The North America Wafer Level Packaging Market is expected to witness market growth of 16.7% CAGR during the forecast period (2022-2028).
Wafer-Level Packaging, also known as WLCSP (Wafer-Level Chip Scale Packaging), is the smallest packaging technology currently available and is provided by OSAT, or Outsourced Semiconductor Assembly and Test, firms such as ASE, Amkor, and others. A real WLP package, on the other hand, is made up of a wafer plus an RDL (Redistribution Layer), interposer, or I/O pitch, all of which function to reorganize the die's pins/contacts such that they are spaced apart and large enough for better and easier handling. Servers, image sensors, high-end supercomputing, gaming consoles, artificial intelligence, as well as IoT (Internet of Things) devices all leverage this innovative technology. Because the WLP approach has not been defined by the industry, there is a range of options to examine. The choice is made based on how much emphasis device manufacturers place on dependability, cost, power consumption, performance, and even form factor.
There are four industries viz. semiconductors, photovoltaic goods, advanced batteries, and pharmaceuticals, that are strategically important to the United States. Integrated circuits are the fundamental components of all electronic products, enabling incredible improvements in information technology that boost productivity across all the regional industries. American supremacy in semiconductors is also critical to technological advancements in the defense sector. photovoltaic cells are the underlying technology of the Solar power and also a vital source of renewable power that can help America's national interests by reducing petroleum dependence and lowering greenhouse gas emissions. Hybrid and electric vehicles rely on advanced batteries and associated electrical management systems in the same way that conventional gasoline-powered vehicles rely on internal combustion engines. As a result, a robust local battery business is considered critical to the regional automotive industry's future competitiveness. Energy-storage devices that are light, long-lasting, and rechargeable are also needed for modern weapons systems being developed by the US military, as well as for conserving renewable energy for utility power grids.
The US market dominated the North America Wafer Level Packaging Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $2,838.6 million by 2028. The Canada market is experiencing a CAGR of 19.4% during (2022 - 2028). Additionally, The Mexico market is expected to display a CAGR of 18.3% during (2022 - 2028).
Based on End User, the market is segmented into Consumer Electronics, Automotive, Healthcare, IT & Telecommunication, and Others. Based on Type, the market is segmented into WLCSP, 2.5D TSV WLP, 3D TSV WLP, Nano WLP, and Others. Based on Technology, the market is segmented into Fan IN and Fan OUT. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include ASML Holding N.V., Fujitsu Limited, Toshiba Corporation, Qualcomm, Inc., Amkor Technology, Inc., Deca Technologies, Inc., Jiangsu Changjing Electronics Technology Co., Ltd., Tokyo Electron Ltd., Applied Materials, Inc., and Lam Research Corporation.
Wafer-Level Packaging, also known as WLCSP (Wafer-Level Chip Scale Packaging), is the smallest packaging technology currently available and is provided by OSAT, or Outsourced Semiconductor Assembly and Test, firms such as ASE, Amkor, and others. A real WLP package, on the other hand, is made up of a wafer plus an RDL (Redistribution Layer), interposer, or I/O pitch, all of which function to reorganize the die's pins/contacts such that they are spaced apart and large enough for better and easier handling. Servers, image sensors, high-end supercomputing, gaming consoles, artificial intelligence, as well as IoT (Internet of Things) devices all leverage this innovative technology. Because the WLP approach has not been defined by the industry, there is a range of options to examine. The choice is made based on how much emphasis device manufacturers place on dependability, cost, power consumption, performance, and even form factor.
There are four industries viz. semiconductors, photovoltaic goods, advanced batteries, and pharmaceuticals, that are strategically important to the United States. Integrated circuits are the fundamental components of all electronic products, enabling incredible improvements in information technology that boost productivity across all the regional industries. American supremacy in semiconductors is also critical to technological advancements in the defense sector. photovoltaic cells are the underlying technology of the Solar power and also a vital source of renewable power that can help America's national interests by reducing petroleum dependence and lowering greenhouse gas emissions. Hybrid and electric vehicles rely on advanced batteries and associated electrical management systems in the same way that conventional gasoline-powered vehicles rely on internal combustion engines. As a result, a robust local battery business is considered critical to the regional automotive industry's future competitiveness. Energy-storage devices that are light, long-lasting, and rechargeable are also needed for modern weapons systems being developed by the US military, as well as for conserving renewable energy for utility power grids.
The US market dominated the North America Wafer Level Packaging Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $2,838.6 million by 2028. The Canada market is experiencing a CAGR of 19.4% during (2022 - 2028). Additionally, The Mexico market is expected to display a CAGR of 18.3% during (2022 - 2028).
Based on End User, the market is segmented into Consumer Electronics, Automotive, Healthcare, IT & Telecommunication, and Others. Based on Type, the market is segmented into WLCSP, 2.5D TSV WLP, 3D TSV WLP, Nano WLP, and Others. Based on Technology, the market is segmented into Fan IN and Fan OUT. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include ASML Holding N.V., Fujitsu Limited, Toshiba Corporation, Qualcomm, Inc., Amkor Technology, Inc., Deca Technologies, Inc., Jiangsu Changjing Electronics Technology Co., Ltd., Tokyo Electron Ltd., Applied Materials, Inc., and Lam Research Corporation.
Scope of the Study
Market Segments Covered in the Report:
By End User
- Consumer Electronics
- Automotive
- Healthcare
- IT & Telecommunication
- Others
ByType
- WLCSP
- 5D TSV WLP
- 3D TSV WLP
- Nano WLP
- Others
By Technology
- Fan IN
- Fan OUT
By Country
- US
- Canada
- Mexico
- Rest of North America
Key Market Players
List of Companies Profiled in the Report:
- ASML Holding N.V.
- Fujitsu Limited
- Toshiba Corporation
- Qualcomm, Inc.
- Amkor Technology, Inc.
- Deca Technologies, Inc.
- Jiangsu Changjing Electronics Technology Co., Ltd.
- Tokyo Electron Ltd.
- Applied Materials, Inc.
- Lam Research Corporation
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Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 3. North America Wafer Level Packaging Market by End User
Chapter 4. North America Wafer Level Packaging Market by Type
Chapter 5. North America Wafer Level Packaging Market by Technology
Chapter 6. North America Wafer Level Packaging Market by Country
Chapter 7. Company Profiles
Companies Mentioned
- ASML Holding N.V.
- Fujitsu Limited
- Toshiba Corporation
- Qualcomm, Inc.
- Amkor Technology, Inc.
- Deca Technologies, Inc.
- Jiangsu Changjing Electronics Technology Co., Ltd.
- Tokyo Electron Ltd.
- Applied Materials, Inc.
- Lam Research Corporation
Methodology
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