The Asia Pacific Molded Interconnect Device (MID) Market is expected to witness market growth of 14.2% CAGR during the forecast period (2022-2028).
MIDs provide design flexibility, which aids in product space savings by eliminating the need for additional components. This contributes to the overall weight reduction of the product. It also aids in reducing assembly times and the number of production steps by integrating sensors and circuits. This is expected to reduce additional costs while also enabling high-quality component manufacturing.
Additionally, most thermoplastics benefit from two-shot injection molding. Because the procedure involves the use of soft-touch surfaces, the finished products can have ergonomic handles or other components. This is especially true for tools, medical equipment, and other portable items. When silicone plastics or other rubbery substances are used for gaskets and other parts that need a strong seal, it provides a better seal. The bond formed is extremely strong, resulting in a good or service which is more durable, reliable, and has a longer life.
The growing number of 5G subscribers in China is expected to boost the adoption of new 5G-based devices. LDS process technology advancements by major leaders like Amphenol, Tongda Group, LPKF Laser & Electronics, and Molex is expected to further contribute to the market growth. Further, Asian countries such as China and Japan are among the major manufacturers of consumer electronics. The demand for smartphones in India is growing due to factors including expanding telecom infrastructure, the presence of affordable smartphones, and an increase in the number of product launches.
The China market dominated the Asia Pacific Molded Interconnect Device (MID) Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $296 Million by 2028, growing at a CAGR of 12.1 % during the forecast period. The Japan market is anticipated to grow at a CAGR of 13.5% during (2022 - 2028). Additionally, The India market is poised to grow at a CAGR of 14.9% during (2022 - 2028).
Based on Product Type, the market is segmented into Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems and Others. Based on Process, the market is segmented into Laser Direct Structuring (LDS), Two-Shot Molding and Film Techniques. Based on Vertical, the market is segmented into Consumer Electronics, Telecommunications, Automotive, Medical, Industrial and Military & Aerospace. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Molex, LLC (Koch Industries, Inc.), TE Connectivity Ltd., Taoglas, KYOCERA AVX Components Corporation (Kyocera Corporation), Amphenol Corporation, LPKF Laser & Electronics AG, HARTING Technology Group, MID Solutions GmbH, and 2E mechatronic GmbH & Co. KG
MIDs provide design flexibility, which aids in product space savings by eliminating the need for additional components. This contributes to the overall weight reduction of the product. It also aids in reducing assembly times and the number of production steps by integrating sensors and circuits. This is expected to reduce additional costs while also enabling high-quality component manufacturing.
Additionally, most thermoplastics benefit from two-shot injection molding. Because the procedure involves the use of soft-touch surfaces, the finished products can have ergonomic handles or other components. This is especially true for tools, medical equipment, and other portable items. When silicone plastics or other rubbery substances are used for gaskets and other parts that need a strong seal, it provides a better seal. The bond formed is extremely strong, resulting in a good or service which is more durable, reliable, and has a longer life.
The growing number of 5G subscribers in China is expected to boost the adoption of new 5G-based devices. LDS process technology advancements by major leaders like Amphenol, Tongda Group, LPKF Laser & Electronics, and Molex is expected to further contribute to the market growth. Further, Asian countries such as China and Japan are among the major manufacturers of consumer electronics. The demand for smartphones in India is growing due to factors including expanding telecom infrastructure, the presence of affordable smartphones, and an increase in the number of product launches.
The China market dominated the Asia Pacific Molded Interconnect Device (MID) Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $296 Million by 2028, growing at a CAGR of 12.1 % during the forecast period. The Japan market is anticipated to grow at a CAGR of 13.5% during (2022 - 2028). Additionally, The India market is poised to grow at a CAGR of 14.9% during (2022 - 2028).
Based on Product Type, the market is segmented into Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems and Others. Based on Process, the market is segmented into Laser Direct Structuring (LDS), Two-Shot Molding and Film Techniques. Based on Vertical, the market is segmented into Consumer Electronics, Telecommunications, Automotive, Medical, Industrial and Military & Aerospace. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Molex, LLC (Koch Industries, Inc.), TE Connectivity Ltd., Taoglas, KYOCERA AVX Components Corporation (Kyocera Corporation), Amphenol Corporation, LPKF Laser & Electronics AG, HARTING Technology Group, MID Solutions GmbH, and 2E mechatronic GmbH & Co. KG
Scope of the Study
Market Segments Covered in the Report:
By Product Type- Antennae & Connectivity Modules
- Sensors
- Connectors & Switches
- Lighting Systems
- Others
- Laser Direct Structuring (LDS)
- Two-Shot Molding
- Film Techniques
- Consumer Electronics
- Telecommunications
- Automotive
- Medical
- Industrial
- Military & Aerospace
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Key Market Players
List of Companies Profiled in the Report:
- Molex, LLC (Koch Industries, Inc.)
- TE Connectivity Ltd.
- Taoglas
- KYOCERA AVX Components Corporation (Kyocera Corporation)
- Amphenol Corporation
- LPKF Laser & Electronics AG
- HARTING Technology Group
- MID Solutions GmbH
- 2E mechatronic GmbH & Co. KG
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Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 3. Asia Pacific Molded Interconnect Device (MID) Market by Product Type
Chapter 4. Asia Pacific Molded Interconnect Device (MID) Market by Process
Chapter 5. Asia Pacific Molded Interconnect Device (MID) Market by Vertical
Chapter 6. Asia Pacific Molded Interconnect Device (MID) Market by Country
Chapter 7. Company Profiles
Companies Mentioned
- Molex, LLC (Koch Industries, Inc.)
- TE Connectivity Ltd.
- Taoglas
- KYOCERA AVX Components Corporation (Kyocera Corporation)
- Amphenol Corporation
- LPKF Laser & Electronics AG
- HARTING Technology Group
- MID Solutions GmbH
- 2E mechatronic GmbH & Co. KG
Methodology
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