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Advanced IC Packaging Market by Package Type, Packaging Technology, Application, End User, Material, Assembly Process - Global Forecast to 2030- Product Image
Advanced IC Packaging Market by Package Type, Packaging Technology, Application, End User, Material, Assembly Process - Global Forecast to 2030- Product Image
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Advanced IC Packaging Market by Package Type, Packaging Technology, Application, End User, Material, Assembly Process - Global Forecast to 2030

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  • 185 Pages
  • May 2025
  • Region: Global
  • 360iResearch™
  • ID: 5437795
UP TO OFF until Dec 31st 2025
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The advanced IC packaging market stands at the nexus of innovation and supply chain strategy, empowering technology leaders to meet rising demands for system integration, power efficiency, and resilience. As industry boundaries blur and technological advancements redefine possibilities, senior decision-makers require actionable intelligence to navigate this complex landscape with precision and agility.

Market Snapshot: Advanced IC Packaging Market

The advanced IC packaging market grew from USD 48.51 billion in 2024 to USD 52.76 billion in 2025. This sector is set to maintain robust expansion, with a forecasted CAGR of 8.36% culminating in USD 78.57 billion by 2030. Ongoing transformation within the global semiconductor value chain, propelled by performance requirements, miniaturization, and the integration of computing and connectivity, keeps driving demand for innovative packaging. The market comprises applications spanning automotive, consumer electronics, mobile devices, and telecom infrastructure, all spurring the adoption of next-generation solutions and shaping supply priorities worldwide.

Scope & Segmentation

  • Package Type: Ball Grid Array (including Fine Pitch BGA, Micro BGA, Standard BGA), Flip Chip, Wafer Level Packaging (Fan In WLP, Fan Out WLP), and Wire Bond.
  • Packaging Technology: Embedded Die (Embedded Die Substrate, Known Good Die), Fan Out (Panel Based, Wafer Based), System in Package (Chip Scale Package, Multi Chip Module), and Through Silicon Via (Via Last, Via Middle).
  • Applications: Automotive Electronics (ADAS, Powertrain), Consumer Electronics (Gaming Consoles, Smart Home Devices), Mobile Devices (Smartphones, Tablets, Wearables), Telecom Infrastructure (5G Infrastructure, Network Equipment).
  • End User: Foundries, Integrated Device Manufacturers, Original Equipment Manufacturers, Outsourced Semiconductor Assembly and Test Partners.
  • Material: Encapsulation, Solder Ball, Substrate, Underfill.
  • Assembly Process: Die Preparation, Final Test, Flip Chip Interconnect, Underfill and Encapsulation.
  • Geographic Coverage: Americas (including major U.S. states, Canada, Mexico, Brazil, Argentina), Europe, Middle East & Africa (including United Kingdom, Germany, France, and additional countries), Asia-Pacific (China, India, Japan, South Korea, and others).
  • Leading Companies: ASE Technology Holding Co., Ltd, Amkor Technology, Inc., Jiangsu Changjiang Electronics Technology Co., Ltd, Siliconware Precision Industries Co., Ltd, Powertech Technology Inc., Tongfu Microelectronics Co., Ltd, UTAC Holdings Ltd, ChipMOS Technologies Inc., King Yuan Electronics Co., Ltd, Hana Microelectronics Public Co., Ltd.

Key Takeaways for Decision-Makers

  • Advanced IC packaging is a primary enabler for heterogeneous integration, supporting the convergence of logic, memory, and RF components within single solutions.
  • Investment is accelerating in fan-out wafer-level packaging, through-silicon via technologies, and next-generation substrate materials to meet customer demands for miniaturization and performance gains.
  • Shifting industry priorities emphasize supply chain resilience, prompting diversification of manufacturing and strategic material sourcing to address geopolitical risks.
  • Automotive, mobile, and telecom segments are driving differentiated requirements, from ruggedized designs to high-density interconnects and compact form factors for edge and consumer devices.
  • Collaboration is intensifying across the value chain, with foundries, OSATs, and material suppliers forming alliances to align technology development with emerging market needs.

Tariff Impact and Strategic Response

Recent U.S. tariffs have introduced varied pressures on the advanced IC packaging sector. Increased duties on substrate imports elevated costs for upstream suppliers, motivating capacity shifts to regions unaffected by these measures. Stakeholders are reconfiguring global manufacturing to maintain pricing stability and secure competitive margins. In downstream markets, firms have adjusted product timelines, emphasizing upgrades over complete redesign to sustain profit structures. Flexible manufacturing and vertically integrated supply chains remain crucial competitive advantages under evolving trade policies.

Methodology & Data Sources

The findings in this report are built on a foundation of rigorous primary and secondary research. Industry executive and engineer interviews, combined with deep analysis of public patents, regulatory filings, and corporate disclosures, form the basis for qualitative and quantitative insights. Data from trade publications, industry associations, and customs records were triangulated and validated through peer review to ensure robust and actionable conclusions.

Why This Report Matters

  • Enables senior leaders to anticipate technology shifts and allocate resources by providing in-depth segmentation and regional analysis.
  • Supports risk mitigation and strategy formation through detailed assessments of supply chain resilience, material sourcing, and the impact of tariffs.
  • Guides investment and partnership decisions, underpinned by transparent methodologies and firsthand expert perspectives.

Conclusion

The advanced IC packaging market is evolving rapidly, shaped by application demands, supply chain realignment, and global innovation. This report delivers the clarity and strategic context needed for confident, future-oriented decision-making in a dynamic industry.

 

Additional Product Information:

  • Purchase of this report includes 1 year online access with quarterly updates.
  • This report can be updated on request. Please contact our Customer Experience team using the Ask a Question widget on our website.

Table of Contents

1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary
4. Market Overview
4.1. Introduction
4.2. Market Sizing & Forecasting
5. Market Dynamics
6. Market Insights
6.1. Porter’s Five Forces Analysis
6.2. PESTLE Analysis
7. Cumulative Impact of United States Tariffs 2025
8. Advanced IC Packaging Market, by Package Type
8.1. Introduction
8.2. Ball Grid Array
8.2.1. Fine Pitch Bga
8.2.2. Micro Bga
8.2.3. Standard Bga
8.3. Flip Chip
8.4. Wafer Level Packaging
8.4.1. Fan In Wlp
8.4.2. Fan Out Wlp
8.5. Wire Bond
9. Advanced IC Packaging Market, by Packaging Technology
9.1. Introduction
9.2. Embedded Die
9.2.1. Embedded Die Substrate
9.2.2. Known Good Die
9.3. Fan Out
9.3.1. Panel Based Fan Out
9.3.2. Wafer Based Fan Out
9.4. System In Package
9.4.1. Chip Scale Package
9.4.2. Multi Chip Module
9.5. Through Silicon Via
9.5.1. Via Last
9.5.2. Via Middle
10. Advanced IC Packaging Market, by Application
10.1. Introduction
10.2. Automotive Electronics
10.2.1. Adas
10.2.2. Powertrain
10.3. Consumer Electronics
10.3.1. Gaming Consoles
10.3.2. Smart Home Devices
10.4. Mobile Devices
10.4.1. Smartphones
10.4.2. Tablets
10.4.3. Wearables
10.5. Telecom Infrastructure
10.5.1. 5G Infrastructure
10.5.2. Network Equipment
11. Advanced IC Packaging Market, by End User
11.1. Introduction
11.2. Foundries
11.3. Integrated Device Manufacturers
11.4. Original Equipment Manufacturers
11.5. Outsourced Semiconductor Assembly And Test
12. Advanced IC Packaging Market, by Material
12.1. Introduction
12.2. Encapsulation
12.3. Solder Ball
12.4. Substrate
12.5. Underfill
13. Advanced IC Packaging Market, by Assembly Process
13.1. Introduction
13.2. Die Preparation
13.3. Final Test
13.4. Flip Chip Interconnect
13.5. Underfill And Encapsulation
14. Americas Advanced IC Packaging Market
14.1. Introduction
14.2. United States
14.3. Canada
14.4. Mexico
14.5. Brazil
14.6. Argentina
15. Europe, Middle East & Africa Advanced IC Packaging Market
15.1. Introduction
15.2. United Kingdom
15.3. Germany
15.4. France
15.5. Russia
15.6. Italy
15.7. Spain
15.8. United Arab Emirates
15.9. Saudi Arabia
15.10. South Africa
15.11. Denmark
15.12. Netherlands
15.13. Qatar
15.14. Finland
15.15. Sweden
15.16. Nigeria
15.17. Egypt
15.18. Turkey
15.19. Israel
15.20. Norway
15.21. Poland
15.22. Switzerland
16. Asia-Pacific Advanced IC Packaging Market
16.1. Introduction
16.2. China
16.3. India
16.4. Japan
16.5. Australia
16.6. South Korea
16.7. Indonesia
16.8. Thailand
16.9. Philippines
16.10. Malaysia
16.11. Singapore
16.12. Vietnam
16.13. Taiwan
17. Competitive Landscape
17.1. Market Share Analysis, 2024
17.2. FPNV Positioning Matrix, 2024
17.3. Competitive Analysis
17.3.1. ASE Technology Holding Co., Ltd
17.3.2. Amkor Technology, Inc.
17.3.3. Jiangsu Changjiang Electronics Technology Co., Ltd
17.3.4. Siliconware Precision Industries Co., Ltd
17.3.5. Powertech Technology Inc.
17.3.6. Tongfu Microelectronics Co., Ltd
17.3.7. UTAC Holdings Ltd
17.3.8. ChipMOS Technologies Inc.
17.3.9. King Yuan Electronics Co., Ltd
17.3.10. Hana Microelectronics Public Co., Ltd
18. ResearchAI
19. ResearchStatistics
20. ResearchContacts
21. ResearchArticles
22. Appendix
List of Figures
FIGURE 1. ADVANCED IC PACKAGING MARKET MULTI-CURRENCY
FIGURE 2. ADVANCED IC PACKAGING MARKET MULTI-LANGUAGE
FIGURE 3. ADVANCED IC PACKAGING MARKET RESEARCH PROCESS
FIGURE 4. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
FIGURE 5. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY REGION, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 6. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 7. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2024 VS 2030 (%)
FIGURE 8. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 9. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2024 VS 2030 (%)
FIGURE 10. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 11. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2024 VS 2030 (%)
FIGURE 12. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 13. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2024 VS 2030 (%)
FIGURE 14. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 15. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2024 VS 2030 (%)
FIGURE 16. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 17. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2024 VS 2030 (%)
FIGURE 18. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 19. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2030 (%)
FIGURE 20. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 21. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY STATE, 2024 VS 2030 (%)
FIGURE 22. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY STATE, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 23. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2030 (%)
FIGURE 24. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 25. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2030 (%)
FIGURE 26. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 27. ADVANCED IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2024
FIGURE 28. ADVANCED IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2024
List of Tables
TABLE 1. ADVANCED IC PACKAGING MARKET SEGMENTATION & COVERAGE
TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2024
TABLE 3. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
TABLE 4. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
TABLE 5. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
TABLE 6. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2030 (USD MILLION)
TABLE 7. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, BY REGION, 2018-2030 (USD MILLION)
TABLE 8. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FINE PITCH BGA, BY REGION, 2018-2030 (USD MILLION)
TABLE 9. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY MICRO BGA, BY REGION, 2018-2030 (USD MILLION)
TABLE 10. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY STANDARD BGA, BY REGION, 2018-2030 (USD MILLION)
TABLE 11. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2030 (USD MILLION)
TABLE 12. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FLIP CHIP, BY REGION, 2018-2030 (USD MILLION)
TABLE 13. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, BY REGION, 2018-2030 (USD MILLION)
TABLE 14. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FAN IN WLP, BY REGION, 2018-2030 (USD MILLION)
TABLE 15. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT WLP, BY REGION, 2018-2030 (USD MILLION)
TABLE 16. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2030 (USD MILLION)
TABLE 17. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY WIRE BOND, BY REGION, 2018-2030 (USD MILLION)
TABLE 18. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 19. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, BY REGION, 2018-2030 (USD MILLION)
TABLE 20. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE SUBSTRATE, BY REGION, 2018-2030 (USD MILLION)
TABLE 21. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY KNOWN GOOD DIE, BY REGION, 2018-2030 (USD MILLION)
TABLE 22. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2030 (USD MILLION)
TABLE 23. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, BY REGION, 2018-2030 (USD MILLION)
TABLE 24. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY PANEL BASED FAN OUT, BY REGION, 2018-2030 (USD MILLION)
TABLE 25. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY WAFER BASED FAN OUT, BY REGION, 2018-2030 (USD MILLION)
TABLE 26. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2030 (USD MILLION)
TABLE 27. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, BY REGION, 2018-2030 (USD MILLION)
TABLE 28. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY CHIP SCALE PACKAGE, BY REGION, 2018-2030 (USD MILLION)
TABLE 29. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY MULTI CHIP MODULE, BY REGION, 2018-2030 (USD MILLION)
TABLE 30. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2030 (USD MILLION)
TABLE 31. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, BY REGION, 2018-2030 (USD MILLION)
TABLE 32. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY VIA LAST, BY REGION, 2018-2030 (USD MILLION)
TABLE 33. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY VIA MIDDLE, BY REGION, 2018-2030 (USD MILLION)
TABLE 34. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2030 (USD MILLION)
TABLE 35. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 36. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
TABLE 37. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY ADAS, BY REGION, 2018-2030 (USD MILLION)
TABLE 38. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY POWERTRAIN, BY REGION, 2018-2030 (USD MILLION)
TABLE 39. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 40. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
TABLE 41. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY GAMING CONSOLES, BY REGION, 2018-2030 (USD MILLION)
TABLE 42. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY SMART HOME DEVICES, BY REGION, 2018-2030 (USD MILLION)
TABLE 43. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 44. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, BY REGION, 2018-2030 (USD MILLION)
TABLE 45. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY SMARTPHONES, BY REGION, 2018-2030 (USD MILLION)
TABLE 46. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY TABLETS, BY REGION, 2018-2030 (USD MILLION)
TABLE 47. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY WEARABLES, BY REGION, 2018-2030 (USD MILLION)
TABLE 48. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2030 (USD MILLION)
TABLE 49. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, BY REGION, 2018-2030 (USD MILLION)
TABLE 50. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY 5G INFRASTRUCTURE, BY REGION, 2018-2030 (USD MILLION)
TABLE 51. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY NETWORK EQUIPMENT, BY REGION, 2018-2030 (USD MILLION)
TABLE 52. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2030 (USD MILLION)
TABLE 53. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 54. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FOUNDRIES, BY REGION, 2018-2030 (USD MILLION)
TABLE 55. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY INTEGRATED DEVICE MANUFACTURERS, BY REGION, 2018-2030 (USD MILLION)
TABLE 56. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY ORIGINAL EQUIPMENT MANUFACTURERS, BY REGION, 2018-2030 (USD MILLION)
TABLE 57. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST, BY REGION, 2018-2030 (USD MILLION)
TABLE 58. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 59. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY ENCAPSULATION, BY REGION, 2018-2030 (USD MILLION)
TABLE 60. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY SOLDER BALL, BY REGION, 2018-2030 (USD MILLION)
TABLE 61. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY SUBSTRATE, BY REGION, 2018-2030 (USD MILLION)
TABLE 62. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY UNDERFILL, BY REGION, 2018-2030 (USD MILLION)
TABLE 63. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2018-2030 (USD MILLION)
TABLE 64. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY DIE PREPARATION, BY REGION, 2018-2030 (USD MILLION)
TABLE 65. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FINAL TEST, BY REGION, 2018-2030 (USD MILLION)
TABLE 66. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FLIP CHIP INTERCONNECT, BY REGION, 2018-2030 (USD MILLION)
TABLE 67. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY UNDERFILL AND ENCAPSULATION, BY REGION, 2018-2030 (USD MILLION)
TABLE 68. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2030 (USD MILLION)
TABLE 69. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2030 (USD MILLION)
TABLE 70. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2030 (USD MILLION)
TABLE 71. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 72. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2030 (USD MILLION)
TABLE 73. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2030 (USD MILLION)
TABLE 74. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2030 (USD MILLION)
TABLE 75. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2030 (USD MILLION)
TABLE 76. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 77. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 78. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 79. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2030 (USD MILLION)
TABLE 80. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2030 (USD MILLION)
TABLE 81. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 82. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 83. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2018-2030 (USD MILLION)
TABLE 84. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
TABLE 85. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2030 (USD MILLION)
TABLE 86. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2030 (USD MILLION)
TABLE 87. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2030 (USD MILLION)
TABLE 88. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 89. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2030 (USD MILLION)
TABLE 90. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2030 (USD MILLION)
TABLE 91. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2030 (USD MILLION)
TABLE 92. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2030 (USD MILLION)
TABLE 93. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 94. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 95. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 96. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2030 (USD MILLION)
TABLE 97. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2030 (USD MILLION)
TABLE 98. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 99. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 100. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2018-2030 (USD MILLION)
TABLE 101. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
TABLE 102. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2030 (USD MILLION)
TABLE 103. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2030 (USD MILLION)
TABLE 104. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2030 (USD MILLION)
TABLE 105. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 106. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2030 (USD MILLION)
TABLE 107. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2030 (USD MILLION)
TABLE 108. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2030 (USD MILLION)
TABLE 109. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2030 (USD MILLION)
TABLE 110. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 111. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 112. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 113. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2030 (USD MILLION)
TABLE 114. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2030 (USD MILLION)
TABLE 115. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 116. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 117. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2018-2030 (USD MILLION)
TABLE 118. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2030 (USD MILLION)
TABLE 119. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2030 (USD MILLION)
TABLE 120. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2030 (USD MILLION)
TABLE 121. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 122. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2030 (USD MILLION)
TABLE 123. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2030 (USD MILLION)
TABLE 124. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2030 (USD MILLION)
TABLE 125. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2030 (USD MILLION)
TABLE 126. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 127. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 128. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 129. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2030 (USD MILLION)
TABLE 130. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2030 (USD MILLION)
TABLE 131. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 132. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 133. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2018-2030 (USD MILLION)
TABLE 134. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2030 (USD MILLION)
TABLE 135. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2030 (USD MILLION)
TABLE 136. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2030 (USD MILLION)
TABLE 137. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 138. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2030 (USD MILLION)
TABLE 139. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2030 (USD MILLION)
TABLE 140. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2030 (USD MILLION)
TABLE 141. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2030 (USD MILLION)
TABLE 142. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 143. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 144. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 145. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2030 (USD MILLION)
TABLE 146. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2030 (USD MILLION)
TABLE 147. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 148. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 149. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2018-2030 (USD MILLION)
TABLE 150. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2030 (USD MILLION)
TABLE 151. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2030 (USD MILLION)
TABLE 152. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2030 (USD MILLION)
TABLE 153. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 154. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2030 (USD MILLION)
TABLE 155. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2030 (USD MILLION)
TABLE 156. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2030 (USD MILLION)
TABLE 157. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2030 (USD MILLION)
TABLE 158. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 159. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 160. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 161. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2030 (USD MILLION)
TABLE 162. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2030 (USD MILLION)
TABLE 163. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 164. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 165. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2018-2030 (USD MILLION)
TABLE 166. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2030 (USD MILLION)
TABLE 167. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2030 (USD MILLION)
TABLE 168. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2030 (USD MILLION)
TABLE 169. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 170. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2030 (USD MILLION)
TABLE 171. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2030 (USD MILLION)
TABLE 172. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2030 (USD MILLION)
TABLE 173. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2030 (USD MILLION)
TABLE 174. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 175. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 176. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 177. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2030 (USD MILLION)
TABLE 178. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2030 (USD MILLION)
TABLE 179. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 180. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 181. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2018-2030 (USD MILLION)
TABLE 182. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
TABLE 183. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2030 (USD MILLION)
TABLE 184. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2030 (USD MILLION)
TABLE 185. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2030 (USD MILLION)
TABLE 186. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 187. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2030 (USD MILLION)
TABLE 188. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2030 (USD MILLION)
TABLE 189. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2030 (USD MILLION)
TABLE 190. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2030 (USD MILLION)
TABLE 191. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 192. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 193. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 194. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2030 (USD MILLION)
TABLE 195. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2030 (USD MILLION)
TABLE 196. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 197. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 198. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2018-2030 (USD MILLION)
TABLE 199. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2030 (USD MILLION)
TABLE 200. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2030 (USD MILLION)
TABLE 201. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2030 (USD MILLION)
TABLE 202. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 203. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2030 (USD MILLION)
TABLE 204. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2030 (USD MILLION)
TABLE 205. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2030 (USD MILLION)
TABLE 206. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2030 (USD MILLION)
TABLE 207. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 208. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 209. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 210. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2030 (USD MILLION)
TABLE 211. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2030 (USD MILLION)
TABLE 212. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 213. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 214. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2018-2030 (USD MILLION)
TABLE 215. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2030 (USD MILLION)
TABLE 216. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2030 (USD MILLION)
TABLE 217. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2030 (USD MILLION)
TABLE 218. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 219. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2030 (USD MILLION)
TABLE 220. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2030 (USD MILLION)
TABLE 221. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2030 (USD MILLION)
TABLE 222. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2030 (USD MILLION)
TABLE 223. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 224. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 225. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 226. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2030 (USD MILLION)
TABLE 227. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2030 (USD MILLION)
TABLE 228. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 229. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 230. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2018-2030 (USD MILLION)
TABLE 231. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2030 (USD MILLION)
TABLE 232. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2030 (USD MILLION)
TABLE 233. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2030 (USD MILLION)
TABLE 234. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 235. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2030 (USD MILLION)
TABLE 236. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2030 (USD MILLION)
TABLE 237. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2030 (USD MILLION)
TABLE 238. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2030 (USD MILLION)
TABLE 239. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 240. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 241. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 242. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2030 (USD MILLION)
TABLE 243. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2030 (USD MILLION)
TABLE 244. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 245. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 246. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2018-2030 (USD MILLION)
TABLE 247. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2030 (USD MILLION)
TABLE 248. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2030 (USD MILLION)
TABLE 249. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2030 (USD MILLION)
TABLE 250. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 251. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2030 (USD MILLION)
TABLE 252. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2030 (USD MILLION)
TABLE 253. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2030 (USD MILLION)
TABLE 254. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2030 (USD MILLION)
TABLE 255. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 256. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 257. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 258. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2030 (USD MILLION)
TABLE 259. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2030 (USD MILLION)
TABLE 260. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 261. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 262. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2018-2030 (USD MILLION)
TABLE 263. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2030 (USD MILLION)
TABLE 264. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2030 (USD MILLION)
TABLE 265. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2030 (USD MILLION)
TABLE 266. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 267. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2030 (USD MILLION)
TABLE 268. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2030 (USD MILLION)
TABLE 269. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2030 (USD MILLION)
TABLE 270. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2030 (USD MILLION)
TABLE 271. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 272. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 273. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 274. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2030 (USD MILLION)
TABLE 275. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2030 (USD MILLION)
TABLE 276. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 277. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 278. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2018-2030 (USD MILLION)
TABLE 279. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2030 (USD MILLION)
TABLE 280. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2030 (USD MILLION)
TABLE 281. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2030 (USD MILLION)
TABLE 282. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 283. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2030 (USD MILLION)
TABLE 284. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2030 (USD MILLION)
TABLE 285. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2030 (USD MILLION)
TABLE 286. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2030 (USD MILLION)
TABLE 287. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 288. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 289. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 290. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2030 (USD MILLION)
TABLE 291. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2030 (USD MILLION)
TABLE 292. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 293. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 294. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2018-2030 (USD MILLION)
TABLE 295. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2030 (USD MILLION)
TABLE 296. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2030 (USD MILLION)
TABLE 297. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2030 (USD MILLION)
TABLE 298. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 299. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2030 (USD MILLION)
TABLE 300. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2030 (USD MILLION)
TABLE 301. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2030 (USD MILLION)
TABLE 302. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2030 (USD MILLION)
TABLE 303. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 304. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 305. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 306. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2030 (USD MILLION)
TABLE 307. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2030 (USD MILLION)
TABLE 308. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
TABLE 309. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 310. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY ASSEMBLY PROCESS, 2018-2030 (USD MILLION)
TABLE 311. SOUTH AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2030 (USD MILLION)
TABLE 312. SOUTH AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2030 (USD MILLION)
TABLE 313. SOUTH AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, 2018-2030 (USD MILLION)
TABLE 314. SOUTH AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 315. SOUTH AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY EMBEDDED DIE, 2018-2030 (USD MILLION)
TABLE 316. SOUTH AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT, 2018-2030 (USD MILLION)
TABLE 317. SOUTH AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2030 (USD MILLION)
TABLE 318. SOUTH AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, 2018-2030 (USD MILLION)
TABLE 319. SOUTH AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 320. SOUTH AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 321. SOUTH AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 322. SOUTH AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY MOBILE DEVICES, 2018-2030 (USD MILLION)
TABLE 323. SOUTH AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY TELECOM INFRASTRUCTURE, 2018-2030 (U

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Companies Mentioned

The companies profiled in this Advanced IC Packaging market report include:
  • ASE Technology Holding Co., Ltd
  • Amkor Technology, Inc.
  • Jiangsu Changjiang Electronics Technology Co., Ltd
  • Siliconware Precision Industries Co., Ltd
  • Powertech Technology Inc.
  • Tongfu Microelectronics Co., Ltd
  • UTAC Holdings Ltd
  • ChipMOS Technologies Inc.
  • King Yuan Electronics Co., Ltd
  • Hana Microelectronics Public Co., Ltd

Table Information

Report AttributeDetails
No. of Pages185
PublishedMay 2025
Forecast Period2025 - 2030
Estimated Market Value ( USD ) in 2025 $ 52.76 Billion
Forecasted Market Value ( USD ) by 2030 $ 78.57 Billion
Compound Annual Growth Rate8.3%
Regions CoveredGlobal
No. of Companies Mentioned11

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