Results for tag: "Molded Interconnect Device"

The Molded Interconnect Device (MID) market is a subset of the plastics industry. It involves the use of injection molding to create components with integrated electrical and mechanical features. MIDs are used in a variety of applications, including automotive, consumer electronics, medical, and industrial. They are typically made from thermoplastics, such as polycarbonate, polyamide, and polyphenylene sulfide. MIDs offer several advantages over traditional components, such as improved performance, reduced weight, and cost savings. They also provide greater design flexibility, allowing for the integration of multiple components into a single device. This can reduce assembly time and complexity, as well as improve reliability. Several companies are involved in the MID market, including 3D Systems, BASF, Covestro, DSM, Henkel, and TE Connectivity. These companies offer a range of products, including injection molding machines, materials, and components. They also provide design and engineering services to help customers develop custom solutions. Show Less Read more