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The semiconductor packaging materials market is forecasted to grow by USD 10.19 billion during 2024-2029, accelerating at a CAGR of 5.6% during the forecast period. The report on the semiconductor packaging materials market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.Speak directly to the analyst to clarify any post sales queries you may have.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by increasing miniaturization of electronic devices and growing application of semiconductor ICS in IOT, advanced semiconductor material packaging technologies, and surge in global demand for consumer electronics and smart electronic devices.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market size data, segment with regional analysis and vendor landscape in addition to an analysis of the key companies. Reports have historic and forecast data.
The semiconductor packaging materials market is segmented as below:
By Material
- Organic substrates
- Lead frames
- Bonding wires
- Ceramic packages
- Others
By End-user
- Consumer electronics
- Automotive
- Medical devices
- Communication and telecom
- Others
By Technology
- Grid array
- System-in-package (SIP)
- Others
By Geographical Landscape
- APAC
- North America
- Europe
- South America
- Middle East and Africa
The report on the semiconductor packaging materials market covers the following areas:
- Semiconductor Packaging Materials Market sizing
- Semiconductor Packaging Materials Market forecast
- Semiconductor Packaging Materials Market industry analysis
The report presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive primary and secondary research. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.
Table of Contents
1 Executive Summary
2 Market Analysis
3 Market Landscape
4 Market Sizing
5 Historic Market Size
6 Qualitative Analysis
7 Five Forces Analysis
8 Market Segmentation by Material
9 Market Segmentation by End-user
10 Market Segmentation by Technology
11 Customer Landscape
12 Geographic Landscape
13 Drivers, Challenges, and Opportunity/Restraints
14 Competitive Landscape
15 Competitive Analysis
16 Appendix
List of Exhibits
Executive Summary
The following companies are recognized as the key players in the global semiconductor packaging materials market: Amkor Technology Inc., ASE Technology Holding Co. Ltd., BASF SE, ChipMOS TECHNOLOGIES INC., DuPont de Nemours Inc., Henkel AG and Co. KGaA, Heraeus Holding GmbH, Hitachi Ltd., Honeywell International Inc., Indium Corp., Intel Corp., KYOCERA Corp., LG Innotek Co. Ltd., MITSUI and CO. LTD., Nan Ya Printed Circuit Board Corp., Nippon Steel Corp., Powertech Technology Inc., Samsung Electronics Co. Ltd., Taiwan SEMICONDUCTOR CO. LTD., and Texas Instruments Inc..Commenting on the report, an analyst from the research team said: "The latest trend gaining momentum in the market is increase in adoption of flip-chip, sip, lead-free packaging solutions."
According to the report, one of the major drivers for this market is the increasing miniaturization of electronic devices and growing application of semiconductor ICs in IoT.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Amkor Technology Inc.
- ASE Technology Holding Co. Ltd.
- BASF SE
- ChipMOS TECHNOLOGIES INC.
- DuPont de Nemours Inc.
- Henkel AG and Co. KGaA
- Heraeus Holding GmbH
- Hitachi Ltd.
- Honeywell International Inc.
- Indium Corp.
- Intel Corp.
- KYOCERA Corp.
- LG Innotek Co. Ltd.
- MITSUI and CO. LTD.
- Nan Ya Printed Circuit Board Corp.
- Nippon Steel Corp.
- Powertech Technology Inc.
- Samsung Electronics Co. Ltd.
- TAIWAN SEMICONDUCTOR CO. LTD.
- Texas Instruments Inc.
