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3D IC and 2.5D IC Packaging: Global Strategic Business Report

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    Report

  • 79 Pages
  • April 2024
  • Region: Global
  • Global Industry Analysts, Inc
  • ID: 5301798

Global 3D IC and 2.5D IC Packaging Market to Reach $6.4 Billion by 2030

The global market for 3D IC and 2.5D IC Packaging estimated at US$3.3 Billion in the year 2022, is projected to reach a revised size of US$6.4 Billion by 2030, growing at a CAGR of 8.7% over the analysis period 2022-2030. 3D Wafer-level Chip-Scale Packaging, one of the segments analyzed in the report, is projected to record a 8.7% CAGR and reach US$2.8 Billion by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the 3D TSV segment is readjusted to a revised 9.4% CAGR for the next 8-year period.

The U.S. Market is Estimated at $955 Million, While China is Forecast to Grow at 8.2% CAGR

The 3D IC and 2.5D IC Packaging market in the U.S. is estimated at US$955 Million in the year 2022. China, the world's second largest economy, is forecast to reach a projected market size of US$1.1 Billion by the year 2030 trailing a CAGR of 8.2% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 7.8% and 7.2% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 6.7% CAGR.

Select Competitors (Total 13 Featured) -

  • Amkor Technology: ASE Group
  • Broadcom Ltd.
  • Intel Corporation
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • Samsung Electronics Co., Ltd.
  • Stmicroelectronics Nv
  • Taiwan Semiconductor Manufacturing Company Limited
  • Toshiba Corp.
  • United Microelectronics Corp.

What's New?

  • Special coverage on Russia-Ukraine war; global inflation; easing of zero-Covid policy in China and its `bumpy` reopening; supply chain disruptions, global trade tensions; and risk of recession.
  • Global competitiveness and key competitor percentage market shares
  • Market presence across multiple geographies - Strong/Active/Niche/Trivial
  • Online interactive peer-to-peer collaborative bespoke updates
  • Access to digital archives and Research Platform
  • Complimentary updates for one year

Table of Contents

I. METHODOLOGYII. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
  • Impact of Covid-19 and a Looming Global Recession
  • Influencer Market Insights
  • World Market Trajectories
  • 3D IC and 2.5D IC Packaging - Global Key Competitors Percentage Market Share in 2022 (E)
  • 3D IC and 2.5D IC Packaging Competitor Market Share Scenario Worldwide (in %): 2018E
  • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2022 (E)
2. FOCUS ON SELECT PLAYERS3. MARKET TRENDS & DRIVERS
4. GLOBAL MARKET PERSPECTIVE
TABLE 1: World 3D IC and 2.5D IC Packaging Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
TABLE 2: World Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
TABLE 3: World Historic Review for 3D IC and 2.5D IC Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
TABLE 4: World 16-Year Perspective for 3D IC and 2.5D IC Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2014, 2023 & 2030
TABLE 5: World Recent Past, Current & Future Analysis for 3D Wafer-level Chip-Scale Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
TABLE 6: World Historic Review for 3D Wafer-level Chip-Scale Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
TABLE 7: World 16-Year Perspective for 3D Wafer-level Chip-Scale Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
TABLE 8: World Recent Past, Current & Future Analysis for 3D TSV by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
TABLE 9: World Historic Review for 3D TSV by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
TABLE 10: World 16-Year Perspective for 3D TSV by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
TABLE 11: World Recent Past, Current & Future Analysis for 2.5D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
TABLE 12: World Historic Review for 2.5D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
TABLE 13: World 16-Year Perspective for 2.5D by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
TABLE 14: World Recent Past, Current & Future Analysis for Logic by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
TABLE 15: World Historic Review for Logic by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
TABLE 16: World 16-Year Perspective for Logic by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
TABLE 17: World Recent Past, Current & Future Analysis for Imaging & Optoelectronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
TABLE 18: World Historic Review for Imaging & Optoelectronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
TABLE 19: World 16-Year Perspective for Imaging & Optoelectronics by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
TABLE 20: World Recent Past, Current & Future Analysis for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
TABLE 21: World Historic Review for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
TABLE 22: World 16-Year Perspective for Memory by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
TABLE 23: World Recent Past, Current & Future Analysis for MEMS / Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
TABLE 24: World Historic Review for MEMS / Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
TABLE 25: World 16-Year Perspective for MEMS / Sensors by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
TABLE 26: World Recent Past, Current & Future Analysis for LED by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
TABLE 27: World Historic Review for LED by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
TABLE 28: World 16-Year Perspective for LED by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
TABLE 29: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
TABLE 30: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
TABLE 31: World 16-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
TABLE 32: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
TABLE 33: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
TABLE 34: World 16-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
TABLE 35: World Recent Past, Current & Future Analysis for Telecommunication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
TABLE 36: World Historic Review for Telecommunication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
TABLE 37: World 16-Year Perspective for Telecommunication by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
TABLE 38: World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
TABLE 39: World Historic Review for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
TABLE 40: World 16-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
TABLE 41: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
TABLE 42: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
TABLE 43: World 16-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
TABLE 44: World Recent Past, Current & Future Analysis for Smart Technologies by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
TABLE 45: World Historic Review for Smart Technologies by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
TABLE 46: World 16-Year Perspective for Smart Technologies by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
TABLE 47: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2022 through 2030 and % CAGR
TABLE 48: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2021 and % CAGR
TABLE 49: World 16-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
III. MARKET ANALYSIS
UNITED STATES
  • Market Facts & Figures
  • US 3D IC and 2.5D IC Packaging Market Share (in %) by Company: 2018 & 2027
  • 3D Wafer-level Chip-Scale Packaging (Packaging Technology) Market Share Analysis (in %) of Leading Players in the US for 2018 & 2027
  • 3D TSV (Packaging Technology) Competitor Revenue Share (in %) in the US: 2018 & 2027
  • 2.5D (Packaging Technology) Market Share Breakdown (in %) of Major Players in the US: 2018 & 2027
  • 3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2023 (E)
  • Market Analytics
CANADA
JAPAN
  • 3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2023 (E)
CHINA
  • 3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2023 (E)
EUROPE
  • Market Facts & Figures
  • European 3D IC and 2.5D IC Packaging Market: Competitor Market Share Scenario (in %) for 2018 & 2027
  • 3D Wafer-level Chip-Scale Packaging (Packaging Technology) Market Share (in %) by Company in Europe: 2018 & 2027
  • 3D TSV (Packaging Technology) Market Share (in %) of Major Players in Europe: 2018 & 2027
  • 2.5D (Packaging Technology) Competitor Market Share Analysis (in %) in Europe: 2018 & 2027
  • 3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2023 (E)
  • Market Analytics
FRANCE
  • 3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2023 (E)
GERMANY
  • 3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2023 (E)
ITALY
UNITED KINGDOM
  • 3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2023 (E)
REST OF EUROPE
ASIA-PACIFIC
  • 3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2023 (E)
REST OF WORLD
IV. COMPETITION

Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

  • Amkor Technology: ASE Group
  • Broadcom Ltd.
  • Intel Corporation
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • Samsung Electronics Co., Ltd.
  • Stmicroelectronics Nv
  • Taiwan Semiconductor Manufacturing Company Limited
  • Toshiba Corp.
  • United Microelectronics Corp.

Table Information