.4.1.1 Germany Flip Chip Market by Packaging Technology
6.2.4.1.2 Germany Flip Chip Market by Bumping Technology
6.2.4.1.3 Germany Flip Chip Market by End User
6.2.4.2 UK Flip Chip Market
6.2.4.2.1 UK Flip Chip Market by Packaging Technology
6.2.4.2.2 UK Flip Chip Market by Bumping Technology
6.2.4.2.3 UK Flip Chip Market by End User
6.2.4.3 France Flip Chip Market
6.2.4.3.1 France Flip Chip Market by Packaging Technology
6.2.4.3.2 France Flip Chip Market by Bumping Technology
6.2.4.3.3 France Flip Chip Market by End User
6.2.4.4 Russia Flip Chip Market
6.2.4.4.1 Russia Flip Chip Market by Packaging Technology
6.2.4.4.2 Russia Flip Chip Market by Bumping Technology
6.2.4.4.3 Russia Flip Chip Market by End User
6.2.4.5 Spain Flip Chip Market
6.2.4.5.1 Spain Flip Chip Market by Packaging Technology
6.2.4.5.2 Spain Flip Chip Market by Bumping Technology
6.2.4.5.3 Spain Flip Chip Market by End User
6.2.4.6 Italy Flip Chip Market
6.2.4.6.1 Italy Flip Chip Market by Packaging Technology
6.2.4.6.2 Italy Flip Chip Market by Bumping Technology
6.2.4.6.3 Italy Flip Chip Market by End User
6.2.4.7 Rest of Europe Flip Chip Market
6.2.4.7.1 Rest of Europe Flip Chip Market by Packaging Technology
6.2.4.7.2 Rest of Europe Flip Chip Market by Bumping Technology
6.2.4.7.3 Rest of Europe Flip Chip Market by End User
6.3 Asia Pacific Flip Chip Market
6.3.1 Asia Pacific Flip Chip Market by Packaging Technology
6.3.1.1 Asia Pacific Flip Chip 2.5D IC Market by Country
6.3.1.2 Asia Pacific Flip Chip 3D IC Market by Country
6.3.1.3 Asia Pacific Flip Chip 2D IC Market by Country
6.3.2 Asia Pacific Flip Chip Market by Bumping Technology
6.3.2.1 Asia Pacific Copper Pillar Flip Chip Market by Country
6.3.2.2 Asia Pacific Gold Bumping Flip Chip Market by Country
6.3.2.3 Asia Pacific Solder Bumping Flip Chip Market by Country
6.3.2.4 Asia Pacific Other Bumping Technology Flip Chip Market by Country
6.3.3 Asia Pacific Flip Chip Market by End User
6.3.3.1 Asia Pacific Electronics Flip Chip Market by Country
6.3.3.2 Asia Pacific Industrial Flip Chip Market by Country
6.3.3.3 Asia Pacific IT & Telecom Flip Chip Market by Country
6.3.3.4 Asia Pacific Automotive Flip Chip Market by Country
6.3.3.5 Asia Pacific Healthcare & Life Sciences Flip Chip Market by Country
6.3.3.6 Asia Pacific Aerospace & Defense Flip Chip Market by Country
6.3.3.7 Asia Pacific Others Flip Chip Market by Country
6.3.4 Asia Pacific Flip Chip Market by Country
6.3.4.1 China Flip Chip Market
6.3.4.1.1 China Flip Chip Market by Packaging Technology
6.3.4.1.2 China Flip Chip Market by Bumping Technology
6.3.4.1.3 China Flip Chip Market by End User
6.3.4.2 Japan Flip Chip Market
6.3.4.2.1 Japan Flip Chip Market by Packaging Technology
6.3.4.2.2 Japan Flip Chip Market by Bumping Technology
6.3.4.2.3 Japan Flip Chip Market by End User
6.3.4.3 India Flip Chip Market
6.3.4.3.1 India Flip Chip Market by Packaging Technology
6.3.4.3.2 India Flip Chip Market by Bumping Technology
6.3.4.3.3 India Flip Chip Market by End User
6.3.4.4 South Korea Flip Chip Market
6.3.4.4.1 South Korea Flip Chip Market by Packaging Technology
6.3.4.4.2 South Korea Flip Chip Market by Bumping Technology
6.3.4.4.3 South Korea Flip Chip Market by End User
6.3.4.5 Singapore Flip Chip Market
6.3.4.5.1 Singapore Flip Chip Market by Packaging Technology
6.3.4.5.2 Singapore Flip Chip Market by Bumping Technology
6.3.4.5.3 Singapore Flip Chip Market by End User
6.3.4.6 Malaysia Flip Chip Market
6.3.4.6.1 Malaysia Flip Chip Market by Packaging Technology
6.3.4.6.2 Malaysia Flip Chip Market by Bumping Technology
6.3.4.6.3 Malaysia Flip Chip Market by End User
6.3.4.7 Rest of Asia Pacific Flip Chip Market
6.3.4.7.1 Rest of Asia Pacific Flip Chip Market by Packaging Technology
6.3.4.7.2 Rest of Asia Pacific Flip Chip Market by Bumping Technology
6.3.4.7.3 Rest of Asia Pacific Flip Chip Market by End User
6.4 LAMEA Flip Chip Market
6.4.1 LAMEA Flip Chip Market by Packaging Technology
6.4.1.1 LAMEA Flip Chip 2.5D IC Market by Country
6.4.1.2 LAMEA Flip Chip 3D IC Market by Country
6.4.1.3 LAMEA Flip Chip 2D IC Market by Country
6.4.2 LAMEA Flip Chip Market by Bumping Technology
6.4.2.1 LAMEA Copper Pillar Flip Chip Market by Country
6.4.2.2 LAMEA Gold Bumping Flip Chip Market by Country
6.4.2.3 LAMEA Solder Bumping Flip Chip Market by Country
6.4.2.4 LAMEA Other Bumping Technology Flip Chip Market by Country
6.4.3 LAMEA Flip Chip Market by End User
6.4.3.1 LAMEA Electronics Flip Chip Market by Country
6.4.3.2 LAMEA Industrial Flip Chip Market by Country
6.4.3.3 LAMEA IT & Telecom Flip Chip Market by Country
6.4.3.4 LAMEA Automotive Flip Chip Market by Country
6.4.3.5 LAMEA Healthcare & Life Sciences Flip Chip Market by Country
6.4.3.6 LAMEA Aerospace & Defense Flip Chip Market by Country
6.4.3.7 LAMEA Others Flip Chip Market by Country
6.4.4 LAMEA Flip Chip Market by Country
6.4.4.1 Brazil Flip Chip Market
6.4.4.1.1 Brazil Flip Chip Market by Packaging Technology
6.4.4.1.2 Brazil Flip Chip Market by Bumping Technology
6.4.4.1.3 Brazil Flip Chip Market by End User
6.4.4.2 Argentina Flip Chip Market
6.4.4.2.1 Argentina Flip Chip Market by Packaging Technology
6.4.4.2.2 Argentina Flip Chip Market by Bumping Technology
6.4.4.2.3 Argentina Flip Chip Market by End User
6.4.4.3 UAE Flip Chip Market
6.4.4.3.1 UAE Flip Chip Market by Packaging Technology
6.4.4.3.2 UAE Flip Chip Market by Bumping Technology
6.4.4.3.3 UAE Flip Chip Market by End User
6.4.4.4 Saudi Arabia Flip Chip Market
6.4.4.4.1 Saudi Arabia Flip Chip Market by Packaging Technology
6.4.4.4.2 Saudi Arabia Flip Chip Market by Bumping Technology
6.4.4.4.3 Saudi Arabia Flip Chip Market by End User
6.4.4.5 South Africa Flip Chip Market
6.4.4.5.1 South Africa Flip Chip Market by Packaging Technology
6.4.4.5.2 South Africa Flip Chip Market by Bumping Technology
6.4.4.5.3 South Africa Flip Chip Market by End User
6.4.4.6 Nigeria Flip Chip Market
6.4.4.6.1 Nigeria Flip Chip Market by Packaging Technology
6.4.4.6.2 Nigeria Flip Chip Market by Bumping Technology
6.4.4.6.3 Nigeria Flip Chip Market by End User
6.4.4.7 Rest of LAMEA Flip Chip Market
6.4.4.7.1 Rest of LAMEA Flip Chip Market by Packaging Technology
6.4.4.7.2 Rest of LAMEA Flip Chip Market by Bumping Technology
6.4.4.7.3 Rest of LAMEA Flip Chip Market by End User

Chapter 7. Company Profiles
7.1 3M Company
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.4 Research & Development Expense
7.1.5 SWOT Analysis
7.2 Advanced Micro Devices, Inc.
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expenses
7.3 Amkor Technology, Inc.
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional Analysis
7.3.4 Research & Development Expense
7.3.5 Recent strategies and developments:
7.3.5.1 Partnerships, Collaborations, and Agreements:
7.4 Apple, Inc.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Product and Regional Analysis
7.4.4 Research & Development Expense
7.4.5 SWOT Analysis
7.5 Fujitsu Limited
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 SWOT Analysis
7.6 Intel Corporation
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 Research & Development Expenses
7.6.5 Recent strategies and developments:
7.6.5.1 Acquisition and Mergers:
7.6.6 SWOT Analysis
7.7 IBM Corporation
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Regional & Segmental Analysis
7.7.4 Research & Development Expenses
7.7.5 SWOT Analysis
7.8 Samsung Electronics Co., Ltd. (Samsung Group)
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expense
7.8.5 Recent strategies and developments:
7.8.5.1 Product Launches and Product Expansions:
7.8.6 SWOT Analysis
7.9 Texas Instruments, Inc.
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental and Regional Analysis
7.9.4 Research & Development Expense
7.9.5 SWOT Analysis
7.10 Taiwan Semiconductor Manufacturing Company
7.10.1 Company overview
7.10.2 Financial Analysis
7.10.3 Regional Analysis
7.10.4 Research & Development Expense
Note: Product cover images may vary from those shown
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  • 3M Company
  • Advanced Micro Devices, Inc.
  • Amkor Technology, Inc.
  • Apple, Inc.
  • Fujitsu Limited
  • Intel Corporation
  • IBM Corporation
  • Samsung Electronics Co., Ltd.
  • Texas Instruments, Inc.
  • Taiwan Semiconductor Manufacturing Company
Note: Product cover images may vary from those shown
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