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Advanced IC Packaging Market by Package Type (Ball Grid Array, Flip Chip, Wafer Level Packaging), Packaging Technology (Embedded Die, Fan Out, System In Package), Application, End User, Material, Assembly Process - Global Forecast 2025-2030- Product Image
Advanced IC Packaging Market by Package Type (Ball Grid Array, Flip Chip, Wafer Level Packaging), Packaging Technology (Embedded Die, Fan Out, System In Package), Application, End User, Material, Assembly Process - Global Forecast 2025-2030- Product Image
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Advanced IC Packaging Market by Package Type (Ball Grid Array, Flip Chip, Wafer Level Packaging), Packaging Technology (Embedded Die, Fan Out, System In Package), Application, End User, Material, Assembly Process - Global Forecast 2025-2030

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    Report

  • 193 Pages
  • August 2025
  • Region: Global
  • 360iResearch™
  • ID: 5437795
UP TO OFF until Jan 01st 2026
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Advanced IC packaging is transforming semiconductor performance and system integration across industries. Senior executives are leveraging modern packaging to drive the next phase of electronics innovation while responding to evolving supply chain realities and heightened quality demands.

Market Snapshot: Advanced IC Packaging Market Size and Growth Outlook

The Advanced IC Packaging Market grew from USD 48.51 billion in 2024 to USD 52.76 billion in 2025. This sector is projected to expand at a CAGR of 8.36%, reaching USD 78.57 billion by 2030. Growth is underpinned by escalating requirements for high-density integration, improved device performance, and robust miniaturization, positioning advanced IC packaging as a central catalyst driving semiconductor progress globally.

Scope & Segmentation of the Advanced IC Packaging Market

This report delivers an in-depth analysis across the following dimensions, enabling tailored strategies for business leaders:

  • Package Types: Ball grid array (fine pitch BGA, micro BGA, standard BGA), flip chip, wafer level packaging (fan-in WLP, fan-out WLP), wire bond.
  • Packaging Technologies: Embedded die (embedded die substrate, known good die), fan-out (panel based, wafer based), system in package (chip scale package, multi-chip module), through silicon via (via last, via middle).
  • Applications: Automotive electronics (ADAS, powertrain), consumer electronics (gaming consoles, smart home devices), mobile devices (smartphones, tablets, wearables), telecom infrastructure (5G infrastructure, network equipment).
  • End Users: Foundries, integrated device manufacturers, original equipment manufacturers, outsourced semiconductor assembly and test providers.
  • Materials: Encapsulation, solder ball, substrate, underfill.
  • Assembly Processes: Die preparation, final test, flip chip interconnect, underfill and encapsulation.
  • Regional Coverage: Americas (including United States, Canada, Mexico, Brazil, Argentina), EMEA (United Kingdom, Germany, France, Russia, Italy, Spain, United Arab Emirates, Saudi Arabia, South Africa, and more), Asia-Pacific (China, India, Japan, Australia, South Korea, Indonesia, Thailand, Philippines, Malaysia, Singapore, Vietnam, Taiwan).
  • Leading Companies: ASE Technology Holding Co., Ltd; Amkor Technology, Inc.; Jiangsu Changjiang Electronics Technology Co., Ltd; Siliconware Precision Industries Co., Ltd; Powertech Technology Inc.; Tongfu Microelectronics Co., Ltd; UTAC Holdings Ltd; ChipMOS Technologies Inc.; King Yuan Electronics Co., Ltd; Hana Microelectronics Public Co., Ltd.

Key Takeaways for Senior Decision-Makers

  • Innovation in packaging—moving beyond legacy wire bond and flip chip—enables higher density and more reliable miniaturized devices critical to new markets.
  • Emerging techniques such as fan-in and fan-out wafer-level packaging are meeting demand for smaller form factors and enhanced signal integrity.
  • 2.5D and 3D stacking are driving heterogeneous integration, supporting complex co-existence of memory, logic, and sensor components.
  • Regionalization of supply chains is reshaping provider strategies, with nearshoring and modular operations mitigating delivery risk and tariff exposure.
  • Material innovation and advanced process analytics are enhancing throughput, yield optimization, and sustainability in response to quality and regulatory requirements.
  • Cross-sector partnerships and collaborative R&D accelerate development of features required for markets such as AI, automotive, and next-gen telecom infrastructure.

Impact of United States Tariffs on Advanced IC Packaging Supply Chains

Implementation of US tariffs in 2025 has driven up costs for essential materials and components, prompting companies to reevaluate sourcing and logistics. This shift has catalyzed regional diversification and increased focus on certification and compliance processes, as firms strive to ensure consistent quality and supply stability for mission-critical electronics applications.

Advanced IC Packaging Market Methodology & Data Sources

This report is based on rigorous secondary research, comprehensive primary interviews with senior executives and engineers, and advanced analytical frameworks. Data reliability is reinforced by triangulation, peer review, and validation workshops with industry stakeholders.

Why This Report Matters for Executive Decision-Making

  • Equips leaders with actionable insights to guide investments, risk mitigation, and supply chain design amidst evolving policy and technology landscapes.
  • Enables informed market entry strategies and technology adoption plans grounded in cross-segment and regional intelligence.
  • Supports cross-functional alignment by providing concise and credible evidence for board-level and operational priorities.

Conclusion: Strategic Direction in Advanced IC Packaging

With innovation, policy, and competition reshaping the advanced IC packaging sector, informed strategies and resilient operations are pivotal. This research empowers leaders to drive impactful decisions that sustain growth and competitiveness in the critical semiconductor ecosystem.

 

Additional Product Information:

  • Purchase of this report includes 1 year online access with quarterly updates.
  • This report can be updated on request. Please contact our Customer Experience team using the Ask a Question widget on our website.

Table of Contents

1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary
4. Market Overview
4.1. Introduction
4.2. Market Sizing & Forecasting
5. Market Dynamics
5.1. Integration of fan-out wafer level packaging to support high bandwidth memory and AI processors
5.2. Adoption of silicon interposer and through silicon via technologies for chiplet integration
5.3. Growing investment in 2.5D and 3D heterogeneous integration to meet performance demands
5.4. Shift towards eco-friendly underfill materials and green packaging solutions for sustainability
5.5. Development of advanced thermal management designs to address increasing chip power densities
5.6. Emergence of fan-in wafer level chip scale packaging for cost-effective mobile device applications
5.7. Customization of embedded die packaging processes to optimize form factor in IoT and wearables
6. Market Insights
6.1. Porter’s Five Forces Analysis
6.2. PESTLE Analysis
7. Cumulative Impact of United States Tariffs 2025
8. Advanced IC Packaging Market, by Package Type
8.1. Introduction
8.2. Ball Grid Array
8.2.1. Fine Pitch Bga
8.2.2. Micro Bga
8.2.3. Standard Bga
8.3. Flip Chip
8.4. Wafer Level Packaging
8.4.1. Fan In Wlp
8.4.2. Fan Out Wlp
8.5. Wire Bond
9. Advanced IC Packaging Market, by Packaging Technology
9.1. Introduction
9.2. Embedded Die
9.2.1. Embedded Die Substrate
9.2.2. Known Good Die
9.3. Fan Out
9.3.1. Panel Based Fan Out
9.3.2. Wafer Based Fan Out
9.4. System In Package
9.4.1. Chip Scale Package
9.4.2. Multi Chip Module
9.5. Through Silicon Via
9.5.1. Via Last
9.5.2. Via Middle
10. Advanced IC Packaging Market, by Application
10.1. Introduction
10.2. Automotive Electronics
10.2.1. Adas
10.2.2. Powertrain
10.3. Consumer Electronics
10.3.1. Gaming Consoles
10.3.2. Smart Home Devices
10.4. Mobile Devices
10.4.1. Smartphones
10.4.2. Tablets
10.4.3. Wearables
10.5. Telecom Infrastructure
10.5.1. 5G Infrastructure
10.5.2. Network Equipment
11. Advanced IC Packaging Market, by End User
11.1. Introduction
11.2. Foundries
11.3. Integrated Device Manufacturers
11.4. Original Equipment Manufacturers
11.5. Outsourced Semiconductor Assembly And Test
12. Advanced IC Packaging Market, by Material
12.1. Introduction
12.2. Encapsulation
12.3. Solder Ball
12.4. Substrate
12.5. Underfill
13. Advanced IC Packaging Market, by Assembly Process
13.1. Introduction
13.2. Die Preparation
13.3. Final Test
13.4. Flip Chip Interconnect
13.5. Underfill And Encapsulation
14. Americas Advanced IC Packaging Market
14.1. Introduction
14.2. United States
14.3. Canada
14.4. Mexico
14.5. Brazil
14.6. Argentina
15. Europe, Middle East & Africa Advanced IC Packaging Market
15.1. Introduction
15.2. United Kingdom
15.3. Germany
15.4. France
15.5. Russia
15.6. Italy
15.7. Spain
15.8. United Arab Emirates
15.9. Saudi Arabia
15.10. South Africa
15.11. Denmark
15.12. Netherlands
15.13. Qatar
15.14. Finland
15.15. Sweden
15.16. Nigeria
15.17. Egypt
15.18. Turkey
15.19. Israel
15.20. Norway
15.21. Poland
15.22. Switzerland
16. Asia-Pacific Advanced IC Packaging Market
16.1. Introduction
16.2. China
16.3. India
16.4. Japan
16.5. Australia
16.6. South Korea
16.7. Indonesia
16.8. Thailand
16.9. Philippines
16.10. Malaysia
16.11. Singapore
16.12. Vietnam
16.13. Taiwan
17. Competitive Landscape
17.1. Market Share Analysis, 2024
17.2. FPNV Positioning Matrix, 2024
17.3. Competitive Analysis
17.3.1. ASE Technology Holding Co., Ltd
17.3.2. Amkor Technology, Inc.
17.3.3. Jiangsu Changjiang Electronics Technology Co., Ltd
17.3.4. Siliconware Precision Industries Co., Ltd
17.3.5. Powertech Technology Inc.
17.3.6. Tongfu Microelectronics Co., Ltd
17.3.7. UTAC Holdings Ltd
17.3.8. ChipMOS Technologies Inc.
17.3.9. King Yuan Electronics Co., Ltd
17.3.10. Hana Microelectronics Public Co., Ltd
18. ResearchAI
19. ResearchStatistics
20. ResearchContacts
21. ResearchArticles
22. Appendix
List of Figures
FIGURE 1. ADVANCED IC PACKAGING MARKET RESEARCH PROCESS
FIGURE 2. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
FIGURE 3. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY REGION, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 4. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 5. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2024 VS 2030 (%)
FIGURE 6. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 7. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2024 VS 2030 (%)
FIGURE 8. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 9. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2024 VS 2030 (%)
FIGURE 10. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 11. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2024 VS 2030 (%)
FIGURE 12. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 13. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2024 VS 2030 (%)
FIGURE 14. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 15. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2024 VS 2030 (%)
FIGURE 16. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 17. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2030 (%)
FIGURE 18. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 19. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY STATE, 2024 VS 2030 (%)
FIGURE 20. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY STATE, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 21. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2030 (%)
FIGURE 22. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 23. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2030 (%)
FIGURE 24. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 25. ADVANCED IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2024
FIGURE 26. ADVANCED IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2024
FIGURE 27. ADVANCED IC PACKAGING MARKET: RESEARCHAI
FIGURE 28. ADVANCED IC PACKAGING MARKET: RESEARCHSTATISTICS
FIGURE 29. ADVANCED IC PACKAGING MARKET: RESEARCHCONTACTS
FIGURE 30. ADVANCED IC PACKAGING MARKET: RESEARCHARTICLES
List of Tables
TABLE 1. ADVANCED IC PACKAGING MARKET SEGMENTATION & COVERAGE
TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2024
TABLE 3. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, 2018-2024 (USD MILLION)
TABLE 4. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, 2025-2030 (USD MILLION)
TABLE 5. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY REGION, 2018-2024 (USD MILLION)
TABLE 6. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY REGION, 2025-2030 (USD MILLION)
TABLE 7. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2024 (USD MILLION)
TABLE 8. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2025-2030 (USD MILLION)
TABLE 9. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2024 (USD MILLION)
TABLE 10. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2025-2030 (USD MILLION)
TABLE 11. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, BY REGION, 2018-2024 (USD MILLION)
TABLE 12. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, BY REGION, 2025-2030 (USD MILLION)
TABLE 13. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FINE PITCH BGA, BY REGION, 2018-2024 (USD MILLION)
TABLE 14. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FINE PITCH BGA, BY REGION, 2025-2030 (USD MILLION)
TABLE 15. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY MICRO BGA, BY REGION, 2018-2024 (USD MILLION)
TABLE 16. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY MICRO BGA, BY REGION, 2025-2030 (USD MILLION)
TABLE 17. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY STANDARD BGA, BY REGION, 2018-2024 (USD MILLION)
TABLE 18. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY STANDARD BGA, BY REGION, 2025-2030 (USD MILLION)
TABLE 19. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2024 (USD MILLION)
TABLE 20. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2025-2030 (USD MILLION)
TABLE 21. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FLIP CHIP, BY REGION, 2018-2024 (USD MILLION)
TABLE 22. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FLIP CHIP, BY REGION, 2025-2030 (USD MILLION)
TABLE 23. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, BY REGION, 2018-2024 (USD MILLION)
TABLE 24. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, BY REGION, 2025-2030 (USD MILLION)
TABLE 25. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FAN IN WLP, BY REGION, 2018-2024 (USD MILLION)
TABLE 26. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FAN IN WLP, BY REGION, 2025-2030 (USD MILLION)
TABLE 27. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT WLP, BY REGION, 2018-2024 (USD MILLION)
TABLE 28. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT WLP, BY REGION, 2025-2030 (USD MILLION)
TABLE 29. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2024 (USD MILLION)
TABLE 30. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2025-2030 (USD MILLION)
TABLE 31. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY WIRE BOND, BY REGION, 2018-2024 (USD MILLION)
TABLE 32. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY WIRE BOND, BY REGION, 2025-2030 (USD MILLION)
TABLE 33. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
TABLE 34. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
TABLE 35. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, BY REGION, 2018-2024 (USD MILLION)
TABLE 36. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, BY REGION, 2025-2030 (USD MILLION)
TABLE 37. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE SUBSTRATE, BY REGION, 2018-2024 (USD MILLION)
TABLE 38. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE SUBSTRATE, BY REGION, 2025-2030 (USD MILLION)
TABLE 39. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY KNOWN GOOD DIE, BY REGION, 2018-2024 (USD MILLION)
TABLE 40. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY KNOWN GOOD DIE, BY REGION, 2025-2030 (USD MILLION)
TABLE 41. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2024 (USD MILLION)
TABLE 42. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2025-2030 (USD MILLION)
TABLE 43. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, BY REGION, 2018-2024 (USD MILLION)
TABLE 44. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, BY REGION, 2025-2030 (USD MILLION)
TABLE 45. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY PANEL BASED FAN OUT, BY REGION, 2018-2024 (USD MILLION)
TABLE 46. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY PANEL BASED FAN OUT, BY REGION, 2025-2030 (USD MILLION)
TABLE 47. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY WAFER BASED FAN OUT, BY REGION, 2018-2024 (USD MILLION)
TABLE 48. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY WAFER BASED FAN OUT, BY REGION, 2025-2030 (USD MILLION)
TABLE 49. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2024 (USD MILLION)
TABLE 50. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2025-2030 (USD MILLION)
TABLE 51. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, BY REGION, 2018-2024 (USD MILLION)
TABLE 52. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, BY REGION, 2025-2030 (USD MILLION)
TABLE 53. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY CHIP SCALE PACKAGE, BY REGION, 2018-2024 (USD MILLION)
TABLE 54. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY CHIP SCALE PACKAGE, BY REGION, 2025-2030 (USD MILLION)
TABLE 55. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY MULTI CHIP MODULE, BY REGION, 2018-2024 (USD MILLION)
TABLE 56. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY MULTI CHIP MODULE, BY REGION, 2025-2030 (USD MILLION)
TABLE 57. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2024 (USD MILLION)
TABLE 58. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2025-2030 (USD MILLION)
TABLE 59. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, BY REGION, 2018-2024 (USD MILLION)
TABLE 60. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, BY REGION, 2025-2030 (USD MILLION)
TABLE 61. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY VIA LAST, BY REGION, 2018-2024 (USD MILLION)
TABLE 62. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY VIA LAST, BY REGION, 2025-2030 (USD MILLION)
TABLE 63. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY VIA MIDDLE, BY REGION, 2018-2024 (USD MILLION)
TABLE 64. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY VIA MIDDLE, BY REGION, 2025-2030 (USD MILLION)
TABLE 65. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2024 (USD MILLION)
TABLE 66. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2025-2030 (USD MILLION)
TABLE 67. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
TABLE 68. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
TABLE 69. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, BY REGION, 2018-2024 (USD MILLION)
TABLE 70. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, BY REGION, 2025-2030 (USD MILLION)
TABLE 71. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY ADAS, BY REGION, 2018-2024 (USD MILLION)
TABLE 72. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY ADAS, BY REGION, 2025-2030 (USD MILLION)
TABLE 73. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY POWERTRAIN, BY REGION, 2018-2024 (USD MILLION)
TABLE 74. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY POWERTRAIN, BY REGION, 2025-2030 (USD MILLION)
TABLE 75. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2024 (USD MILLION)
TABLE 76. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2025-2030 (USD MILLION)
TABLE 77. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2024 (USD MILLION)
TABLE 78. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2025-2030 (USD MILLION)
TABLE 79. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY GAMING CONSOLES, BY REGION, 2018-2024 (USD MILLION)
TABLE 80. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY GAMING CONSOLES, BY REGION, 2025-2030 (USD MILLION)
TABLE 81. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY SMART HOME DEVICES, BY REGION, 2018-2024 (USD MILLION)
TABLE 82. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY SMART HOME DEVICES, BY REGION, 2025-2030 (USD MILLION)
TABLE 83. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2024 (USD MILLION)
TABLE 84. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2025-2030 (USD MILLION)
TABLE 85. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, BY REGION, 2018-2024 (USD MILLION)
TABLE 86. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, BY REGION, 2025-2030 (USD MILLION)
TABLE 87. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY SMARTPHONES, BY REGION, 2018-2024 (USD MILLION)
TABLE 88. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY SMARTPHONES, BY REGION, 2025-2030 (USD MILLION)
TABLE 89. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY TABLETS, BY REGION, 2018-2024 (USD MILLION)
TABLE 90. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY TABLETS, BY REGION, 2025-2030 (USD MILLION)
TABLE 91. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY WEARABLES, BY REGION, 2018-2024 (USD MILLION)
TABLE 92. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY WEARABLES, BY REGION, 2025-2030 (USD MILLION)
TABLE 93. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2024 (USD MILLION)
TABLE 94. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2025-2030 (USD MILLION)
TABLE 95. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, BY REGION, 2018-2024 (USD MILLION)
TABLE 96. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, BY REGION, 2025-2030 (USD MILLION)
TABLE 97. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY 5G INFRASTRUCTURE, BY REGION, 2018-2024 (USD MILLION)
TABLE 98. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY 5G INFRASTRUCTURE, BY REGION, 2025-2030 (USD MILLION)
TABLE 99. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY NETWORK EQUIPMENT, BY REGION, 2018-2024 (USD MILLION)
TABLE 100. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY NETWORK EQUIPMENT, BY REGION, 2025-2030 (USD MILLION)
TABLE 101. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2024 (USD MILLION)
TABLE 102. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2025-2030 (USD MILLION)
TABLE 103. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2024 (USD MILLION)
TABLE 104. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2025-2030 (USD MILLION)
TABLE 105. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FOUNDRIES, BY REGION, 2018-2024 (USD MILLION)
TABLE 106. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FOUNDRIES, BY REGION, 2025-2030 (USD MILLION)
TABLE 107. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY INTEGRATED DEVICE MANUFACTURERS, BY REGION, 2018-2024 (USD MILLION)
TABLE 108. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY INTEGRATED DEVICE MANUFACTURERS, BY REGION, 2025-2030 (USD MILLION)
TABLE 109. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY ORIGINAL EQUIPMENT MANUFACTURERS, BY REGION, 2018-2024 (USD MILLION)
TABLE 110. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY ORIGINAL EQUIPMENT MANUFACTURERS, BY REGION, 2025-2030 (USD MILLION)
TABLE 111. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST, BY REGION, 2018-2024 (USD MILLION)
TABLE 112. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST, BY REGION, 2025-2030 (USD MILLION)
TABLE 113. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2024 (USD MILLION)
TABLE 114. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2025-2030 (USD MILLION)
TABLE 115. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY ENCAPSULATION, BY REGION, 2018-2024 (USD MILLION)
TABLE 116. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY ENCAPSULATION, BY REGION, 2025-2030 (USD MILLION)
TABLE 117. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY SOLDER BALL, BY REGION, 2018-2024 (USD MILLION)
TABLE 118. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY SOLDER BALL, BY REGION, 2025-2030 (USD MILLION)
TABLE 119. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY SUBSTRATE, BY REGION, 2018-2024 (USD MILLION)
TABLE 120. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY SUBSTRATE, BY REGION, 2025-2030 (USD MILLION)
TABLE 121. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY UNDERFILL, BY REGION, 2018-2024 (USD MILLION)
TABLE 122. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY UNDERFILL, BY REGION, 2025-2030 (USD MILLION)
TABLE 123. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2018-2024 (USD MILLION)
TABLE 124. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2025-2030 (USD MILLION)
TABLE 125. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY DIE PREPARATION, BY REGION, 2018-2024 (USD MILLION)
TABLE 126. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY DIE PREPARATION, BY REGION, 2025-2030 (USD MILLION)
TABLE 127. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FINAL TEST, BY REGION, 2018-2024 (USD MILLION)
TABLE 128. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FINAL TEST, BY REGION, 2025-2030 (USD MILLION)
TABLE 129. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FLIP CHIP INTERCONNECT, BY REGION, 2018-2024 (USD MILLION)
TABLE 130. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FLIP CHIP INTERCONNECT, BY REGION, 2025-2030 (USD MILLION)
TABLE 131. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY UNDERFILL AND ENCAPSULATION, BY REGION, 2018-2024 (USD MILLION)
TABLE 132. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY UNDERFILL AND ENCAPSULATION, BY REGION, 2025-2030 (USD MILLION)
TABLE 133. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2024 (USD MILLION)
TABLE 134. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2025-2030 (USD MILLION)
TABLE 135. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2024 (USD MILLION)
TABLE 136. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2025-2030 (USD MILLION)
TABLE 137. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2024 (USD MILLION)
TABLE 138. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2025-2030 (USD MILLION)
TABLE 139. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
TABLE 140. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
TABLE 141. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2024 (USD MILLION)
TABLE 142. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2025-2030 (USD MILLION)
TABLE 143. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2024 (USD MILLION)
TABLE 144. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2025-2030 (USD MILLION)
TABLE 145. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2024 (USD MILLION)
TABLE 146. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2025-2030 (USD MILLION)
TABLE 147. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2024 (USD MILLION)
TABLE 148. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2025-2030 (USD MILLION)
TABLE 149. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
TABLE 150. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
TABLE 151. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2024 (USD MILLION)
TABLE 152. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2025-2030 (USD MILLION)
TABLE 153. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2024 (USD MILLION)
TABLE 154. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2025-2030 (USD MILLION)
TABLE 155. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2024 (USD MILLION)
TABLE 156. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2025-2030 (USD MILLION)
TABLE 157. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2024 (USD MILLION)
TABLE 158. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2025-2030 (USD MILLION)
TABLE 159. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2024 (USD MILLION)
TABLE 160. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2025-2030 (USD MILLION)
TABLE 161. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2024 (USD MILLION)
TABLE 162. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2025-2030 (USD MILLION)
TABLE 163. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2018-2024 (USD MILLION)
TABLE 164. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2025-2030 (USD MILLION)
TABLE 165. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2024 (USD MILLION)
TABLE 166. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2025-2030 (USD MILLION)
TABLE 167. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2024 (USD MILLION)
TABLE 168. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2025-2030 (USD MILLION)
TABLE 169. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2024 (USD MILLION)
TABLE 170. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2025-2030 (USD MILLION)
TABLE 171. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2024 (USD MILLION)
TABLE 172. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2025-2030 (USD MILLION)
TABLE 173. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
TABLE 174. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
TABLE 175. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2024 (USD MILLION)
TABLE 176. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2025-2030 (USD MILLION)
TABLE 177. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2024 (USD MILLION)
TABLE 178. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2025-2030 (USD MILLION)
TABLE 179. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2024 (USD MILLION)
TABLE 180. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2025-2030 (USD MILLION)
TABLE 181. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2024 (USD MILLION)
TABLE 182. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2025-2030 (USD MILLION)
TABLE 183. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
TABLE 184. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
TABLE 185. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2024 (USD MILLION)
TABLE 186. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2025-2030 (USD MILLION)
TABLE 187. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2024 (USD MILLION)
TABLE 188. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2025-2030 (USD MILLION)
TABLE 189. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2024 (USD MILLION)
TABLE 190. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2025-2030 (USD MILLION)
TABLE 191. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2024 (USD MILLION)
TABLE 192. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2025-2030 (USD MILLION)
TABLE 193. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2024 (USD MILLION)
TABLE 194. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2025-2030 (USD MILLION)
TABLE 195. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2024 (USD MILLION)
TABLE 196. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2025-2030 (USD MILLION)
TABLE 197. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2018-2024 (USD MILLION)
TABLE 198. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2025-2030 (USD MILLION)
TABLE 199. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY STATE, 2018-2024 (USD MILLION)
TABLE 200. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY STATE, 2025-2030 (USD MILLION)
TABLE 201. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2024 (USD MILLION)
TABLE 202. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2025-2030 (USD MILLION)
TABLE 203. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2024 (USD MILLION)
TABLE 204. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2025-2030 (USD MILLION)
TABLE 205. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2024 (USD MILLION)
TABLE 206. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2025-2030 (USD MILLION)
TABLE 207. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
TABLE 208. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
TABLE 209. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2024 (USD MILLION)
TABLE 210. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2025-2030 (USD MILLION)
TABLE 211. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2024 (USD MILLION)
TABLE 212. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2025-2030 (USD MILLION)
TABLE 213. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2024 (USD MILLION)
TABLE 214. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2025-2030 (USD MILLION)
TABLE 215. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2024 (USD MILLION)
TABLE 216. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2025-2030 (USD MILLION)
TABLE 217. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
TABLE 218. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
TABLE 219. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2024 (USD MILLION)
TABLE 220. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2025-2030 (USD MILLION)
TABLE 221. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2024 (USD MILLION)
TABLE 222. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2025-2030 (USD MILLION)
TABLE 223. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2024 (USD MILLION)
TABLE 224. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2025-2030 (USD MILLION)
TABLE 225. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2024 (USD MILLION)
TABLE 226. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2025-2030 (USD MILLION)
TABLE 227. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2024 (USD MILLION)
TABLE 228. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2025-2030 (USD MILLION)
TABLE 229. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2024 (USD MILLION)
TABLE 230. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2025-2030 (USD MILLION)
TABLE 231. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2018-2024 (USD MILLION)
TABLE 232. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2025-2030 (USD MILLION)
TABLE 233. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2024 (USD MILLION)
TABLE 234. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2025-2030 (USD MILLION)
TABLE 235. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2024 (USD MILLION)
TABLE 236. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2025-2030 (USD MILLION)
TABLE 237. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2024 (USD MILLION)
TABLE 238. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2025-2030 (USD MILLION)
TABLE 239. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
TABLE 240. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
TABLE 241. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2024 (USD MILLION)
TABLE 242. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2025-2030 (USD MILLION)
TABLE 243. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2024 (USD MILLION)
TABLE 244. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2025-2030 (USD MILLION)
TABLE 245. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2024 (USD MILLION)
TABLE 246. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2025-2030 (USD MILLION)
TABLE 247. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2024 (USD MILLION)
TABLE 248. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2025-2030 (USD MILLION)
TABLE 249. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
TABLE 250. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
TABLE 251. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2024 (USD MILLION)
TABLE 252. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2025-2030 (USD MILLION)
TABLE 253. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2024 (USD MILLION)
TABLE 254. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2025-2030 (USD MILLION)
TABLE 255. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2024 (USD MILLION)
TABLE 256. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2025-2030 (USD MILLION)
TABLE 257. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2024 (USD MILLION)
TABLE 258. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2025-2030 (USD MILLION)
TABLE 259. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2024 (USD MILLION)
TABLE 260. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2025-2030 (USD MILLION)
TABLE 261. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2024 (USD MILLION)
TABLE 262. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2025-2030 (USD MILLION)
TABLE 263. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2018-2024 (USD MILLION)
TABLE 264. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2025-2030 (USD MILLION)
TABLE 265. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2024 (USD MILLION)
TABLE 266. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2025-2030 (USD MILLION)
TABLE 267. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2024 (USD MILLION)
TABLE 268. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2025-2030 (USD MILLION)
TABLE 269. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2024 (USD MILLION)
TABLE 270. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2025-2030 (USD MILLION)
TABLE 271. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
TABLE 272. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
TABLE 273. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2024 (USD MILLION)
TABLE 274. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2025-2030 (USD MILLION)
TABLE 275. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2024 (USD MILLION)
TABLE 276. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2025-2030 (USD MILLION)
TABLE 277. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2024 (USD MILLION)
TABLE 278. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2025-2030 (USD MILLION)
TABLE 279. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2024 (USD MILLION)
TABLE 280. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2025-2030 (USD MILLION)
TABLE 281. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
TABLE 282. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
TABLE 283. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2024 (USD MILLION)
TABLE 284. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2025-2030 (USD MILLION)
TABLE 285. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2024 (USD MILLION)
TABLE 286. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2025-2030 (USD MILLION)
TABLE 287. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2024 (USD MILLION)
TABLE 288. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2025-2030 (USD MILLION)
TABLE 289. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2024 (USD MILLION)
TABLE 290. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2025-2030 (USD MILLION)
TABLE 291. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2024 (USD MILLION)
TABLE 292. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2025-2030 (USD MILLION)
TABLE 293. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2024 (USD MILLION)
TABLE 294. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2025-2030 (USD MILLION)
TABLE 295. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2018-2024 (USD MILLION)
TABLE 296. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2025-2030 (USD MILLION)
TABLE 297. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2024 (USD MILLION)
TABLE 298. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2025-2030 (USD MILLION)
TABLE 299. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2024 (USD MILLION)
TABLE 300. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2025-2030 (USD MILLION)
TABLE 301. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2024 (USD MILLION)
TABLE 302. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2025-2030 (USD MILLION)
TABLE 303. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
TABLE 304. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
TABLE 305. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2024 (USD MILLION)
TABLE 306. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2025-2030 (USD MILLION)
TABLE 307. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2024 (USD MILLION)
TABLE 308. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2025-2030 (USD MILLION)
TABLE 309. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2024 (USD MILLION)
TABLE 310. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2025-2030 (USD MILLION)
TABLE 311. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2024 (USD MILLION)
TABLE 312. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2025-2030 (USD MILLION)
TABLE 313. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
TABLE 314. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
TABLE 315. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2024 (USD MILLION)
TABLE 316. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2025-2030 (USD MILLION)
TABLE 317. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2024 (USD MILLION)
TABLE 318. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2025-2030 (USD MILLION)
TABLE 319. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2024 (USD MILLION)
TABLE 320. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2025-2030 (USD MILLION)
TABLE 321. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2024 (USD MILLION)
TABLE 322. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2025-2030 (USD MILLION)
TABLE 323. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2024 (USD MILLION)
TABLE 324. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2025-2030 (USD MILLION)
TABLE 325. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2024 (USD MILLION)
TABLE 326. ARGENTINA ADVANCED

Samples

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Companies Mentioned

The companies profiled in this Advanced IC Packaging market report include:
  • ASE Technology Holding Co., Ltd
  • Amkor Technology, Inc.
  • Jiangsu Changjiang Electronics Technology Co., Ltd
  • Siliconware Precision Industries Co., Ltd
  • Powertech Technology Inc.
  • Tongfu Microelectronics Co., Ltd
  • UTAC Holdings Ltd
  • ChipMOS Technologies Inc.
  • King Yuan Electronics Co., Ltd
  • Hana Microelectronics Public Co., Ltd

Table Information

Report AttributeDetails
No. of Pages193
PublishedAugust 2025
Forecast Period2025 - 2030
Estimated Market Value ( USD ) in 2025 $ 52.76 Billion
Forecasted Market Value ( USD ) by 2030 $ 78.57 Billion
Compound Annual Growth Rate8.3%
Regions CoveredGlobal
No. of Companies Mentioned11

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