+353-1-416-8900REST OF WORLD
+44-20-3973-8888REST OF WORLD
1-917-300-0470EAST COAST U.S
1-800-526-8630U.S. (TOLL FREE)


Advances in Embedded and Fan-Out Wafer Level Packaging Technologies. Edition No. 1. IEEE Press

  • ID: 5225486
  • Book
  • March 2019
  • 576 Pages
  • John Wiley and Sons Ltd

Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges

Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons.

Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions.

  • Discusses specific company standards and their development results
  • Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.

Note: Product cover images may vary from those shown

Preface xvii

List of Contributors xxiii

Acknowledgments xxvii

1 History of Embedded and Fan-Out Packaging Technology 1
Michael Topper, Andreas Ostmann, Tanja Braun, and Klaus-Dieter Lang

2 FO-WLP Market and Technology Trends 39
E. Jan Vardaman

3 Embedded Wafer-Level Ball Grid Array (eWLB) Packaging Technology Platform 55
Thorsten Meyer and Steffen Krohnert

4 Ultrathin 3D FO-WLP eWLB-PoP (Embedded Wafer-Level Ball Grid Array-Package-on-Package) Technology 77
S.W. Yoon

5 NEPES’ Fan-Out Packaging Technology from Single die, SiP to Panel-Level Packaging 97
Jong Heon (Jay) Kim

6 M-Series Fan-Out with Adaptive Patterning 117
Tim Olson and Chris Scanlan

7 SWIFTR Semiconductor Packaging Technology 141
Ron Huemoeller and Curtis Zwenger

8 Embedded Silicon Fan-Out (eSiFOR) Technology for Wafer-Level System Integration 169
Daquan Yu

9 Embedding of Active and Passive Devices by Using an Embedded Interposer: The i2 Board Technology 185
Thomas Gottwald, Christian Roessle, and Alexander Neumann

10 Embedding of Power Electronic Components: The Smart p2 Pack Technology 201
Thomas Gottwald and Christian Roessle

11 Embedded Die in Substrate (Panel-Level) Packaging Technology 217
Tomoko Takahashi and Akio Katsumata

12 Blade: A Chip-First Embedded Technology for Power Packaging 241
Boris Plikat and Thorsten Scharf

13 The Role of Liquid Molding Compounds in the Success of Fan-Out Wafer-Level Packaging Technology 261
Katsushi Kan, Michiyasu Sugahara, and Markus Cichon

14 Advanced Dielectric Materials (Polyimides and Polybenzoxazoles) for Fan-Out Wafer-Level Packaging (FO-WLP) 271
T. Enomoto, J.I. Matthews, and T. Motobe

15 Enabling Low Temperature Cure Dielectrics for Advanced Wafer-Level Packaging 317
Stefan Vanclooster and Dimitri Janssen

16 The Role of Pick and Place in Fan-Out Wafer-Level Packaging 347
Hugo Pristauz, Alastair Attard, and Harald Meixner

17 Process and Equipment for eWLB: Chip Embedding by Molding 371
Edward Furgut, Hirohito Oshimori, and Hiroaki Yamagishi

18 Tools for Fan-Out Wafer-Level Package Processing 403
Nelson Fan, Eric Kuah, Eric Ng, and Otto Cheung

19 Equipment and Process for eWLB: Required PVD/Sputter Solutions 419
Chris Jones, Ricardo Gaio, and Jose Castro

20 Excimer Laser Ablation for the Patterning of Ultra-fine Routings 441
Habib Hichri, Markus Arendt, and Seongkuk Lee

21 Temporary Carrier Technologies for eWLB and RDL-First Fan-Out Wafer-Level Packages 457
Thomas Uhrmann and Boris Považay

22 Encapsulated Wafer-Level Package Technology (eWLCSP): Robust WLCSP Reliability with Sidewall Protection 471
S.W. Yoon

23 Embedded Multi-die Interconnect Bridge (EMIB): A Localized, High Density, High Bandwidth Packaging Interconnect 487
Ravi Mahajan, Robert Sankman, Kemal Aygun, Zhiguo Qian, Ashish Dhall, Jonathan Rosch, Debendra Mallik, and Islam Salama

24 Interconnection Technology Innovations in 2.5D Integrated Electronic Systems 501
Paragkumar A. Thadesar, Paul K. Jo, and Muhannad S. Bakir

References 515

Index 521

Note: Product cover images may vary from those shown
Beth Keser Steffen Kröhnert
Note: Product cover images may vary from those shown