+353-1-416-8900REST OF WORLD
+44-20-3973-8888REST OF WORLD
1-917-300-0470EAST COAST U.S
1-800-526-8630U.S. (TOLL FREE)
Sale

Asia Pacific Embedded Die Packaging Technology Market Forecast to 2028 - COVID-19 Impact and Regional Analysis by Platform, Application, and Industry

  • PDF Icon

    Report

  • May 2021
  • Region: Asia Pacific
  • The Insight Partners
  • ID: 5331700
UP TO OFF until Jan 15th 2023
The APAC embedded die packaging technology market is expected to grow from US$ 32,019.28 thousand in 2020 to US$ 1,21,957.05 thousand by 2028; it is estimated to grow at a CAGR of 18.5 % from 2021 to 2028. Mounting adoption of wearable devices and internet of things is expected to accelerate the APAC embedded die packaging technology market. In the era of digitalization and the Internet of Things (IoT), the embedded die packaging technology is also offering advanced electronic devices for consumers. Consumer inclination toward smartwatches and IoT devices is likely to propel the APAC embedded die packaging technology market growth. Some of the market players across APAC region are introducing advanced wearable electronic gadgets for customers. The new features in smart wearables, such as health monitoring, activity monitoring, and internet connectivity, are improving through embedded die packaging technology. For instance, Apple Watch 4 series implemented the embedded die packaging technology to design a small form factor-based structure. Such adoption of embedded die packaging technology in wearables through embedded die packaging technology is supposed to fuel the APAC market growth in the coming years. Besides, the emergence of smart devices based on IoT technology is creating a scope for embedded die packaging technology across APAC region, to achieve smart assistant, smart hearables, companion robot, smart camera, smart speaker, and other features, which will drive the growth of the APAC embedded die packaging technology market.





The outbreak of COVID-19 has severely affected countries across the world. Countries such as China, India, South Korea, and Japan are moving toward new networking solutions such as 5G, 4G, and VoLTE. China and India are the most prominent manufacturing hub in the region and have an enhanced focus on industrialization. The growth of the manufacturing industry has been hampered due to lockdown but soon recovered the development by enhancing the production capabilities in the second half of the year. The demand for advanced electronics such as a smartwatch, smart wearables, and healthcare machines has increased significantly. Also, companies in the Asian region have restructured their capabilities by adopting various strategies such as automation, partnership, and acquisition. For instance, in 2020, Schweizer Electronic AG formed sales representative agreement with Varikorea Co., Ltd to promote SCHWEIZER’s high-tech printed circuit boards and embedding solutions in South Korea
Based on industry, the consumer electronics segment led the APAC embedded die packaging technology market in 2020. Rising disposable income and increasing tech-savvy population are boosting the adoption of advanced and compact consumer electronics, thereby augmenting the demand for embedded die packaging technology. The advent of compact smart wearables is further enhancing the demand for microelectronics. Embedded die packaging technology allows packaging of a maximum number of components on a single die with limited space to support the miniaturization of electronic devices. The technology offers various benefits, such as shrinking the size and lowering the cost of the electronic devices. Embedded die technology is being used in most electronic products, such as TVs, smartphones, and IoT devices. The integration of multiple components onto a single die is revolutionizing the consumer industry toward miniaturization. Consumer electronics segment includes smartphones, tablets, wearable devices etc. Further, the advent of smart electronics devices with the integration of multiple processors, sensors, and other components is accelerating the market growth. Therefore, the growing demand of consumer electronics will increase the demand of embedded die packaging technology, which will drive the growth of the APAC embedded die packaging technology market.

The overall APAC embedded die packaging technology market size has been derived using both primary and secondary sources. To begin the research process, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the APAC embedded die packaging technology market. The process also serves the purpose of obtaining overview and forecast for the APAC embedded die packaging technology market with respects to all the segments pertaining to the region. Also, multiple primary interviews have been conducted with industry participants and commentators to validate the data, as well as to gain more analytical insights into the topic. The participants who typically take part in such a process include industry experts such as VPs, business development managers, market intelligence managers, and national sales managers along with external consultants such as valuation experts, research analysts, and key opinion leaders specializing in the APAC embedded die packaging technology market. Amkor Technology, Inc.; ASE Group; AT & S Austria Technologie & Systemtechnik Aktiengesellschaft; Fujikura Ltd.; General Electric Company; Infineon Technologies AG; Microsemi; Schweizer Electronic AG; Shinko Electric Industries Co., Ltd.; and Taiwan Semiconductor Manufacturing Company, Limited are among a few players operating in the APAC embedded die packaging technology market.

Reasons to Buy
  • Save and reduce time carrying out entry-level research by identifying the growth, size, leading players and segments in the APAC embedded die packaging technology market.
  • Highlights key business priorities in order to assist companies to realign their business strategies
  • The key findings and recommendations highlight crucial progressive industry trends in APAC embedded die packaging technology market, thereby allowing players across the value chain to develop effective long-term strategies
  • Develop/modify business expansion plans by using substantial growth offering developed and emerging markets
  • Scrutinize in-depth APAC market trends and outlook coupled with the factors driving the embedded die packaging technology market, as well as those hindering it
  • Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to client products, segmentation, pricing and distribution
Frequently Asked Questions about the Asian Pacific Embedded Die Packaging Technology Market

What is the estimated value of the Asian Pacific Embedded Die Packaging Technology Market?

The Asian Pacific Embedded Die Packaging Technology Market was estimated to be valued at $32019.28 Million in 2020.

What is the growth rate of the Asian Pacific Embedded Die Packaging Technology Market?

The growth rate of the Asian Pacific Embedded Die Packaging Technology Market is 18.5%, with an estimated value of $121957.05 Million by 2028.

What is the forecasted size of the Asian Pacific Embedded Die Packaging Technology Market?

The Asian Pacific Embedded Die Packaging Technology Market is estimated to be worth $121957.05 Million by 2028.

Who are the key companies in the Asian Pacific Embedded Die Packaging Technology Market?

Key companies in the Asian Pacific Embedded Die Packaging Technology Market include Amkor Technology, Inc., ASE Group, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Fujikura Ltd., General Electric Company, Infineon Technologies AG, Microsemi, Schweizer Electronic AG and Taiwan Semiconductor Manufacturing Company, Limited.

Table of Contents

1. Introduction
1.1 Study Scope
1.2 Research Report Guidance
1.3 Market Segmentation
1.3.1 APAC Embedded Die Packaging Technology Market - By Platform
1.3.2 APAC Embedded Die Packaging Technology Market - By Application
1.3.3 APAC Embedded Die Packaging Technology Market - By Industry
1.3.4 APAC Embedded Die Packaging Technology Market- By Country
2. Key Takeaways
3. Research Methodology
3.1 Coverage
3.2 Secondary Research
3.3 Primary Research
4. APAC Embedded Die Packaging Technology Market Landscape
4.1 Market Overview
4.2 APAC PEST Analysis
4.3 Ecosystem Analysis
4.4 Expert Opinion
5. APAC Embedded Die Packaging Technology Market - Key Market Dynamics
5.1 Market Drivers
5.1.1 Burgeoning Demand for Miniaturization of Electronic Devices
5.1.2 Escalating Developments in Embedded Die Packaging Technology
5.2 Market Restraints
5.2.1 Technical Issues and Availability of Alternative Solutions
5.3 Market Opportunities
5.3.1 Surging Demand to Enhance Smartphone and Automotive Device Performance
5.4 Future Trends
5.4.1 Mounting Adoption of Wearable Devices and Internet of Things
5.5 Impact Analysis of Drivers and Restraints
6. Embedded Die Packaging Technology Market - APAC Analysis
6.1 APAC Embedded Die Packaging Technology Market Overview
6.2 APAC Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
7. APAC Embedded Die Packaging Technology Market Analysis - By Platform
7.1 Overview
7.2 APAC Embedded Die Packaging Technology Market, By Platform (2020 and 2028)
7.3 IC Package Substrate
7.3.1 Overview
7.3.2 IC Package Substrate: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
7.4 Rigid Board
7.4.1 Overview
7.4.2 Rigid Board: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
7.5 Flexible Board
7.5.1 Overview
7.5.2 Flexible Board: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
8. APAC Embedded Die Packaging Technology Market - By Application
8.1 Overview
8.2 APAC Embedded Die Packaging Technology Market, by Application (2020 and 2028)
8.3 Smartphone and Tablets
8.3.1 Overview
8.3.2 Smartphone and Tablets: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
8.4 Medical and Wearable Devices
8.4.1 Overview
8.4.2 Medical and Wearable Devices: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
8.5 Industrial Devices
8.5.1 Overview
8.5.2 Industrial Devices: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
8.6 Security Devices
8.6.1 Overview
8.6.2 Security Devices: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
8.7 Other Applications
8.7.1 Overview
8.7.2 Other Applications: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
9. APAC Embedded Die Packaging Technology Market - By Industry
9.1 Overview
9.2 APAC Embedded Die Packaging Technology Market, by Industry (2020 and 2028)
9.3 Consumer Electronics
9.3.1 Overview
9.3.2 Consumer Electronics: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
9.4 IT and Telecommunication
9.4.1 Overview
9.4.2 IT and Telecommunication: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
9.5 Automotive
9.5.1 Overview
9.5.2 Automotive: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
9.6 Healthcare
9.6.1 Overview
9.6.2 Healthcare: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
9.7 Other Industries
9.7.1 Overview
9.7.2 Other Industries: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
10. APAC Embedded Die Packaging Technology Market - Country Analysis
10.1 Overview
10.1.1 APAC: Embedded Die Packaging Technology Market- by Key Country
10.1.1.1 Australia: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.1.1 Australia: Embedded Die Packaging Technology Market- By Platform
10.1.1.1.2 Australia: Embedded Die Packaging Technology Market- By Application
10.1.1.1.3 Australia: Embedded Die Packaging Technology Market- By Industry
10.1.1.2 China: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.2.1 China: Embedded Die Packaging Technology Market- By Platform
10.1.1.2.2 China: Embedded Die Packaging Technology Market- By Application
10.1.1.2.3 China: Embedded Die Packaging Technology Market- By Industry
10.1.1.3 India: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.3.1 India: Embedded Die Packaging Technology Market- By Platform
10.1.1.3.2 India: Embedded Die Packaging Technology Market- By Application
10.1.1.3.3 India: Embedded Die Packaging Technology Market- By Industry
10.1.1.4 Japan: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.4.1 Japan: Embedded Die Packaging Technology Market- By Platform
10.1.1.4.2 Japan: Embedded Die Packaging Technology Market- By Application
10.1.1.4.3 Japan: Embedded Die Packaging Technology Market- By Industry
10.1.1.5 South Korea: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.5.1 South Korea: Embedded Die Packaging Technology Market- By Platform
10.1.1.5.2 South Korea: Embedded Die Packaging Technology Market- By Application
10.1.1.5.3 South Korea: Embedded Die Packaging Technology Market- By Industry
10.1.1.6 Rest of APAC: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.6.1 Rest of APAC: Embedded Die Packaging Technology Market- By Platform
10.1.1.6.2 Rest of APAC: Embedded Die Packaging Technology Market- By Application
10.1.1.6.3 Rest of APAC: Embedded Die Packaging Technology Market- By Industry
11. APAC Embedded Die Packaging Technology Market- COVID-19 Impact Analysis
11.1 APAC
12. Industry Landscape
12.1 Overview
12.2 Market Initiative
12.3 New Product Development
13. Company Profiles
13.1 ASE Group
13.1.1 Key Facts
13.1.2 Business Description
13.1.3 Products and Services
13.1.4 Financial Overview
13.1.5 SWOT Analysis
13.1.6 Key Developments
13.2 Amkor Technology, Inc.
13.2.1 Key Facts
13.2.2 Business Description
13.2.3 Products and Services
13.2.4 Financial Overview
13.2.5 SWOT Analysis
13.2.6 Key Developments
13.3 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
13.3.1 Key Facts
13.3.2 Business Description
13.3.3 Products and Services
13.3.4 Financial Overview
13.3.5 SWOT Analysis
13.3.6 Key Developments
13.4 Fujikura Ltd.
13.4.1 Key Facts
13.4.2 Business Description
13.4.3 Products and Services
13.4.4 Financial Overview
13.4.5 SWOT Analysis
13.4.6 Key Developments
13.5 General Electric Company
13.5.1 Key Facts
13.5.2 Business Description
13.5.3 Products and Services
13.5.4 Financial Overview
13.5.5 SWOT Analysis
13.5.6 Key Developments
13.6 Infineon Technologies AG
13.6.1 Key Facts
13.6.2 Business Description
13.6.3 Products and Services
13.6.4 Financial Overview
13.6.5 SWOT Analysis
13.6.6 Key Developments
13.7 Microsemi
13.7.1 Key Facts
13.7.2 Business Description
13.7.3 Products and Services
13.7.4 Financial Overview
13.7.5 SWOT Analysis
13.7.6 Key Developments
13.8 Shinko Electric Industries Co., Ltd.
13.8.1 Key Facts
13.8.2 Business Description
13.8.3 Products and Services
13.8.4 Financial Overview
13.8.5 SWOT Analysis
13.8.6 Key Developments
13.9 Schweizer Electronic AG
13.9.1 Key Facts
13.9.2 Business Description
13.9.3 Products and Services
13.9.4 Financial Overview
13.9.5 SWOT Analysis
13.9.6 Key Developments
13.10 Taiwan Semiconductor Manufacturing Company, Limited
13.10.1 Key Facts
13.10.2 Business Description
13.10.3 Products and Services
13.10.4 Financial Overview
13.10.5 SWOT Analysis
13.10.6 Key Developments
14. Appendix
14.1 About the Publisher
14.2 Word Index
List of Tables
Table 1. APAC Embedded Die Packaging Technology Market - Revenue, and Forecast to 2028 (US$ Thousand)
Table 2. Australia: Embedded Die Packaging Technology Market - By Platform - Revenue and Forecast to 2028 (US$ Thousand)
Table 3. Australia: Embedded Die Packaging Technology Market - By Application - Revenue and Forecast to 2028 (US$ Thousand)
Table 4. Australia: Embedded Die Packaging Technology Market - By Industry - Revenue and Forecast to 2028 (US$ Thousand)
Table 5. China: Embedded Die Packaging Technology Market - By Platform - Revenue and Forecast to 2028 (US$ Thousand)
Table 6. China: Embedded Die Packaging Technology Market - By Application - Revenue and Forecast to 2028 (US$ Thousand)
Table 7. China: Embedded Die Packaging Technology Market - By Industry - Revenue and Forecast to 2028 (US$ Thousand)
Table 8. India: Embedded Die Packaging Technology Market - By Platform - Revenue and Forecast to 2028 (US$ Thousand)
Table 9. India: Embedded Die Packaging Technology Market - By Application - Revenue and Forecast to 2028 (US$ Thousand)
Table 10. India: Embedded Die Packaging Technology Market - By Industry - Revenue and Forecast to 2028 (US$ Thousand)
Table 11. Japan: Embedded Die Packaging Technology Market - By Platform - Revenue and Forecast to 2028 (US$ Thousand)
Table 12. Japan: Embedded Die Packaging Technology Market - By Application - Revenue and Forecast to 2028 (US$ Thousand)
Table 13. Japan: Embedded Die Packaging Technology Market - By Industry - Revenue and Forecast to 2028 (US$ Thousand)
Table 14. South Korea: Embedded Die Packaging Technology Market - By Platform - Revenue and Forecast to 2028 (US$ Thousand)
Table 15. South Korea: Embedded Die Packaging Technology Market - By Application - Revenue and Forecast to 2028 (US$ Thousand)
Table 16. South Korea: Embedded Die Packaging Technology Market - By Industry - Revenue and Forecast to 2028 (US$ Thousand)
Table 17. Rest of APAC: Embedded Die Packaging Technology Market - By Platform - Revenue and Forecast to 2028 (US$ Thousand)
Table 18. Rest of APAC: Embedded Die Packaging Technology Market - By Application - Revenue and Forecast to 2028 (US$ Thousand)
Table 19. Rest of APAC: Embedded Die Packaging Technology Market - By Industry - Revenue and Forecast to 2028 (US$ Thousand)
Table 20. List of Abbreviation
List of Figures
Figure 1. APAC Embedded Die Packaging Technology Market Segmentation
Figure 2. APAC Embedded Die Packaging Technology Market Segmentation - By Country
Figure 3. APAC Embedded Die Packaging Technology Market Overview
Figure 4. IC Package Substrate Platform Held the Largest Market Share in 2020
Figure 5. Smartphones and Tablets Held the Largest Market Share in 2020
Figure 6. Consumer Electronics Held the Largest Market Share in 2020
Figure 7. China was the Largest Revenue Contributor in 2020
Figure 8. APAC - PEST Analysis
Figure 9. APAC Embedded Die Packaging Technology Market - Ecosystem Analysis
Figure 10. Expert Opinion
Figure 11. APAC Embedded Die Packaging Technology Market Impact Analysis of Drivers and Restraints
Figure 12. APAC Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 13. APAC Embedded Die Packaging Technology Market Revenue Share, by Platform (2020 and 2028)
Figure 14. APAC IC Package Substrate: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 15. APAC Rigid Board: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 16. APAC Flexible Board: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 17. APAC Embedded Die Packaging Technology Market Revenue Share, by Application (2020 and 2028)
Figure 18. APAC Smartphone and Tablets: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 19. APAC Medical and Wearable Devices: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 20. APAC Industrial Devices: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 21. APAC Security Devices: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 22. APAC Other Applications: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 23. APAC Embedded Die Packaging Technology Market Revenue Share, by Industry (2020 and 2028)
Figure 24. APAC Consumer Electronics: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 25. APAC IT and Telecommunication: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 26. APAC Automotive: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 27. APAC Healthcare: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 28. APAC Other Industries: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 29. APAC: Embedded Die Packaging Technology Market, by Key Country - Revenue (2020) (USD Thousand)
Figure 30. APAC: Embedded Die Packaging Technology Market Revenue Share, By Key Country (2020 and 2028)
Figure 31. Australia: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 32. China: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 33. India: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 34. Japan: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 35. South Korea: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 36. Rest of APAC: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 37. Impact of COVID-19 Pandemic in APAC Country Markets

Companies Mentioned

A selection of companies mentioned in this report includes:

  • Amkor Technology, Inc.
  • ASE Group
  • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
  • Fujikura Ltd.
  • General Electric Company
  • Infineon Technologies AG
  • Microsemi
  • Schweizer Electronic AG
  • Shinko Electric Industries Co., Ltd.
  • Taiwan Semiconductor Manufacturing Company, Limited