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Europe Embedded Die Packaging Technology Market Forecast to 2028 - COVID-19 Impact and Regional Analysis by Platform, Application, and Industry

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    Report

  • May 2021
  • Region: Europe
  • The Insight Partners
  • ID: 5331843
UP TO OFF until Jan 15th 2023
The Europe embedded die packaging technology market is expected to grow from US$ 9,686.92 thousand in 2020 to US$ 35,043.61 thousand by 2028; it is estimated to grow at a CAGR of 17.8 % from 2021 to 2028. Escalating demand for miniaturization of electronic devices and the growing trend of the small form factor-based handheld electronic devices are the factors accelerating the growth of the embedded die packaging technology market. Technological advancements such as miniaturization in electronics forming have influenced various markets including military, aerospace, medical, retail, and consumer electronics. Devices with small form factor-based packages embed more functionality and are considered the best alternative for traditional packaging systems. Personalized healthcare gadgets, thin-sized smartphones, and compact PCs are equipped with embedded die packaging technology-based components, such as ICs, processors, sensors, and RF modules. Continuous development in advanced packaging technologies, including flexible boards and IC package substrate, further supplement the Europe market growth by resolving the technical challenges. Innovations in solutions such as multi-die integration and flexible ICs enhance device performance by offering small form factors. New packaging technologies are aiding the integration of multiple components in a single die. Moreover, market players across Europe region are making efforts to optimize the embedded die packaging technology for better solution formation. For instance, in July 2019, Intel Corporation introduced a new advanced packaging solution called embedded multi-die interconnect bridge (EMIB). The embedded die packaging technology is used to form chiplets with high bandwidth and low power consumption. So rising demand of miniaturization is expected to fuel the Europe embedded die packaging technology market growth.





In case of COVID-19, Europe is highly affected specially the UK and Russia. Due to increased number of COVID-19 cases, the European market also witnessed a sluggish growth in the embedded die packaging technology in the first half of 2020. The semiconductor industry in Europe resumes growth at a slower rate compared to other markets, such as Asia and the US. The demand from industrial and automotive electronics has witnessed a substantial hit than consumer electronics due to the impact of COVID-19 pandemic. Post lockdown market has witnessed healthy growth rate owing to the increasing demand for advanced electronics devices to restart the facilities, operations, commercial places, and transportation.

Based on application, the smartphone and tablets segment led the Europe embedded die packaging technology market in 2020. New inventions are being carried out in consumer electronics to overcome the challenges of flexibility, reliability, and cost-saving benefits for customers. The smart devices in consumer electronics are getting smaller in size to offer enhanced comfort and best fit solution for consumers. Growing trend of size reduction and improving functionality of electronic devices are increasing the implementation of embedded die packaging technology for cellphones and tablets. The die and chip size play a vital role in smartphone design, as manufacturers are urging for a new solution to take the minimum space possible. Integration of maximum number of components in smartphone ICs or modules using embedded die packaging technology to reduce the size and enhance the performance are among the key factors bolstering the Europe embedded die packaging technology market growth.

The overall Europe embedded die packaging technology market size has been derived using both primary and secondary sources. To begin the research process, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the Europe embedded die packaging technology market. The process also serves the purpose of obtaining overview and forecast for the Europe embedded die packaging technology market with respects to all the segments pertaining to the region. Also, multiple primary interviews have been conducted with industry participants and commentators to validate the data, as well as to gain more analytical insights into the topic. The participants who typically take part in such a process include industry expert such as VPs, business development managers, market intelligence managers, and national sales managers along with external consultants such as valuation experts, research analysts, and key opinion leaders specializing in the Europe embedded die packaging technology market. Amkor Technology, Inc.; ASE Group; AT & S Austria Technologie & Systemtechnik Aktiengesellschaft; Fujikura Ltd.; General Electric Company; Infineon Technologies AG; Microsemi; Schweizer Electronic AG; and Taiwan Semiconductor Manufacturing Company, Limited are among a few players operating in the Europe embedded die packaging technology market.

Reasons to Buy
  • Save and reduce time carrying out entry-level research by identifying the growth, size, leading players and segments in the Europe embedded die packaging technology market.
  • Highlights key business priorities in order to assist companies to realign their business strategies
  • The key findings and recommendations highlight crucial progressive industry trends in Europe embedded die packaging technology market, thereby allowing players across the value chain to develop effective long-term strategies
  • Develop/modify business expansion plans by using substantial growth offering developed and emerging markets
  • Scrutinize in-depth Europe market trends and outlook coupled with the factors driving the embedded die packaging technology market, as well as those hindering it
  • Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to client products, segmentation, pricing and distribution
Frequently Asked Questions about the European Embedded Die Packaging Technology Market

What is the estimated value of the European Embedded Die Packaging Technology Market?

The European Embedded Die Packaging Technology Market was estimated to be valued at $9686.92 Million in 2020.

What is the growth rate of the European Embedded Die Packaging Technology Market?

The growth rate of the European Embedded Die Packaging Technology Market is 17.8%, with an estimated value of $35043.61 Million by 2028.

What is the forecasted size of the European Embedded Die Packaging Technology Market?

The European Embedded Die Packaging Technology Market is estimated to be worth $35043.61 Million by 2028.

Who are the key companies in the European Embedded Die Packaging Technology Market?

Key companies in the European Embedded Die Packaging Technology Market include Amkor Technology, Inc., ASE Group, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Fujikura Ltd., General Electric Company, Infineon Technologies AG, Microsemi and Taiwan Semiconductor Manufacturing Company, Limited.

Table of Contents

TABLE OF CONTENTS
1. Introduction
1.1 Study Scope
1.2 Research Report Guidance
1.3 Market Segmentation
1.3.1 Europe Embedded Die Packaging Technology Market - By Platform
1.3.2 Europe Embedded Die Packaging Technology Market - By Application
1.3.3 Europe Embedded Die Packaging Technology Market - By Industry
1.3.4 Europe Embedded Die Packaging Technology Market- By Country
2. Key Takeaways
3. Research Methodology
3.1 Coverage
3.2 Secondary Research
3.3 Primary Research
4. Europe Embedded Die Packaging Technology Market Landscape
4.1 Market Overview
4.2 Europe PEST Analysis
4.3 Ecosystem Analysis
4.4 Expert Opinion
5. Europe Embedded Die Packaging Technology Market - Key Market Dynamics
5.1 Market Drivers
5.1.1 Escalating Demand for Miniaturization of Electronic Devices
5.1.2 Mounting Developments in Embedded Die Packaging Technology
5.2 Market Restraints
5.2.1 Technical Complexities and Alternative Solutions Availability
5.3 Market Opportunities
5.3.1 Growing Demand to Enhance Smartphone and Automotive Device Performance
5.4 Future Trends
5.4.1 Rising Adoption of Wearable Devices and Internet of Things
5.5 Impact Analysis of Drivers and Restraints
6. Embedded Die Packaging Technology Market - Europe Analysis
6.1 Europe Embedded Die Packaging Technology Market Overview
6.2 Europe Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
7. Europe Embedded Die Packaging Technology Market Analysis - By Platform
7.1 Overview
7.2 Europe Embedded Die Packaging Technology Market, By Platform (2020 and 2028)
7.3 IC Package Substrate
7.3.1 Overview
7.3.2 IC Package Substrate: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
7.4 Rigid Board
7.4.1 Overview
7.4.2 Rigid Board: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
7.5 Flexible Board
7.5.1 Overview
7.5.2 Flexible Board: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
8. Europe Embedded Die Packaging Technology Market - By Application
8.1 Overview
8.2 Europe Embedded Die Packaging Technology Market, by Application (2020 and 2028)
8.3 Smartphone and Tablets
8.3.1 Overview
8.3.2 Smartphone and Tablets: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
8.4 Medical and Wearable Devices
8.4.1 Overview
8.4.2 Medical and Wearable Devices: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
8.5 Industrial Devices
8.5.1 Overview
8.5.2 Industrial Devices: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
8.6 Security Devices
8.6.1 Overview
8.6.2 Security Devices: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
8.7 Other Applications
8.7.1 Overview
8.7.2 Other Applications: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
9. Europe Embedded Die Packaging Technology Market - By Industry
9.1 Overview
9.2 Europe Embedded Die Packaging Technology Market, by Industry (2020 and 2028)
9.3 Consumer Electronics
9.3.1 Overview
9.3.2 Consumer Electronics: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
9.4 IT and Telecommunication
9.4.1 Overview
9.4.2 IT and Telecommunication: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
9.5 Automotive
9.5.1 Overview
9.5.2 Automotive: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
9.6 Healthcare
9.6.1 Overview
9.6.2 Healthcare: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
9.7 Other Industries
9.7.1 Overview
9.7.2 Other Industries: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
10. Europe Embedded Die Packaging Technology Market - Country Analysis
10.1 Overview
10.1.1 Europe: Embedded Die Packaging Technology Market- by Key Country
10.1.1.1 Germany: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.1.1 Germany: Embedded Die Packaging Technology Market- By Platform
10.1.1.1.2 Germany: Embedded Die Packaging Technology Market- By Application
10.1.1.1.3 Germany: Embedded Die Packaging Technology Market- By Industry
10.1.1.2 France: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.2.1 France: Embedded Die Packaging Technology Market- By Platform
10.1.1.2.2 France: Embedded Die Packaging Technology Market- By Application
10.1.1.2.3 France: Embedded Die Packaging Technology Market- By Industry
10.1.1.3 Italy: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.3.1 Italy: Embedded Die Packaging Technology Market- By Platform
10.1.1.3.2 Italy: Embedded Die Packaging Technology Market- By Application
10.1.1.3.3 Italy: Embedded Die Packaging Technology Market- By Industry
10.1.1.4 UK: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.4.1 UK: Embedded Die Packaging Technology Market- By Platform
10.1.1.4.2 UK: Embedded Die Packaging Technology Market- By Application
10.1.1.4.3 UK: Embedded Die Packaging Technology Market- By Industry
10.1.1.5 Russia: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.5.1 Russia: Embedded Die Packaging Technology Market- By Platform
10.1.1.5.2 Russia: Embedded Die Packaging Technology Market- By Application
10.1.1.5.3 Russia: Embedded Die Packaging Technology Market- By Industry
10.1.1.6 Rest of Europe: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
10.1.1.6.1 Rest of Europe: Embedded Die Packaging Technology Market- By Platform
10.1.1.6.2 Rest of Europe: Embedded Die Packaging Technology Market- By Application
10.1.1.6.3 Rest of Europe: Embedded Die Packaging Technology Market- By Industry
11. Europe Embedded Die Packaging Technology Market- COVID-19 Impact Analysis
11.1 Europe
12. Industry Landscape
12.1 Overview
12.2 Market Initiative
12.3 New Product Development
13. Company Profiles
13.1 ASE Group
13.1.1 Key Facts
13.1.2 Business Description
13.1.3 Products and Services
13.1.4 Financial Overview
13.1.5 SWOT Analysis
13.1.6 Key Developments
13.2 Amkor Technology, Inc.
13.2.1 Key Facts
13.2.2 Business Description
13.2.3 Products and Services
13.2.4 Financial Overview
13.2.5 SWOT Analysis
13.2.6 Key Developments
13.3 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
13.3.1 Key Facts
13.3.2 Business Description
13.3.3 Products and Services
13.3.4 Financial Overview
13.3.5 SWOT Analysis
13.3.6 Key Developments
13.4 Fujikura Ltd.
13.4.1 Key Facts
13.4.2 Business Description
13.4.3 Products and Services
13.4.4 Financial Overview
13.4.5 SWOT Analysis
13.4.6 Key Developments
13.5 General Electric Company
13.5.1 Key Facts
13.5.2 Business Description
13.5.3 Products and Services
13.5.4 Financial Overview
13.5.5 SWOT Analysis
13.5.6 Key Developments
13.6 Infineon Technologies AG
13.6.1 Key Facts
13.6.2 Business Description
13.6.3 Products and Services
13.6.4 Financial Overview
13.6.5 SWOT Analysis
13.6.6 Key Developments
13.7 Microsemi
13.7.1 Key Facts
13.7.2 Business Description
13.7.3 Products and Services
13.7.4 Financial Overview
13.7.5 SWOT Analysis
13.7.6 Key Developments
13.8 Schweizer Electronic AG
13.8.1 Key Facts
13.8.2 Business Description
13.8.3 Products and Services
13.8.4 Financial Overview
13.8.5 SWOT Analysis
13.8.6 Key Developments
13.9 Taiwan Semiconductor Manufacturing Company, Limited
13.9.1 Key Facts
13.9.2 Business Description
13.9.3 Products and Services
13.9.4 Financial Overview
13.9.5 SWOT Analysis
13.9.6 Key Developments
14. Appendix
14.1 About the Publisher
14.2 Word Index
List of Tables
Table 1. Europe Embedded Die Packaging Technology Market - Revenue, and Forecast to 2028 (US$ Thousand)
Table 2. Germany: Embedded Die Packaging Technology Market - By Platform - Revenue and Forecast to 2028 (US$ Thousand)
Table 3. Germany: Embedded Die Packaging Technology Market - By Application - Revenue and Forecast to 2028 (US$ Thousand)
Table 4. Germany: Embedded Die Packaging Technology Market - By Industry - Revenue and Forecast to 2028 (US$ Thousand)
Table 5. France: Embedded Die Packaging Technology Market - By Platform - Revenue and Forecast to 2028 (US$ Thousand)
Table 6. France: Embedded Die Packaging Technology Market - By Application - Revenue and Forecast to 2028 (US$ Thousand)
Table 7. France: Embedded Die Packaging Technology Market - By Industry - Revenue and Forecast to 2028 (US$ Thousand)
Table 8. Italy: Embedded Die Packaging Technology Market - By Platform - Revenue and Forecast to 2028 (US$ Thousand)
Table 9. Italy: Embedded Die Packaging Technology Market - By Application - Revenue and Forecast to 2028 (US$ Thousand)
Table 10. Italy: Embedded Die Packaging Technology Market - By Industry - Revenue and Forecast to 2028 (US$ Thousand)
Table 11. UK: Embedded Die Packaging Technology Market - By Platform - Revenue and Forecast to 2028 (US$ Thousand)
Table 12. UK: Embedded Die Packaging Technology Market - By Application - Revenue and Forecast to 2028 (US$ Thousand)
Table 13. UK: Embedded Die Packaging Technology Market - By Industry - Revenue and Forecast to 2028 (US$ Thousand)
Table 14. Russia: Embedded Die Packaging Technology Market - By Platform - Revenue and Forecast to 2028 (US$ Thousand)
Table 15. Russia: Embedded Die Packaging Technology Market - By Application - Revenue and Forecast to 2028 (US$ Thousand)
Table 16. Russia: Embedded Die Packaging Technology Market - By Industry - Revenue and Forecast to 2028 (US$ Thousand)
Table 17. Rest of Europe: Embedded Die Packaging Technology Market - By Platform - Revenue and Forecast to 2028 (US$ Thousand)
Table 18. Rest of Europe: Embedded Die Packaging Technology Market - By Application - Revenue and Forecast to 2028 (US$ Thousand)
Table 19. Rest of Europe: Embedded Die Packaging Technology Market - By Industry - Revenue and Forecast to 2028 (US$ Thousand)
Table 20. List of Abbreviation
List of Figures
Figure 1. Europe Embedded Die Packaging Technology Market Segmentation
Figure 2. Europe Embedded Die Packaging Technology Market Segmentation - By Country
Figure 3. Europe Embedded Die Packaging Technology Market Overview
Figure 4. IC Package Substrate Platform Held the Largest Market Share in 2020
Figure 5. Smartphones and Tablets Held the Largest Market Share in 2020
Figure 6. Consumer Electronics Held the Largest Market Share in 2020
Figure 7. Germany was the Largest Revenue Contributor in 2020
Figure 8. Europe - PEST Analysis
Figure 9. Europe Embedded Die Packaging Technology Market - Ecosystem Analysis
Figure 10. Expert Opinion
Figure 11. Europe Embedded Die Packaging Technology Market Impact Analysis of Drivers and Restraints
Figure 12. Europe Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 13. Europe Embedded Die Packaging Technology Market Revenue Share, by Platform (2020 and 2028)
Figure 14. Europe IC Package Substrate: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 15. Europe Rigid Board: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 16. Europe Flexible Board: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 17. Europe Embedded Die Packaging Technology Market Revenue Share, by Application (2020 and 2028)
Figure 18. Europe Smartphone and Tablets: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 19. Europe Medical and Wearable Devices: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 20. Europe Industrial Devices: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 21. Europe Security Devices: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 22. Europe Other Applications: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 23. Europe Embedded Die Packaging Technology Market Revenue Share, by Industry (2020 and 2028)
Figure 24. Europe Consumer Electronics: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 25. Europe IT and Telecommunication: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 26. Europe Automotive: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 27. Europe Healthcare: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 28. Europe Other Industries: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 29. Europe: Embedded Die Packaging Technology Market, by Key Country - Revenue (2020) (USD Thousand)
Figure 30. Europe: Embedded Die Packaging Technology Market Revenue Share, By Key Country (2020 and 2028)
Figure 31. Germany: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 32. France: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 33. Italy: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 34. UK: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 35. Russia: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 36. Rest of Europe: Embedded Die Packaging Technology Market - Revenue and Forecast to 2028 (US$ Thousand)
Figure 37. Impact of COVID-19 Pandemic in Europe Country Markets

Companies Mentioned

A selection of companies mentioned in this report includes:

  • Amkor Technology, Inc.
  • ASE Group
  • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
  • Fujikura Ltd.
  • General Electric Company
  • Infineon Technologies AG
  • Microsemi
  • Schweizer Electronic AG
  • Taiwan Semiconductor Manufacturing Company, Limited