Chapter 3: Market Overview
3.1. Market Definition and Scope
3.2. Key Forces Shaping the Market
3.3. Top Investment Pockets
3.4. Patent Analysis
3.4.1. By Region, 2013–2020
3.5. Market Dynamics
3.5.1. Drivers
3.5.1.1. Perfectly Suitable Properties for Electronic Applications
3.5.1.2. Increased Consumer Electronic Industry Output and Trend for Miniaturization
3.5.2. Restraints
3.5.2.1. Improper Selection of Potting Resin
3.5.3. Opportunity
3.5.3.1. Gradual Adoption of Two Component Polyurethane Potting Compounds
3.6. Impact of Covid-19 Outbreak on the Market
Chapter 4: Potting Compound Market, by Resin Type
4.1. Overview
4.1.1. Market Size and Forecast
4.2. Epoxy
4.2.1. Key Market Trends, Growth Factors, and Opportunities
4.2.2. Market Size and Forecast, by Region
4.2.3. Market Share Analysis, by Country
4.3. Polyurethane
4.3.1. Key Market Trends, Growth Factors, and Opportunities
4.3.2. Market Size and Forecast, by Region
4.3.3. Market Share Analysis, by Country
4.4. Silicone
4.4.1. Key Market Trends, Growth Factors, and Opportunities
4.4.2. Market Size and Forecast, by Region
4.4.3. Market Share Analysis, by Country
4.5. Polyester
4.5.1. Key Market Trends, Growth Factors, and Opportunities
4.5.2. Market Size and Forecast, by Region
4.5.3. Market Share Analysis, by Country
4.6. Polyamide
4.6.1. Key Market Trends, Growth Factors, and Opportunities
4.6.2. Market Size and Forecast, by Region
4.6.3. Market Share Analysis, by Country
4.7. Polyolefin
4.7.1. Key Market Trends, Growth Factors, and Opportunities
4.7.2. Market Size and Forecast, by Region
4.7.3. Market Share Analysis, by Country
4.8. Acrylics
4.8.1. Key Market Trends, Growth Factors, and Opportunities
4.8.2. Market Size and Forecast, by Region
4.8.3. Market Share Analysis, by Country
Chapter 5: Potting Compound Market, by Curing Technology
5.1. Overview
5.1.1. Market Size and Forecast
5.2. Uv Curing
5.2.1. Key Market Trends, Growth Factors, and Opportunities
5.2.2. Market Size and Forecast, by Region
5.2.3. Market Share Analysis, by Country
5.3. Thermal Curing
5.3.1. Key Market Trends, Growth Factors, and Opportunities
5.3.2. Market Size and Forecast, by Region
5.3.3. Market Share Analysis, by Country
5.4. Room Temperature Curing
5.4.1. Key Market Trends, Growth Factors, and Opportunities
5.4.2. Market Size and Forecast, by Region
5.4.3. Market Share Analysis, by Country
Chapter 6: Potting Compound Market, by Application
6.1. Overview
6.1.1. Market Size and Forecast
6.2. Electrical
6.2.1. Key Market Trends, Growth Factors, and Opportunities
6.2.2. Market Size and Forecast, by Region
6.2.3. Market Size and Forecast, by Electrical Type
6.2.4. Market Share Analysis, by Country
6.3. Electronics
6.3.1. Key Market Trends, Growth Factors, and Opportunities
6.3.2. Market Size and Forecast, by Region
6.3.3. Market Size and Forecast, by Electronics Type
6.3.4. Market Share Analysis, by Country
Chapter 7: Potting Compound Market, by End-user
7.1. Overview
7.1.1. Market Size and Forecast
7.2. Electronics
7.2.1. Key Market Trends, Growth Factors, and Opportunities
7.2.2. Market Size and Forecast, by Region
7.2.3. Market Share Analysis, by Country
7.3. Aerospace
7.3.1. Key Market Trends, Growth Factors, and Opportunities
7.3.2. Market Size and Forecast, by Region
7.3.3. Market Share Analysis, by Country
7.4. Automotive
7.4.1. Key Market Trends, Growth Factors, and Opportunities
7.4.2. Market Size and Forecast, by Region
7.4.3. Market Share Analysis, by Country
7.5. Industrial
7.5.1. Key Market Trends, Growth Factors, and Opportunities
7.5.2. Market Size and Forecast, by Region
7.5.3. Market Share Analysis, by Country
7.6. Other
7.6.1. Key Market Trends, Growth Factors, and Opportunities
7.6.2. Market Size and Forecast, by Region
7.6.3. Market Share Analysis, by Country
Chapter 8: Potting Compound Market, by Region
8.1. Overview
8.1.1. Market Size and Forecast
8.2. North America
8.2.1. Key Market Trends, Growth Factors, and Opportunities
8.2.2. Market Size and Forecast, by Resin Type
8.2.3. Market Size and Forecast, by Curing Technology
8.2.4. Market Size and Forecast, by Application
8.2.4.1. Market Size and Forecast, by Electrical Application
8.2.4.2. Market Size and Forecast, by Electronics Application
8.2.5. Market Size and Forecast, by End-user
8.2.6. Market Share Analysis, by Country
8.2.7. U.S.
8.2.7.1. Market Size and Forecast, by Resin Type
8.2.7.2. Market Size and Forecast, by Curing Technology
8.2.7.3. Market Size and Forecast, by Application
8.2.7.3.1. Market Size and Forecast, by Electrical Application
8.2.7.3.2. Market Size and Forecast, by Electronics Application
8.2.7.4. Market Size and Forecast, by End-user
8.2.8. Canada
8.2.8.1. Market Size and Forecast, by Resin Type
8.2.8.2. Market Size and Forecast, by Curing Technology
8.2.8.3. Market Size and Forecast, by Application
8.2.8.3.1. Market Size and Forecast, by Electrical Application
8.2.8.3.2. Market Size and Forecast, by Electronics Application
8.2.8.4. Market Size and Forecast, by End-user
8.2.9. Mexico
8.2.9.1. Market Size and Forecast, by Resin Type
8.2.9.2. Market Size and Forecast, by Curing Technology
8.2.9.3. Market Size and Forecast, by Application
8.2.9.3.1. Market Size and Forecast, by Electrical Application
8.2.9.3.2. Market Size and Forecast, by Electronics Application
8.2.9.4. Market Size and Forecast, by End-user
8.3. Europe
8.3.1. Key Market Trends, Growth Factors, and Opportunities
8.3.2. Market Size and Forecast, by Resin Type
8.3.3. Market Size and Forecast, by Curing Technology
8.3.4. Market Size and Forecast, by Application
8.3.4.1. Market Size and Forecast, by Electrical Application
8.3.4.2. Market Size and Forecast, by Electronics Application
8.3.5. Market Size and Forecast, by End-user
8.3.6. Market Share Analysis, by Country
8.3.7. Germany
8.3.7.1. Market Size and Forecast, by Resin Type
8.3.7.2. Market Size and Forecast, by Curing Technology
8.3.7.3. Market Size and Forecast, by Application
8.3.7.3.1. Market Size and Forecast, by Electrical Application
8.3.7.3.2. Market Size and Forecast, by Electronics Application
8.3.7.4. Market Size and Forecast, by End-user
8.3.8. France
8.3.8.1. Market Size and Forecast, by Resin Type
8.3.8.2. Market Size and Forecast, by Curing Technology
8.3.8.3. Market Size and Forecast, by Application
8.3.8.3.1. Market Size and Forecast, by Electrical Application
8.3.8.3.2. Market Size and Forecast, by Electronics Application
8.3.8.4. Market Size and Forecast, by End-user
8.3.9. UK
8.3.9.1. Market Size and Forecast, by Resin Type
8.3.9.2. Market Size and Forecast, by Curing Technology
8.3.9.3. Market Size and Forecast, by Application
8.3.9.3.1. Market Size and Forecast, by Electrical Application
8.3.9.3.2. Market Size and Forecast, by Electronics Application
8.3.9.4. Market Size and Forecast, by End-user
8.3.10. Italy
8.3.10.1. Market Size and Forecast, by Resin Type
8.3.10.2. Market Size and Forecast, by Curing Technology
8.3.10.3. Market Size and Forecast, by Application
8.3.10.3.1. Market Size and Forecast, by Electrical Application
8.3.10.3.2. Market Size and Forecast, by Electronics Application
8.3.10.4. Market Size and Forecast, by End-user
8.3.11. Spain
8.3.11.1. Market Size and Forecast, by Resin Type
8.3.11.2. Market Size and Forecast, by Curing Technology
8.3.11.3. Market Size and Forecast, by Application
8.3.11.3.1. Market Size and Forecast, by Electrical Application
8.3.11.3.2. Market Size and Forecast, by Electronics Application
8.3.11.4. Market Size and Forecast, by End-user
8.3.12. Rest of Europe
8.3.12.1. Market Size and Forecast, by Resin Type
8.3.12.2. Market Size and Forecast, by Curing Technology
8.3.12.3. Market Size and Forecast, by Application
8.3.12.3.1. Market Size and Forecast, by Electrical Application
8.3.12.3.2. Market Size and Forecast, by Electronics Application
8.3.12.4. Market Size and Forecast, by End-user
8.4. Asia-Pacific
8.4.1. Key Market Trends, Growth Factors, and Opportunities
8.4.2. Market Size and Forecast, by Resin Type
8.4.3. Market Size and Forecast, by Curing Technology
8.4.4. Market Size and Forecast, by Application
8.4.4.1. Market Size and Forecast, by Electrical Application
8.4.4.2. Market Size and Forecast, by Electronics Application
8.4.5. Market Size and Forecast, by End-user
8.4.6. Market Share Analysis, by Country
8.4.7. China
8.4.7.1. Market Size and Forecast, by Resin Type
8.4.7.2. Market Size and Forecast, by Curing Technology
8.4.7.3. Market Size and Forecast, by Application
8.4.7.3.1. Market Size and Forecast, by Electrical Application
8.4.7.3.2. Market Size and Forecast, by Electronics Application
8.4.7.4. Market Size and Forecast, by End-user
8.4.8. Japan
8.4.8.1. Market Size and Forecast, by Resin Type
8.4.8.2. Market Size and Forecast, by Curing Technology
8.4.8.3. Market Size and Forecast, by Application
8.4.8.3.1. Market Size and Forecast, by Electrical Application
8.4.8.3.2. Market Size and Forecast, by Electronics Application
8.4.8.4. Market Size and Forecast, by End-user
8.4.9. India
8.4.9.1. Market Size and Forecast, by Resin Type
8.4.9.2. Market Size and Forecast, by Curing Technology
8.4.9.3. Market Size and Forecast, by Application
8.4.9.3.1. Market Size and Forecast, by Electrical Application
8.4.9.3.2. Market Size and Forecast, by Electronics Application
8.4.9.4. Market Size and Forecast, by End-user
8.4.10. South Korea
8.4.10.1. Market Size and Forecast, by Resin Type
8.4.10.2. Market Size and Forecast, by Curing Technology
8.4.10.3. Market Size and Forecast, by Application
8.4.10.3.1. Market Size and Forecast, by Electrical Application
8.4.10.3.2. Market Size and Forecast, by Electronics Application
8.4.10.4. Market Size and Forecast, by End-user
8.4.11. Australia
8.4.11.1. Market Size and Forecast, by Resin Type
8.4.11.2. Market Size and Forecast, by Curing Technology
8.4.11.3. Market Size and Forecast, by Application
8.4.11.3.1. Market Size and Forecast, by Electrical Application
8.4.11.3.2. Market Size and Forecast, by Electronics Application
8.4.11.4. Market Size and Forecast, by End-user
8.4.12. Rest of Asia-Pacific
8.4.12.1. Market Size and Forecast, by Resin Type
8.4.12.2. Market Size and Forecast, by Curing Technology
8.4.12.3. Market Size and Forecast, by Application
8.4.12.3.1. Market Size and Forecast, by Electrical Application
8.4.12.3.2. Market Size and Forecast, by Electronics Application
8.4.12.4. Market Size and Forecast, by End-user
8.5. LAMEA
8.5.1. Key Market Trends, Growth Factors, and Opportunities
8.5.2. Market Size and Forecast, by Resin Type
8.5.3. Market Size and Forecast, by Curing Technology
8.5.4. Market Size and Forecast, by Application
8.5.4.1. Market Size and Forecast, by Electrical Application
8.5.4.2. Market Size and Forecast, by Electronics Application
8.5.5. Market Size and Forecast, by End-user
8.5.6. Market Share Analysis, by Country
8.5.7. Brazil
8.5.7.1. Market Size and Forecast, by Resin Type
8.5.7.2. Market Size and Forecast, by Curing Technology
8.5.7.3. Market Size and Forecast, by Application
8.5.7.3.1. Market Size and Forecast, by Electrical Application
8.5.7.3.2. Market Size and Forecast, by Electronics Application
8.5.7.4. Market Size and Forecast, by End-user
8.5.8. Saudi Arabia
8.5.8.1. Market Size and Forecast, by Resin Type
8.5.8.2. Market Size and Forecast, by Curing Technology
8.5.8.3. Market Size and Forecast, by Application
8.5.8.3.1. Market Size and Forecast, by Electrical Application
8.5.8.3.2. Market Size and Forecast, by Electronics Application
8.5.8.4. Market Size and Forecast, by End-user
8.5.9. South Africa
8.5.9.1. Market Size and Forecast, by Resin Type
8.5.9.2. Market Size and Forecast, by Curing Technology
8.5.9.3. Market Size and Forecast, by Application
8.5.9.3.1. Market Size and Forecast, by Electrical Application
8.5.9.3.2. Market Size and Forecast, by Electronics Application
8.5.9.4. Market Size and Forecast, by End-user
8.5.10. Rest of LAMEA
8.5.10.1. Market Size and Forecast, by Resin Type
8.5.10.2. Market Size and Forecast, by Curing Technology
8.5.10.3. Market Size and Forecast, by Application
8.5.10.3.1. Market Size and Forecast, by Electrical Application
8.5.10.3.2. Market Size and Forecast, by Electronics Application
8.5.10.4. Market Size and Forecast, by End-user
Chapter 9: Competitive Landscape
9.1. Introduction
9.1.1. Market Player Positioning, 2019
9.2. Top Winning Strategies
9.2.1. Top Winning Strategies, by Year
9.2.2. Top Winning Strategies, by Development
9.2.3. Top Winning Strategies, by Company
9.3. Product Mapping of Top Key Players
9.4. Competitive Heatmap
9.5. Key Developments
9.5.1. New Product Launches
9.5.2. Acquisition
Chapter 10: Company Profiles
10.1. Altana AG
10.1.1. Company Overview
10.1.2. Company Snapshot
10.1.3. Operating Business Segments
10.1.4. Product Portfolio
10.1.5. Business Performance
10.1.6. Key Strategic Moves and Developments
10.2. Aremco Products, Inc.
10.2.1. Company Overview
10.2.2. Company Snapshot
10.2.3. Product Portfolio
10.3. Dow, Inc.
10.3.1. Company Overview
10.3.2. Company Snapshot
10.3.3. Operating Business Segments
10.3.4. Product Portfolio
10.3.5. Business Performance
10.4. Dymax Corporation
10.4.1. Company Overview
10.4.2. Company Snapshot
10.4.3. Product Portfolio
10.5. Henkel AG & Co. Kgaa
10.5.1. Company Overview
10.5.2. Company Snapshot
10.5.3. Operating Business Segments
10.5.4. Product Portfolio
10.5.5. Business Performance
10.5.6. Key Strategic Moves and Developments
10.6. Hitachi Chemical Co. Ltd.
10.6.1. Company Overview
10.6.2. Company Snapshot
10.6.3. Operating Business Segments
10.6.4. Product Portfolio
10.6.5. Business Performance
10.7. Huntsman International LLC
10.7.1. Company Overview
10.7.2. Company Snapshot
10.7.3. Operating Business Segments
10.7.4. Product Portfolio
10.7.5. Business Performance
10.7.6. Key Strategic Moves and Developments
10.8. Lord Corporation
10.8.1. Company Overview
10.8.2. Company Snapshot
10.8.3. Product Portfolio
10.9. Master Bond Inc.
10.9.1. Company Overview
10.9.2. Company Snapshot
10.9.3. Product Portfolio
10.9.4. Key Strategic Moves and Developments
10.10. Mg Chemicals
10.10.1. Company Overview
10.10.2. Company Snapshot
10.10.3. Product Portfolio
10.11. Rbc Industries, Inc.
10.11.1. Company Overview
10.11.2. Company Snapshot
10.11.3. Operating Business Segments
10.11.4. Product Portfolio
10.11.5. Key Strategic Moves and Developments
10.12. Shanghai Sepna Chemical Technology Co. Ltd.
10.12.1. Company Overview
10.12.2. Company Snapshot
10.12.3. Operating Business Segments
10.12.4. Product Portfolio
10.13. Wacker Chemie AG
10.13.1. Company Overview
10.13.2. Company Snapshot
10.13.3. Operating Business Segments
10.13.4. Product Portfolio
10.13.5. Business Performance
10.14. Wevo-Chemie GmbH
10.14.1. Company Overview
10.14.2. Company Snapshot
10.14.3. Product Portfolio
10.15.3M
10.15.1. Company Overview
10.15.2. Company Snapshot
10.15.3. Operating Business Segments
10.15.4. Product Portfolio
10.15.5. Business Performance/
10.15.6. Key Strategic Moves and Developments