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The Worldwide OEM Electronics Assembly Market - 2021 Edition

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    Report

  • 70 Pages
  • July 2021
  • Region: Global
  • New Venture Research
  • ID: 5401989

The worldwide electronics assembly market is substantial in size, approximately $1.4 trillion dollars in terms of cost of goods sold (COGS) as of 2020. The market has been expanding rapidly but changing in composition both in terms of outsourcing partnerships with in-house manufacturing. Also, moves are being made annually with regard to the manufacturing country of origin based on total cost.


The report segments the worldwide electronics assembly value into seven unique markets.


  • Automotive
  • Communications
  • Computers/Peripherals
  • Consumer Electronics
  • Industrial
  • Medical
  • Aerospace/Military/Other Transportation

The following production data is given for the leading OEMs within each product/market segment.


  • COGS Assembly Revenue
  • Electronics COGS Assembly Revenue
  • Outsourced/In-Housed Assembly
  • Revenue
  • Assembly Revenue by 3 Regions
  • Assembly Revenue by 46 Products

The leading OEMs for each segment are chosen not only for their size, but also for their leadership within their industry segment, growth potential, profitability, and inclination to outsource electronics assembly.


Table of Contents

Worksheet 1: Automotive
Automotive Engine Controls
Automotive Instruments
Automotive Safety
Automotive Entertainment
Total Automotive
Automotive Summary


Worksheet 2: Communications
Mobile Phones
Infrastructure
Other Phones
Enterprise LANs
Wireless LANs
DSL/Cable Modems
PBX/Key Systems
Carrier-Class
Other Communications
Total Communications Summary


Worksheet 3: Computer/Peripherals
Notebooks
Desktops
Tablets
Servers
Workstations
ESS
Monitors
Printers
E-Readers
Other Computer
Total Computer Summary


Worksheet 4: Consumer Electronics
Digital TV
MP3/4
Smart Home and AV
Games


Worksheet 5: Industrial
Process Control
Test & Measurement
Other Industrial
Clean Energy
Total Industrial Summary


Worksheet 6: Medical
Monitoring
Therapeutic
Diagnostics/Surgical
Total Medical Summary


Worksheet 7: Aerospace/Military/Other
Transportation
In-Flight Entertainment
Navigation Systems
Weapons
C3 Systems
Other Military
Other Aerospace/Other Transportation
Total Aerospace/Military/Other
Transportation


Worksheet 8: World Total
Total Production Assembly Value by Region
EMS Assembly Value by Region
In-House Assembly Value by Region
Total Assembly Value by Market
Segment/Product

Companies Mentioned

Automotive


  • Aisin Seiki
  • Alps Electric
  • Audi AG
  • AutoLiv
  • BAIC Motor
  • BMW
  • BYD
  • Changan Motor
  • Continental
  • Daimler
  • Delphi (Borgwarner)
  • Denso Corporation
  • Dongfeng
  • Eaton
  • FAW Group
  • Fiat Chrysler
  • Geely Motor
  • General Motors
  • Guangzhou Auto
  • Hella
  • Hitachi
  • Honda Corporation
  • Hyundai Motor
  • Johnson Controls
  • JVC Kenwood
  • Kia Motors
  • Magna International
  • Mahindra
  • Maruti Suzuki
  • Mazda Motors
  • Mitsubishi Motors
  • Navistar
  • Nissan
  • Panasonic
  • Renault
  • Robert Bosch
  • SAIC Motor
  • Tata Motors
  • Tesla
  • Valeo
  • Visteon
  • Volkswagen AG
  • Volvo

Communications


  • Accton
  • ADTRAN
  • ADVA
  • Allied Telesis
  • Apple
  • Arista Networks
  • AsusTek
  • Avaya
  • BBK Electronics
  • Blackberry
  • CEC
  • China Electronics Technology
  • China SpaceSat
  • Ciena
  • Cisco Systems
  • CommScope
  • D-Link
  • Datang Telecom
  • Dell Technologies
  • Ericsson
  • Extreme Networks
  • F5 Networks
  • Fortinet
  • Fujitsu
  • Google
  • Harmonic
  • Harris Corp.
  • Hewlett Packard Ent.
  • Hikvision
  • HTC
  • Huawei
  • Infinera
  • Juniper Networks
  • Kyocera
  • Lenovo
  • LG Mobile Com
  • Mitel
  • Motorola Solutions
  • NEC
  • Netgear
  • Nokia Oyj
  • Oki Electric
  • Panasonic Mobile Comm
  • Panda Electronics
  • Poly
  • Qorvo
  • Quanta Computer
  • Ribbon Communications
  • Samsung Electronics
  • Spirent
  • TCL Electronics
  • Telent
  • Toshiba
  • Ubiquiti Networks
  • UTStarcom
  • Viavi Solutions
  • Vtech
  • Xiaomi
  • ZTE
  • Ubiquiti Networks
  • UTStarcom
  • Viavi Solutions

Computers/Peripherals


  • Acer
  • Agfa-Gevaert
  • Amazon
  • Apple, Inc.
  • AsusTek
  • Tongfang
  • Brother Industries
  • Canon
  • Cisco
  • Founder Technology
  • Compal Electronics
  • Dell Technologies
  • Delta Electronics
  • Diebold Nixdorf
  • EliteGroup Comp. Sys.
  • Epson
  • Founder
  • GigaByte
  • Fujitsu
  • Inspur
  • Google
  • Great Wall
  • Hitachi Vantara
  • HP, Inc.
  • HPE
  • HTC
  • Huawei
  • IBM
  • Intel
  • Inventec
  • Konica Minolta
  • Lenovo
  • Logitech
  • MicroStar
  • MiTac
  • NEC
  • NetApp, Inc.
  • Oracle
  • Pitney Bowes
  • Positivo Informatica
  • Qisda
  • Quanta Computer
  • Ricoh
  • Samsung Electronics
  • Sony
  • Teradata
  • Toshiba
  • TPV
  • Unisys
  • Western Digital
  • Xerox
  • Zebra Technologies

Consumer


  • Acer
  • Alibaba
  • Amazon
  • Amtran
  • Apple
  • Arcelik
  • AU Optronics
  • BOE Technology
  • Bosch Group
  • BOSE
  • Casio Computer
  • Changhong
  • Cisco Systems
  • Commscope
  • Compal Electronics
  • Dolby Laboratories
  • EchoStar
  • Electrolux
  • Fitbit
  • Founder
  • Funai Electric
  • Garmin
  • General Electric
  • Google
  • Haier Electronics
  • Hisense
  • Hitachi
  • Humax
  • JVC Kenwood
  • Koninklijke Philips
  • Konka Group
  • LG Electronics
  • Microsoft
  • Midea Holding
  • Mitsubishi Electric
  • Nikon
  • Nintendo
  • Olympus
  • Panasonic
  • Qisda
  • Quanta Computer
  • Roku
  • Samsung
  • Skyworth
  • SmarDTV (Nagra)
  • Sony
  • Tatung
  • TCL Electronics
  • Technicolor 
  • TomTom
  • Tongfang
  • Toshiba
  • TPV
  • Trimble Navigation
  • Whirlpool
  • Yamaha 

Industrial


  • ABB
  • Advantest
  • Agilent
  • ALSTOM
  • Anritsu
  • Applied Materials
  • ASML
  • Bharat Heavy Electricals
  • Caterpillar
  • Cisco Systems
  • CNH Industrial
  • Coherent
  • Cree
  • Danaher
  • Deere & Co.
  • Diebold
  • Eaton
  • Ebara Corp.
  • Electrolux
  • Emerson
  • Everi Holdings
  • Fanuc
  • Federal Signal
  • First_Solar
  • Fuji Electric
  • Fujitsu
  • GE Industrial
  • Gemalto (Thales)
  • General Dynamics
  • Haier
  • Halliburton
  • Hanwha Q-Cells
  • HiSilicon (Hauwei)
  • Hitachi
  • Honeywell
  • Iberdrola
  • IGT
  • Illumina
  • Ingersoll Rand
  • Itron
  • ITT Corp.
  • JA Solar
  • JEOL
  • JinkoSolar
  • Johnson Controls
  • Keysight Technologies
  • KLA-Tencor
  • Komatsu
  • KONE Oyj
  • Lam Research
  • Lennox Intl.
  • LG Electronics
  • LONGi
  • Mettler Toledo
  • Mitsubishi Electric
  • MKS Instruments
  • MTS Systems
  • National Instruments
  • NCR
  • NEC
  • Nichia
  • Omron
  • Orsted A/S
  • OSRAM Licht
  • Panasonic Lighting
  • Parker-Hannifin
  • PerkinElmer
  • Robert Bosch
  • Rockwell Automation
  • Rohde & Schwartz
  • Samsung
  • Schlumberger Omnes
  • Schneider Electric
  • Shimadzu
  • Siemens AG
  • Sinopec
  • SMIC
  • Smiths Group
  • SPX Corporation
  • Sumitomo Heavy Industries
  • SunPower
  • Teradyne, Inc.
  • Textron, Inc.
  • Thermo Fisher Scientific
  • ThyssenKrupp AG
  • Tokyo Electron
  • Toshiba
  • Trina Solar
  • UTC (Raytheon Technologies)
  • Vestas Wind
  • Waters Corporation
  • Whirlpool Corporation
  • Yingli Solar
  • Yokogawa Electric 

Medical


  • 3M Healthcare
  • Abbott Labs
  • Agilent
  • Amgen
  • AstraZeneca
  • B. Braun
  • Baxter International
  • Becton Dickinson
  • Bio-Rad
  • Boston Scientific
  • Carl Zeiss Meditec
  • CONMED
  • Danaher
  • DaVita Healthcare
  • Dentsply Sirona
  • Dragerwerk
  • Edwards Lifesciences
  • Fresenius
  • Fujitsu
  • GE Healthcare
  • Hitachi
  • Hologic
  • Johnson & Johnson
  • Konica Minolta
  • Masimo
  • Medtronic
  • Mindray Medical
  • Novartis
  • Omron
  • Philips Healthcare
  • Qiagen N.V.
  • ResMed
  • Roche
  • Siemens Healthcare
  • Smith & Nephew
  • Smiths Group
  • Stryker
  • Sun Pharmaceuticals
  • Terumo
  • Thermo Fisher
  • Toshiba
  • Varian Medical
  • Zimmer Biomet

Aerospace/Other


  • Airbus SE
  • AVIC International
  • BAE Systems
  • Boeing
  • Boeing Defense
  • Bombardier
  • Chemring
  • China Aerospace
  • China Electronics Corp.
  • Dassault Aviation
  • Embraer
  • General Dynamics
  • General Electric
  • Gogo LLC
  • Gulfstream Aerospace
  • Hindustan Aerospace
  • Honda Motor
  • Honeywell
  • Israel Aerospace
  • Kawasaki
  • L3Harris
  • Leonardo
  • Lockheed Martin
  • Lufthansa Systems
  • Mitsubishi
  • Mitsui Engineering
  • Northrop Grumman
  • Orbital UAV
  • Raytheon
  • Saab
  • SAFRAN
  • SpaceX
  • Suzuki Motor
  • Teledyne
  • Textron
  • Thales
  • Yamaha

Methodology

The publisher's forecasts are developed using a four-step approach. First, expectations of world economic growth are set based upon historical data and forecasts obtained from published International Monetary Fund (IMF) reports.

Next, a top-down forecast of electronics industry growth is built. This analysis is based primarily on historical data obtained from the Semiconductor Industry Association (SIA) and World Semiconductor Trade Statistics (WSTS). Because semiconductor content is at the core of electronics products, semiconductor data is a good triangulation point for total assembly value. This data is augmented with information on passive content and estimates of labor and overhead.

Then, a bottom-up forecast is developed for each of the products in each segment. This is accomplished by first creating a unit forecast for each product based on historical data and various industry-leader opinions regarding future growth prospects for each product. A model of the assembly value of each product is then built using teardown analyses and price-based models. The unit volume times the assembly value per unit equals the total assembly value for each product - often referred to as the cost of goods sold (COGS).

Finally, the first three steps are reiterated to achieve a coherent forecast. The forecasts developed by this process are presented in all their industry reports.

 

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