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Asia Pacific Hardware Security Modules Market Size, Share & Industry Trends Analysis Report by Deployment Type (Cloud and On-premise), Application, Type, Vertical, Country and Growth Forecast, 2022-2028

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    Report

  • 129 Pages
  • October 2022
  • Region: Asia Pacific
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5694747

The Asia Pacific Hardware Security Modules Market should witness market growth of 13.6% CAGR during the forecast period (2022-2028).

An HSM's functions include onboard secure cryptographic key generation, onboard secure cryptographic key storage, at least for the highest level and most sensitive keys, which are frequently referred to as master keys, key management, use of cryptographic and sensitive data material, such as performing encryption and digital signature functions or offloading application servers for complete asymmetric and symmetric cryptography.

HSMs are also used to maintain transparent and secure data encryption keys for databases and storage device keys, such as disk and tape. HSMs offer both physical and logical protection against disclosure, unauthorized use, and possible adversaries for these resources, including cryptographic keys. Both symmetric as well as asymmetric (public-key) cryptography are supported by HSMs. The cryptographic material for some applications, such as certificate authorities and digital signatures, consists of asymmetric key pairs (as well as certificates) used in public-key cryptography.

The cryptographic material for other applications, like data encryption and financial payment systems, consists mostly of symmetric keys. Some HSM systems are cryptographic hardware accelerators. In most cases, they cannot outperform hardware-only solutions for symmetric core functions. HSMs may provide considerable CPU offload for asymmetric key operations with performance ranging from 1 to 10,000 1024-bit RSA signatures per second. The importance of performance at greater key sizes has increased. In response to this concern, the majority of HSMs now offer elliptic curve cryptography (ECC), which provides better encryption with lower key lengths.

India is going under rapid digitalization in recent years as the country is growing at an exponential rate. The digital infrastructure is the foundation of wealthy economies, thriving research communities, a formidable military, transparent governments, and a free society. Every day, millions of people throughout India rely on cyberspace's electronic services. Owing to the very high dependability on connectivity and networks, the demand for enhanced cybersecurity infrastructure is increasing and the Indian government is increasingly focusing on it. This factor is stimulating the growth of the regional hardware security module market.

The China market dominated the Asia Pacific Hardware Security Modules Market by Country in 2021; thereby, achieving a market value of $179.1 million by 2028. The Japan market is registering a CAGR of 12.9% during (2022-2028). Additionally, The India market would showcase a CAGR of 14.3% during (2022-2028).

Based on Deployment Type, the market is segmented into Cloud and On-premise. Based on Application, the market is segmented into Payment Processing, Authentication, Database Encryption, Code & Document Signing, Application-level encryption, PKI & Credential Management, and Security Sockets Layer (SSL) & Transport Security Layer (TSL). Based on Type, the market is segmented into LAN Based/ Network Attached, PCI-Based/ Embedded Plugins, and USB Based/ Portable & Smart Cards. Based on Vertical, the market is segmented into BFSI, Public Sector/ Government, Aerospace & Defense, and Medical & Life Sciences. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Microsoft Corporation, Amazon.com, Inc., IBM Corporation, Microchip Technology, Inc., Thales Group S.A., Atos Group, Futurex LP, STMicroelectronics N.V., Lattice Semiconductor Corporation and Infineon Technologies AG


Scope of the Study


By Deployment Type


  • Cloud
  • On-premise

By Application


  • Payment Processing
  • Authentication
  • Database Encryption
  • Code & Document Signing
  • Application-level encryption
  • PKI & Credential Management
  • Security Sockets Layer (SSL) & Transport Security Layer (TSL)

By Type


  • LAN Based/ Network Attached
  • PCI-Based/ Embedded Plugins
  • USB Based/ Portable & Smart Cards

By Vertical


  • BFSI
  • Public Sector/ Government
  • Aerospace & Defense
  • Medical & Life Sciences

By Country


  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific

Key Market Players


List of Companies Profiled in the Report:


  • Microsoft Corporation
  • com, Inc.
  • IBM Corporation
  • Microchip Technology, Inc.
  • Thales Group S.A.
  • Atos Group
  • Futurex LP
  • STMicroelectronics N.V.
  • Lattice Semiconductor Corporation
  • Infineon Technologies AG

Unique Offerings


  • Exhaustive coverage
  • The highest number of market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Hardware Security Modules Market, by Deployment Type
1.4.2 Asia Pacific Hardware Security Modules Market, by Application
1.4.3 Asia Pacific Hardware Security Modules Market, by Type
1.4.4 Asia Pacific Hardware Security Modules Market, by Vertical
1.4.5 Asia Pacific Hardware Security Modules Market, by Country
1.5 Research Methodology
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis - Global
3.1 Market Share Analysis, 2021
3.2 Strategies deployed in Hardware Security Modules Market
Chapter 4. Asia Pacific Hardware Security Modules Market by Deployment Type
4.1 Asia Pacific Cloud Market by Country
4.2 Asia Pacific On-premise Market by Country
Chapter 5. Asia Pacific Hardware Security Modules Market by Application
5.1 Asia Pacific Payment Processing Market by Country
5.2 Asia Pacific Authentication Market by Country
5.3 Asia Pacific Database Encryption Market by Country
5.4 Asia Pacific Code & Document Signing Market by Country
5.5 Asia Pacific Application-level encryption Market by Country
5.6 Asia Pacific PKI & Credential Management Market by Country
5.7 Asia Pacific Security Sockets Layer (SSL) & Transport Security Layer (TSL) Market by Country
Chapter 6. Asia Pacific Hardware Security Modules Market by Type
6.1 Asia Pacific LAN Based/ Network Attached Market by Country
6.2 Asia Pacific PCI-Based/ Embedded Pluggins Market by Country
6.3 Asia Pacific USB Based/ Portable & Smart Cards Market by Country
Chapter 7. Asia Pacific Hardware Security Modules Market by Vertical
7.1 Asia Pacific BFSI Market by Country
7.2 Asia Pacific Public Sector/ Government Market by Country
7.3 Asia Pacific Aerospace & Defense Market by Country
7.4 Asia Pacific Medical & Life Sciences Market by Country
7.5 Asia Pacific Consumer Goods & Retail Market by Country
7.6 Asia Pacific Industrial Manufacturing Market by Country
7.7 Asia Pacific Power & Energy Market by Country
7.8 Asia Pacific IT & Telecommunications Market by Country
7.9 Asia Pacific Transportation Market by Country
Chapter 8. Asia Pacific Hardware Security Modules Market by Country
8.1 China Hardware Security Modules Market
8.1.1 China Hardware Security Modules Market by Deployment Type
8.1.2 China Hardware Security Modules Market by Application
8.1.3 China Hardware Security Modules Market by Type
8.1.4 China Hardware Security Modules Market by Vertical
8.2 Japan Hardware Security Modules Market
8.2.1 Japan Hardware Security Modules Market by Deployment Type
8.2.2 Japan Hardware Security Modules Market by Application
8.2.3 Japan Hardware Security Modules Market by Type
8.2.4 Japan Hardware Security Modules Market by Vertical
8.3 India Hardware Security Modules Market
8.3.1 India Hardware Security Modules Market by Deployment Type
8.3.2 India Hardware Security Modules Market by Application
8.3.3 India Hardware Security Modules Market by Type
8.3.4 India Hardware Security Modules Market by Vertical
8.4 South Korea Hardware Security Modules Market
8.4.1 South Korea Hardware Security Modules Market by Deployment Type
8.4.2 South Korea Hardware Security Modules Market by Application
8.4.3 South Korea Hardware Security Modules Market by Type
8.4.4 South Korea Hardware Security Modules Market by Vertical
8.5 Singapore Hardware Security Modules Market
8.5.1 Singapore Hardware Security Modules Market by Deployment Type
8.5.2 Singapore Hardware Security Modules Market by Application
8.5.3 Singapore Hardware Security Modules Market by Type
8.5.4 Singapore Hardware Security Modules Market by Vertical
8.6 Malaysia Hardware Security Modules Market
8.6.1 Malaysia Hardware Security Modules Market by Deployment Type
8.6.2 Malaysia Hardware Security Modules Market by Application
8.6.3 Malaysia Hardware Security Modules Market by Type
8.6.4 Malaysia Hardware Security Modules Market by Vertical
8.7 Rest of Asia Pacific Hardware Security Modules Market
8.7.1 Rest of Asia Pacific Hardware Security Modules Market by Deployment Type
8.7.2 Rest of Asia Pacific Hardware Security Modules Market by Application
8.7.3 Rest of Asia Pacific Hardware Security Modules Market by Type
8.7.4 Rest of Asia Pacific Hardware Security Modules Market by Vertical
Chapter 9. Company Profiles
9.1 Microsoft Corporation
9.1.1 Company Overview
9.1.2 Financial Analysis
9.1.3 Segmental and Regional Analysis
9.1.4 Research & Development Expenses
9.1.5 SWOT Analysis
9.2 Amazon.com, Inc.
9.2.1 Company Overview
9.2.2 Financial Analysis
9.2.3 Segmental Analysis
9.2.4 SWOT Analysis
9.3 IBM Corporation
9.3.1 Company Overview
9.3.2 Financial Analysis
9.3.3 Regional & Segmental Analysis
9.3.4 Research & Development Expenses
9.3.5 Recent Strategies and Developments
9.3.5.1 Acquisition and Mergers
9.3.6 SWOT Analysis
9.4 Atos Group
9.4.1 Company Overview
9.4.2 Financial Analysis
9.4.3 Segmental Analysis
9.4.4 Recent Strategies and Developments
9.4.4.1 Product Launches and Product Expansions
9.4.5 SWOT Analysis
9.5 STMicroelectronics N.V.
9.5.1 Company Overview
9.5.2 Financial Analysis
9.5.3 Segmental and Regional Analysis
9.5.4 Research & Development Expense
9.5.5 Recent Strategies and Developments
9.5.5.1 Partnerships, Collaborations, and Agreements
9.5.5.2 Product Launches and Product Expansions
9.5.6 SWOT Analysis
9.6 Infineon Technologies AG
9.6.1 Company Overview
9.6.2 Financial Analysis
9.6.3 Segmental and Regional Analysis
9.6.4 Research & Development Expense
9.6.5 Recent Strategies and Developments
9.6.5.1 Product Launches and Product Expansions
9.6.6 SWOT Analysis
9.7 Microchip Technology, Inc.
9.7.1 Company overview
9.7.2 Financial Analysis
9.7.3 Segmental and Regional Analysis
9.7.4 Research & Development Expenses
9.7.5 Recent Strategies and Developments
9.7.5.1 Product Launches and Product Expansions
9.8 Thales Group S.A.
9.8.1 Company Overview
9.8.2 Financial Analysis
9.8.3 Segmental and Regional Analysis
9.8.4 Research and Development Expense
9.8.5 Recent Strategies and Developments
9.8.5.1 Acquisition and Mergers
9.9 Lattice Semiconductor Corporation
9.9.1 Company Overview
9.9.2 Financial Analysis
9.9.3 Regional Analysis
9.9.4 Research & Development Expenses
9.10. Futurex LP
9.10.1 Company Overview
9.10.2 Recent Strategies and Developments
9.10.2.1 Product Launches and Product Expansions

Companies Mentioned

  • Microsoft Corporation
  • Amazon.com, Inc.
  • IBM Corporation
  • Microchip Technology, Inc.
  • Thales Group S.A.
  • Atos Group
  • Futurex LP
  • STMicroelectronics N.V.
  • Lattice Semiconductor Corporation
  • Infineon Technologies AG

Methodology

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