Europe Embedded Die Packaging Technology Market Forecast to 2028 - COVID-19 Impact and Regional Analysis by Platform, Application, and Industry

The Europe embedded die packaging technology market is expected to grow from US$ 9,686.92 thousand in 2020 to US$ 35,043.61 thousand by 2028; it is estimated to grow at a CAGR of 17.8 % from 2021 to 2028. Escalating demand for miniaturization of electronic devices and the growing trend of the small form factor-based handheld electronic devices are the factors accelerating the growth of the embedded die packaging technology market. Technological advancements such as miniaturization in electronics forming have influenced various markets including military, aerospace, medical, retail, and consumer electronics. Devices with small form factor-based packages embed more functionality and are considered the best alternative for traditional packaging systems. Personalized healthcare gadgets, thin-sized smartphones, and compact PCs are equipped with embedded die packaging technology-based components, such as ICs, processors, sensors, and RF modules. Continuous development in advanced packaging technologies, including flexible boards and IC package substrate, further supplement the Europe market growth by resolving the technical challenges. Innovations in solutions such as multi-die integration and flexible ICs enhance device performance by offering small form factors. New packaging technologies are aiding the integration of multiple components in a single die. Moreover, market players across Europe region are making efforts to optimize the embedded die packaging technology for better solution formation. For instance, in July 2019, Intel Corporation introduced a new advanced packaging solution called embedded multi-die interconnect bridge (EMIB). The embedded die packaging technology is used to form chiplets with high bandwidth and low power consumption. So rising demand of miniaturization is expected to fuel the Europe embedded die packaging technology market growth.

In case of COVID-19, Europe is highly affected specially the UK and Russia. Due to increased number of COVID-19 cases, the European market also witnessed a sluggish growth in the embedded die packaging technology in the first half of 2020. The semiconductor industry in Europe resumes growth at a slower rate compared to other markets, such as Asia and the US. The demand from industrial and automotive electronics has witnessed a substantial hit than consumer electronics due to the impact of COVID-19 pandemic. Post lockdown market has witnessed healthy growth rate owing to the increasing demand for advanced electronics devices to restart the facilities, operations, commercial places, and transportation.

Based on application, the smartphone and tablets segment led the Europe embedded die packaging technology market in 2020. New inventions are being carried out in consumer electronics to overcome the challenges of flexibility, reliability, and cost-saving benefits for customers. The smart devices in consumer electronics are getting smaller in size to offer enhanced comfort and best fit solution for consumers. Growing trend of size reduction and improving functionality of electronic devices are increasing the implementation of embedded die packaging technology for cellphones and tablets. The die and chip size play a vital role in smartphone design, as manufacturers are urging for a new solution to take the minimum space possible. Integration of maximum number of components in smartphone ICs or modules using embedded die packaging technology to reduce the size and enhance the performance are among the key factors bolstering the Europe embedded die packaging technology market growth.

The overall Europe embedded die packaging technology market size has been derived using both primary and secondary sources. To begin the research process, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the Europe embedded die packaging technology market. The process also serves the purpose of obtaining overview and forecast for the Europe embedded die packaging technology market with respects to all the segments pertaining to the region. Also, multiple primary interviews have been conducted with industry participants and commentators to validate the data, as well as to gain more analytical insights into the topic. The participants who typically take part in such a process include industry expert such as VPs, business development managers, market intelligence managers, and national sales managers along with external consultants such as valuation experts, research analysts, and key opinion leaders specializing in the Europe embedded die packaging technology market. Amkor Technology, Inc.; ASE Group; AT & S Austria Technologie & Systemtechnik Aktiengesellschaft; Fujikura Ltd.; General Electric Company; Infineon Technologies AG; Microsemi; Schweizer Electronic AG; and Taiwan Semiconductor Manufacturing Company, Limited are among a few players operating in the Europe embedded die packaging technology market.

Reasons to Buy

• Save and reduce time carrying out entry-level research by identifying the growth, size, leading players and segments in the Europe embedded die packaging technology market.
• Highlights key business priorities in order to assist companies to realign their business strategies
• The key findings and recommendations highlight crucial progressive industry trends in Europe embedded die packaging technology market, thereby allowing players across the value chain to develop effective long-term strategies
• Develop/modify business expansion plans by using substantial growth offering developed and emerging markets
• Scrutinize in-depth Europe market trends and outlook coupled with the factors driving the embedded die packaging technology market, as well as those hindering it
• Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to client products, segmentation, pricing and distribution