Asia Pacific Embedded Die Packaging Technology Market Forecast to 2028 - COVID-19 Impact and Regional Analysis by Platform, Application, and Industry

The APAC embedded die packaging technology market is expected to grow from US$ 32,019.28 thousand in 2020 to US$ 1,21,957.05 thousand by 2028; it is estimated to grow at a CAGR of 18.5 % from 2021 to 2028. Mounting adoption of wearable devices and internet of things is expected to accelerate the APAC embedded die packaging technology market. In the era of digitalization and the Internet of Things (IoT), the embedded die packaging technology is also offering advanced electronic devices for consumers. Consumer inclination toward smartwatches and IoT devices is likely to propel the APAC embedded die packaging technology market growth. Some of the market players across APAC region are introducing advanced wearable electronic gadgets for customers. The new features in smart wearables, such as health monitoring, activity monitoring, and internet connectivity, are improving through embedded die packaging technology. For instance, Apple Watch 4 series implemented the embedded die packaging technology to design a small form factor-based structure. Such adoption of embedded die packaging technology in wearables through embedded die packaging technology is supposed to fuel the APAC market growth in the coming years. Besides, the emergence of smart devices based on IoT technology is creating a scope for embedded die packaging technology across APAC region, to achieve smart assistant, smart hearables, companion robot, smart camera, smart speaker, and other features, which will drive the growth of the APAC embedded die packaging technology market.

The outbreak of COVID-19 has severely affected countries across the world. Countries such as China, India, South Korea, and Japan are moving toward new networking solutions such as 5G, 4G, and VoLTE. China and India are the most prominent manufacturing hub in the region and have an enhanced focus on industrialization. The growth of the manufacturing industry has been hampered due to lockdown but soon recovered the development by enhancing the production capabilities in the second half of the year. The demand for advanced electronics such as a smartwatch, smart wearables, and healthcare machines has increased significantly. Also, companies in the Asian region have restructured their capabilities by adopting various strategies such as automation, partnership, and acquisition. For instance, in 2020, Schweizer Electronic AG formed sales representative agreement with Varikorea Co., Ltd to promote SCHWEIZER’s high-tech printed circuit boards and embedding solutions in South Korea
Based on industry, the consumer electronics segment led the APAC embedded die packaging technology market in 2020. Rising disposable income and increasing tech-savvy population are boosting the adoption of advanced and compact consumer electronics, thereby augmenting the demand for embedded die packaging technology. The advent of compact smart wearables is further enhancing the demand for microelectronics. Embedded die packaging technology allows packaging of a maximum number of components on a single die with limited space to support the miniaturization of electronic devices. The technology offers various benefits, such as shrinking the size and lowering the cost of the electronic devices. Embedded die technology is being used in most electronic products, such as TVs, smartphones, and IoT devices. The integration of multiple components onto a single die is revolutionizing the consumer industry toward miniaturization. Consumer electronics segment includes smartphones, tablets, wearable devices etc. Further, the advent of smart electronics devices with the integration of multiple processors, sensors, and other components is accelerating the market growth. Therefore, the growing demand of consumer electronics will increase the demand of embedded die packaging technology, which will drive the growth of the APAC embedded die packaging technology market.

The overall APAC embedded die packaging technology market size has been derived using both primary and secondary sources. To begin the research process, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the APAC embedded die packaging technology market. The process also serves the purpose of obtaining overview and forecast for the APAC embedded die packaging technology market with respects to all the segments pertaining to the region. Also, multiple primary interviews have been conducted with industry participants and commentators to validate the data, as well as to gain more analytical insights into the topic. The participants who typically take part in such a process include industry experts such as VPs, business development managers, market intelligence managers, and national sales managers along with external consultants such as valuation experts, research analysts, and key opinion leaders specializing in the APAC embedded die packaging technology market. Amkor Technology, Inc.; ASE Group; AT & S Austria Technologie & Systemtechnik Aktiengesellschaft; Fujikura Ltd.; General Electric Company; Infineon Technologies AG; Microsemi; Schweizer Electronic AG; Shinko Electric Industries Co., Ltd.; and Taiwan Semiconductor Manufacturing Company, Limited are among a few players operating in the APAC embedded die packaging technology market.

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