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Wafer Level Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2021-2026

  • ID: 5483409
  • Report
  • November 2021
  • Region: Global
  • 141 Pages
  • IMARC Group

FEATURED COMPANIES

  • Amkor Technology Inc.
  • Fujitsu Limited
  • IQE PLC
  • JCET Group Co. Ltd.
  • Tokyo Electron Ltd.
  • Toshiba Corporation.
The global wafer level packaging market experienced strong growth during 2015-2020. Looking forward, the publisher expects the market to grow at a CAGR of around 11% during 2021-2026. The wafer-level packaging (WLP) refers to a packaging solution used for adding a protective layer of electronic connections and integrated circuits (ICs). It is used for devices, such as microphones, pressure sensors, accelerometers, gyroscopes, capacitors, resistors and transistors. Some of the commonly used WLP integration types include fan-out (FO), fan-in (FI), flip-chip, 3D FOWLP. These solutions are used at the wafer-level of the device, instead of dicing the wafer into the individual die and packaging them. This offers various benefits, such as a reduction in the size of the wafer chips, streamlining of the manufacturing processes and improvements in chip functionalities. The ultrathin wafers also provide improved heat dissipation and performance, form factor reduction and minimal power consumption. Significant growth in the electronics industry across the globe represents one of the key factors creating a positive outlook on the market growth. Furthermore, the increasing requirement for more compact and faster consumer electronics is also driving the market growth. This has also enhanced the overall demand for cost-effective and high-performance packaging solutions for enhanced mechanical protection, structural support and extended battery life of the devices. Additionally, various technological advancements, such as the integration of connected devices with the Internet of Things (IoT), are acting as other growth-inducing factors. For instance, WLP is widely used for the manufacturing of radar systems in self-driving automobiles. It is also used in the healthcare sector for the production of various wearable devices. Other factors, including increasing circuit miniaturization in microelectronic devices, along with extensive research and development (R&D) activities, are anticipated to drive the market further.

Key Market Segmentation:

The publisher provides an analysis of the key trends in each sub-segment of the global wafer level packaging market, along with forecasts at the global, regional and country level from 2021-2026. Our report has categorized the market based on region, packaging technology and end use industry.

Breakup by Packaging Technology:

3D TSV WLP
2.5D TSV WLP
  • WLCSP
  • Nano WLP
  • Others

Breakup by End Use Industry:

  • Aerospace and Defense
  • Consumer Electronics
  • IT & Telecommunication
  • Healthcare
  • Automotive
  • Others

Breakup by Region:

  • North America
  • United States
  • Canada
  • Asia-Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
  • Russia
  • Others
  • Latin America
  • Brazil
  • Mexico
  • Others
  • Middle East and Africa

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., China Wafer Level CSP Co. Ltd., Chipbond Technology Corporation, Deca Technologies Inc. (Infineon Technologies AG), Fujitsu Limited, IQE PLC, JCET Group Co. Ltd., Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.), Tokyo Electron Ltd. and Toshiba Corporation.

Key Questions Answered in This Report:

  • How has the global wafer level packaging market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the global wafer level packaging market?
  • What are the key regional markets?
  • What is the breakup of the market based on the packaging type?
  • What is the breakup of the market based on the end use industry?
  • What are the various stages in the value chain of the industry?
  • What are the key driving factors and challenges in the industry?
  • What is the structure of the global wafer level packaging market and who are the key players?
  • What is the degree of competition in the industry?
Note: Product cover images may vary from those shown

FEATURED COMPANIES

  • Amkor Technology Inc.
  • Fujitsu Limited
  • IQE PLC
  • JCET Group Co. Ltd.
  • Tokyo Electron Ltd.
  • Toshiba Corporation.
1 Preface

2 Scope and Methodology
2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
2.3.1 Primary Sources
2.3.2 Secondary Sources
2.4 Market Estimation
2.4.1 Bottom-Up Approach
2.4.2 Top-Down Approach
2.5 Forecasting Methodology

3 Executive Summary

4 Introduction
4.1 Overview
4.2 Key Industry Trends

5 Global Wafer Level Packaging Market
5.1 Market Overview
5.2 Market Performance
5.3 Impact of COVID-19
5.4 Market Forecast

6 Market Breakup by Packaging Technology
6.1 3D TSV WLP
6.1.1 Market Trends
6.1.2 Market Forecast
6.2 2.5D TSV WLP
6.2.1 Market Trends
6.2.2 Market Forecast
6.3 WLCSP
6.3.1 Market Trends
6.3.2 Market Forecast
6.4 Nano WLP
6.4.1 Market Trends
6.4.2 Market Forecast
6.5 Others
6.5.1 Market Trends
6.5.2 Market Forecast

7 Market Breakup by End Use Industry
7.1 Aerospace and Defense
7.1.1 Market Trends
7.1.2 Market Forecast
7.2 Consumer Electronics
7.2.1 Market Trends
7.2.2 Market Forecast
7.3 IT & Telecommunication
7.3.1 Market Trends
7.3.2 Market Forecast
7.4 Healthcare
7.4.1 Market Trends
7.4.2 Market Forecast
7.5 Automotive
7.5.1 Market Trends
7.5.2 Market Forecast
7.6 Others
7.6.1 Market Trends
7.6.2 Market Forecast

8 Market Breakup by Region
8.1 North America
8.1.1 United States
8.1.1.1 Market Trends
8.1.1.2 Market Forecast
8.1.2 Canada
8.1.2.1 Market Trends
8.1.2.2 Market Forecast
8.2 Asia-Pacific
8.2.1 China
8.2.1.1 Market Trends
8.2.1.2 Market Forecast
8.2.2 Japan
8.2.2.1 Market Trends
8.2.2.2 Market Forecast
8.2.3 India
8.2.3.1 Market Trends
8.2.3.2 Market Forecast
8.2.4 South Korea
8.2.4.1 Market Trends
8.2.4.2 Market Forecast
8.2.5 Australia
8.2.5.1 Market Trends
8.2.5.2 Market Forecast
8.2.6 Indonesia
8.2.6.1 Market Trends
8.2.6.2 Market Forecast
8.2.7 Others
8.2.7.1 Market Trends
8.2.7.2 Market Forecast
8.3 Europe
8.3.1 Germany
8.3.1.1 Market Trends
8.3.1.2 Market Forecast
8.3.2 France
8.3.2.1 Market Trends
8.3.2.2 Market Forecast
8.3.3 United Kingdom
8.3.3.1 Market Trends
8.3.3.2 Market Forecast
8.3.4 Italy
8.3.4.1 Market Trends
8.3.4.2 Market Forecast
8.3.5 Spain
8.3.5.1 Market Trends
8.3.5.2 Market Forecast
8.3.6 Russia
8.3.6.1 Market Trends
8.3.6.2 Market Forecast
8.3.7 Others
8.3.7.1 Market Trends
8.3.7.2 Market Forecast
8.4 Latin America
8.4.1 Brazil
8.4.1.1 Market Trends
8.4.1.2 Market Forecast
8.4.2 Mexico
8.4.2.1 Market Trends
8.4.2.2 Market Forecast
8.4.3 Others
8.4.3.1 Market Trends
8.4.3.2 Market Forecast
8.5 Middle East and Africa
8.5.1 Market Trends
8.5.2 Market Breakup by Country
8.5.3 Market Forecast

9 SWOT Analysis
9.1 Overview
9.2 Strengths
9.3 Weaknesses
9.4 Opportunities
9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis
11.1 Overview
11.2 Bargaining Power of Buyers
11.3 Bargaining Power of Suppliers
11.4 Degree of Competition
11.5 Threat of New Entrants
11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape
13.1 Market Structure
13.2 Key Players
13.3 Profiles of Key Players
13.3.1 Amkor Technology Inc.
13.3.1.1 Company Overview
13.3.1.2 Product Portfolio
13.3.1.3 Financials
13.3.1.4 SWOT Analysis
13.3.2 China Wafer Level CSP Co. Ltd.
13.3.2.1 Company Overview
13.3.2.2 Product Portfolio
13.3.2.3 SWOT Analysis
13.3.3 Chipbond Technology Corporation
13.3.3.1 Company Overview
13.3.3.2 Product Portfolio
13.3.3.3 SWOT Analysis
13.3.4 Deca Technologies Inc. (Infineon Technologies AG)
13.3.4.1 Company Overview
13.3.4.2 Product Portfolio
13.3.5 Fujitsu Limited
13.3.5.1 Company Overview
13.3.5.2 Product Portfolio
13.3.5.3 Financials
13.3.5.4 SWOT Analysis
13.3.6 IQE PLC
13.3.6.1 Company Overview
13.3.6.2 Product Portfolio
13.3.6.3 SWOT Analysis
13.3.7 JCET Group Co. Ltd.
13.3.7.1 Company Overview
13.3.7.2 Product Portfolio
13.3.7.3 SWOT Analysis
13.3.8 Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.)
13.3.8.1 Company Overview
13.3.8.2 Product Portfolio
13.3.8.3 Financials
13.3.9 Tokyo Electron Ltd.
13.3.9.1 Company Overview
13.3.9.2 Product Portfolio
13.3.9.3 Financials
13.3.9.4 SWOT Analysis
13.3.10 Toshiba Corporation
13.3.10.1 Company Overview
13.3.10.2 Product Portfolio
13.3.10.3 Financials
13.3.10.4 SWOT Analysis

List of Figures
Figure 1: Global: Wafer Level Packaging Market: Major Drivers and Challenges
Figure 2: Global: Wafer Level Packaging Market: Sales Value (in Billion US$), 2015-2020
Figure 3: Global: Wafer Level Packaging Market Forecast: Sales Value (in Billion US$), 2021-2026
Figure 4: Global: Wafer Level Packaging Market: Breakup by Packaging Technology (in %), 2020
Figure 5: Global: Wafer Level Packaging Market: Breakup by End Use Industry (in %), 2020
Figure 6: Global: Wafer Level Packaging Market: Breakup by Region (in %), 2020
Figure 7: Global: Wafer Level Packaging (3D TSV WLP) Market: Sales Value (in Million US$), 2015 & 2020
Figure 8: Global: Wafer Level Packaging (3D TSV WLP) Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 9: Global: Wafer Level Packaging (2.5D TSV WLP) Market: Sales Value (in Million US$), 2015 & 2020
Figure 10: Global: Wafer Level Packaging (2.5D TSV WLP) Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 11: Global: Wafer Level Packaging (WLCSP) Market: Sales Value (in Million US$), 2015 & 2020
Figure 12: Global: Wafer Level Packaging (WLCSP) Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 13: Global: Wafer Level Packaging (Nano WLP) Market: Sales Value (in Million US$), 2015 & 2020
Figure 14: Global: Wafer Level Packaging (Nano WLP) Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 15: Global: Wafer Level Packaging (Others) Market: Sales Value (in Million US$), 2015 & 2020
Figure 16: Global: Wafer Level Packaging (Others) Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 17: Global: Wafer Level Packaging (Aerospace and Defense) Market: Sales Value (in Million US$), 2015 & 2020
Figure 18: Global: Wafer Level Packaging (Aerospace and Defense) Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 19: Global: Wafer Level Packaging (Consumer Electronics) Market: Sales Value (in Million US$), 2015 & 2020
Figure 20: Global: Wafer Level Packaging (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 21: Global: Wafer Level Packaging (IT & Telecommunication) Market: Sales Value (in Million US$), 2015 & 2020
Figure 22: Global: Wafer Level Packaging (IT & Telecommunication) Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 23: Global: Wafer Level Packaging (Healthcare) Market: Sales Value (in Million US$), 2015 & 2020
Figure 24: Global: Wafer Level Packaging (Healthcare) Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 25: Global: Wafer Level Packaging (Automotive) Market: Sales Value (in Million US$), 2015 & 2020
Figure 26: Global: Wafer Level Packaging (Automotive) Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 27: Global: Wafer Level Packaging (Others) Market: Sales Value (in Million US$), 2015 & 2020
Figure 28: Global: Wafer Level Packaging (Others) Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 29: North America: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 30: United States: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 31: United States: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 32: Canada: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 33: Canada: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 34: North America: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 35: Asia-Pacific: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 36: China: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 37: China: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 38: Japan: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 39: Japan: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 40: India: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 41: India: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 42: South Korea: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 43: South Korea: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 44: Australia: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 45: Australia: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 46: Indonesia: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 47: Indonesia: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 48: Others: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 49: Others: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 50: Asia-Pacific: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 51: Europe: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 52: Germany: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 53: Germany: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 54: France: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 55: France: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 56: United Kingdom: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 57: United Kingdom: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 58: Italy: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 59: Italy: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 60: Spain: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 61: Spain: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 62: Russia: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 63: Russia: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 64: Others: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 65: Others: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 66: Europe: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 67: Latin America: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 68: Brazil: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 69: Brazil: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 70: Mexico: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 71: Mexico: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 72: Others: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 73: Others: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 74: Latin America: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 75: Middle East and Africa: Wafer Level Packaging Market: Sales Value (in Million US$), 2015 & 2020
Figure 76: Middle East and Africa: Wafer Level Packaging Market: Breakup by Country (in %), 2020
Figure 77: Middle East and Africa: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2021-2026
Figure 78: Global: Wafer Level Packaging Industry: SWOT Analysis
Figure 79: Global: Wafer Level Packaging Industry: Value Chain Analysis
Figure 80: Global: Wafer Level Packaging Industry: Porter’s Five Forces Analysis

List of Tables
Table 1: Global: Wafer Level Packaging Market: Key Industry Highlights, 2020 and 2026
Table 2: Global: Wafer Level Packaging Market Forecast: Breakup by Packaging Technology (in Million US$), 2021-2026
Table 3: Global: Wafer Level Packaging Market Forecast: Breakup by End Use Industry (in Million US$), 2021-2026
Table 4: Global: Wafer Level Packaging Market Forecast: Breakup by Region (in Million US$), 2021-2026
Table 5: Global: Wafer Level Packaging Market: Competitive Structure
Table 6: Global: Wafer Level Packaging Market: Key Players
Note: Product cover images may vary from those shown
  • Amkor Technology Inc.
  • China Wafer Level CSP Co. Ltd.
  • Chipbond Technology Corporation
  • Deca Technologies Inc. (Infineon Technologies AG)
  • Fujitsu Limited
  • IQE PLC
  • JCET Group Co. Ltd.
  • Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.)
  • Tokyo Electron Ltd.
  • Toshiba Corporation.
Note: Product cover images may vary from those shown

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