The Latin America, Middle East and Africa Molded Interconnect Device (MID) Market is expected to witness market growth of 14.9% CAGR during the forecast period (2022-2028).
The growing use of molded interconnect devices (MID) in medical devices is also driving the molded interconnect device market. The increasing need to reduce e-waste, as well as technological advancement, will drive the molded interconnect device market forward. Moreover, a favorable regulatory environment for the reduction of electronic waste, as well as a growing preference for equipment from different end-use industries like automotive and semiconductors, will be major factors influencing the growth of the molded to interconnect device market.
Over-molded interconnect devices technology, various diagnostic devices such as pulse oximeters, blood pressure monitors, and blood glucose monitors are manufactured. These diagnostics devices benefit from molded interconnect devices technology, which allows for high accuracy, low power consumption, and a small footprint. These devices integrate the connectors, housing, circuit boards, and cables that comprise traditional product interfaces into a single fully functional, compact part. Molded interconnect devices are used in a variety of industries and products, including automotive, medical, tablets, and cell phones.
Mobile telecommunications are the most rapidly spreading technologies in the region. Several trends have shaped the Middle Eastern telecom industry over the last few years. The COVID pandemic did not have a significant negative impact on telecom revenues, although it demonstrated the strength a resilience of telecom networks as they dealt with the unexpected surge in usage. The first and most obvious trend is the growing demand for faster, more dependable technology has continued. The Gulf countries such as the United Arab Emirates, Saudi Arabia, and Qatar have been at the forefront of commercializing 5G technology.
The Brazil market dominated the LAMEA Molded Interconnect Device (MID) Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $47.3 Million by 2028. The Argentina market is expected to exhibit a CAGR of 15.5% during (2022 - 2028). Additionally, The UAE market is expected to experience a CAGR of 14.6% during (2022 - 2028).
Based on Product Type, the market is segmented into Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems and Others. Based on Process, the market is segmented into Laser Direct Structuring (LDS), Two-Shot Molding and Film Techniques. Based on Vertical, the market is segmented into Consumer Electronics, Telecommunications, Automotive, Medical, Industrial and Military & Aerospace. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Molex, LLC (Koch Industries, Inc.), TE Connectivity Ltd., Taoglas, KYOCERA AVX Components Corporation (Kyocera Corporation), Amphenol Corporation, LPKF Laser & Electronics AG, HARTING Technology Group, MID Solutions GmbH, and 2E mechatronic GmbH & Co. KG
The growing use of molded interconnect devices (MID) in medical devices is also driving the molded interconnect device market. The increasing need to reduce e-waste, as well as technological advancement, will drive the molded interconnect device market forward. Moreover, a favorable regulatory environment for the reduction of electronic waste, as well as a growing preference for equipment from different end-use industries like automotive and semiconductors, will be major factors influencing the growth of the molded to interconnect device market.
Over-molded interconnect devices technology, various diagnostic devices such as pulse oximeters, blood pressure monitors, and blood glucose monitors are manufactured. These diagnostics devices benefit from molded interconnect devices technology, which allows for high accuracy, low power consumption, and a small footprint. These devices integrate the connectors, housing, circuit boards, and cables that comprise traditional product interfaces into a single fully functional, compact part. Molded interconnect devices are used in a variety of industries and products, including automotive, medical, tablets, and cell phones.
Mobile telecommunications are the most rapidly spreading technologies in the region. Several trends have shaped the Middle Eastern telecom industry over the last few years. The COVID pandemic did not have a significant negative impact on telecom revenues, although it demonstrated the strength a resilience of telecom networks as they dealt with the unexpected surge in usage. The first and most obvious trend is the growing demand for faster, more dependable technology has continued. The Gulf countries such as the United Arab Emirates, Saudi Arabia, and Qatar have been at the forefront of commercializing 5G technology.
The Brazil market dominated the LAMEA Molded Interconnect Device (MID) Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $47.3 Million by 2028. The Argentina market is expected to exhibit a CAGR of 15.5% during (2022 - 2028). Additionally, The UAE market is expected to experience a CAGR of 14.6% during (2022 - 2028).
Based on Product Type, the market is segmented into Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems and Others. Based on Process, the market is segmented into Laser Direct Structuring (LDS), Two-Shot Molding and Film Techniques. Based on Vertical, the market is segmented into Consumer Electronics, Telecommunications, Automotive, Medical, Industrial and Military & Aerospace. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Molex, LLC (Koch Industries, Inc.), TE Connectivity Ltd., Taoglas, KYOCERA AVX Components Corporation (Kyocera Corporation), Amphenol Corporation, LPKF Laser & Electronics AG, HARTING Technology Group, MID Solutions GmbH, and 2E mechatronic GmbH & Co. KG
Scope of the Study
Market Segments Covered in the Report:
By Product Type- Antennae & Connectivity Modules
- Sensors
- Connectors & Switches
- Lighting Systems
- Others
- Laser Direct Structuring (LDS)
- Two-Shot Molding
- Film Techniques
- Consumer Electronics
- Telecommunications
- Automotive
- Medical
- Industrial
- Military & Aerospace
- Brazil
- Argentina
- UAE
- Saudi Arabia
- South Africa
- Nigeria
- Rest of LAMEA
Key Market Players
List of Companies Profiled in the Report:
- Molex, LLC (Koch Industries, Inc.)
- TE Connectivity Ltd.
- Taoglas
- KYOCERA AVX Components Corporation (Kyocera Corporation)
- Amphenol Corporation
- LPKF Laser & Electronics AG
- HARTING Technology Group
- MID Solutions GmbH
- 2E mechatronic GmbH & Co. KG
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Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 3. LAMEA Molded Interconnect Device (MID) Market by Product Type
Chapter 4. LAMEA Molded Interconnect Device (MID) Market by Process
Chapter 5. LAMEA Molded Interconnect Device (MID) Market by Vertical
Chapter 6. LAMEA Molded Interconnect Device (MID) Market by Country
Chapter 7. Company Profiles
Companies Mentioned
- Molex, LLC (Koch Industries, Inc.)
- TE Connectivity Ltd.
- Taoglas
- KYOCERA AVX Components Corporation (Kyocera Corporation)
- Amphenol Corporation
- LPKF Laser & Electronics AG
- HARTING Technology Group
- MID Solutions GmbH
- 2E mechatronic GmbH & Co. KG
Methodology
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