+353-1-416-8900REST OF WORLD
+44-20-3973-8888REST OF WORLD
1-917-300-0470EAST COAST U.S
1-800-526-8630U.S. (TOLL FREE)
New

Asia Pacific Through-hole Passive Components Market Size, Share & Industry Trends Analysis Report By Leads Model (Axial and Radial), By Application, By Component (Capacitors, Resistors, Inductors, Sensors, Diodes, Transducers), By Country and Growth Forecast, 2022 - 2028

  • PDF Icon

    Report

  • 98 Pages
  • December 2022
  • Region: Asia Pacific
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5723447
The Asia Pacific Through-hole Passive Components Market should witness market growth of 6.3% CAGR during the forecast period (2022-2028).

The prominent factor that is increasing the demand for through-hole passive components is the rising technological advancements in electrical and electronic devices, especially in consumer electronics. In addition, the demand from customers for sleek, thin, edge-to-edge screen coverage and low-price gadgets has boosted the trend of miniaturization.

An example of this is the application of MEMS gyroscopes in smartphones, which have achieved significant success owing to their small size, lightweight, and low price. Moreover, the recent increment in the popularity of features like voice assistants in smart devices has further increased the electronic systems’ complexities, which is favorable for the market.

In addition, prominent technologies like 5G, which are assumed to be an integral part of future devices, require larger processors, batteries, and multiple antennas. This will increase the demand for devices like large processors and radios and consecutively raise the application of through-hole passive components. Manufacturers of 5G chips are demanding package designs in smaller sizes with resistance or capacitance similar to that of larger and older versions.

In this region, various government initiatives are the primary driving forces behind the increasing demand for passive components. The growing regional electronics industry is facilitating the setup of manufacturing plants. For example, the ambition of the South Korean government to create smart industrial zones and facilitate the operation of thousands of smart factories has raised the demand for electronic parts in the nation. Additionally, technological advancements like the expeditious penetration of smartphones along with the rising number of smartphone users which is further increasing the demand for passive components.

The China market dominated the Asia Pacific Through-hole Passive Components Market by Country in 2021; thereby, achieving a market value of $5, 663.3 million by 2028. The Japan market is registering a CAGR of 5.6% during (2022-2028). Additionally, The India market would showcase a CAGR of 7% during (2022-2028).

Based on Leads Model, the market is segmented into Axial and Radial. Based on Application, the market is segmented into Consumer Electronics, Automotive, Industrial, IT & Telecom, Aerospace & Defense, Healthcare & Life Sciences and Others. Based on Component, the market is segmented into Capacitors, Resistors, Inductors, Sensors, Diodes, Transducers and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Vishay Intertechnology, Inc., Yageo Corporation, Murata Manufacturing Co., Ltd., KYOCERA AVX Components Corporation (Kyocera Corporation), Panasonic Corporation, Bourns, Inc., TDK Corporation, TE Connectivity and Microchip Technology, Inc.

Scope of the Study

By Leads Model

  • Axial
  • Radial

By Application

  • Consumer Electronics
  • Automotive
  • Industrial
  • IT & Telecom
  • Aerospace & Defense
  • Healthcare & Life Sciences
  • Others

By Component

  • Capacitors
  • Resistors
  • Inductors
  • Sensors
  • Diodes
  • Transducers
  • Others

By Country

  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific

Key Market Players

List of Companies Profiled in the Report:

  • Vishay Intertechnology, Inc
  • Yageo Corporation
  • Murata Manufacturing Co., Ltd.
  • KYOCERA AVX Components Corporation (Kyocera Corporation)
  • Panasonic Corporation
  • Bourns, Inc.
  • TDK Corporation
  • TE Connectivity
  • Microchip Technology, Inc.

Unique Offerings

  • Exhaustive coverage
  • The highest number of market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Through-hole Passive Components Market, by Leads Model
1.4.2 Asia Pacific Through-hole Passive Components Market, by Application
1.4.3 Asia Pacific Through-hole Passive Components Market, by Component
1.4.4 Asia Pacific Through-hole Passive Components Market, by Country
1.5 Methodology for the research

Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints

Chapter 3. Asia Pacific Through-hole Passive Components Market by Leads Model
3.1 Asia Pacific Axial Market by Country
3.2 Asia Pacific Radial Market by Country

Chapter 4. Asia Pacific Through-hole Passive Components Market by Application
4.1 Asia Pacific Consumer Electronics Market by Country
4.2 Asia Pacific Automotive Market by Country
4.3 Asia Pacific Industrial Market by Country
4.4 Asia Pacific IT & Telecom Market by Country
4.5 Asia Pacific Aerospace & Defense Market by Country
4.6 Asia Pacific Healthcare & Life Sciences Market by Country
4.7 Asia Pacific Other Application Market by Country

Chapter 5. Asia Pacific Through-hole Passive Components Market by Component
5.1 Asia Pacific Capacitors Market by Country
5.2 Asia Pacific Resistors Market by Country
5.3 Asia Pacific Inductors Market by Country
5.4 Asia Pacific Sensors Market by Country
5.5 Asia Pacific Diodes Market by Country
5.6 Asia Pacific Transducers Market by Country
5.7 Asia Pacific Others Market by Country

Chapter 6. Asia Pacific Through-hole Passive Components Market by Country
6.1 China Through-hole Passive Components Market
6.1.1 China Through-hole Passive Components Market by Leads Model
6.1.2 China Through-hole Passive Components Market by Application
6.1.3 China Through-hole Passive Components Market by Component
6.2 Japan Through-hole Passive Components Market
6.2.1 Japan Through-hole Passive Components Market by Leads Model
6.2.2 Japan Through-hole Passive Components Market by Application
6.2.3 Japan Through-hole Passive Components Market by Component
6.3 India Through-hole Passive Components Market
6.3.1 India Through-hole Passive Components Market by Leads Model
6.3.2 India Through-hole Passive Components Market by Application
6.3.3 India Through-hole Passive Components Market by Component
6.4 South Korea Through-hole Passive Components Market
6.4.1 South Korea Through-hole Passive Components Market by Leads Model
6.4.2 South Korea Through-hole Passive Components Market by Application
6.4.3 South Korea Through-hole Passive Components Market by Component
6.5 Singapore Through-hole Passive Components Market
6.5.1 Singapore Through-hole Passive Components Market by Leads Model
6.5.2 Singapore Through-hole Passive Components Market by Application
6.5.3 Singapore Through-hole Passive Components Market by Component
6.6 Malaysia Through-hole Passive Components Market
6.6.1 Malaysia Through-hole Passive Components Market by Leads Model
6.6.2 Malaysia Through-hole Passive Components Market by Application
6.6.3 Malaysia Through-hole Passive Components Market by Component
6.7 Rest of Asia Pacific Through-hole Passive Components Market
6.7.1 Rest of Asia Pacific Through-hole Passive Components Market by Leads Model
6.7.2 Rest of Asia Pacific Through-hole Passive Components Market by Application
6.7.3 Rest of Asia Pacific Through-hole Passive Components Market by Component

Chapter 7. Company Profiles
7.1 Panasonic Corporation
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.4 Research & Development Expense
7.1.5 SWOT Analysis
7.2 TE Connectivity Ltd.
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expense
7.2.5 SWOT Analysis
7.3 TDK Corporation
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional & Segmental Analysis
7.3.4 Research & Development Expenses
7.4 Yageo Corporation
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Regional and Segmental Analysis
7.4.4 Recent strategies and developments:
7.4.4.1 Acquisition and Mergers:
7.5 Microchip Technology, Inc.
7.5.1 Company overview
7.5.2 Financial Analysis
7.5.3 Segmental and Regional Analysis
7.5.4 Research & Development Expenses
7.6 Murata Manufacturing Co., Ltd.
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 Research & Development Expense
7.7 Vishay Intertechnology, Inc.
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental and Regional Analysis
7.7.4 Research and Development Expense
7.7.5 Recent strategies and developments:
7.7.5.1 Product Launches and Product Expansions:
7.8 KYOCERA AVX Components Corporation (Kyocera Corporation)
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expense
7.9 Bourns, Inc.
7.9.1 Company Overview

Companies Mentioned

  • Vishay Intertechnology, Inc
  • Yageo Corporation
  • Murata Manufacturing Co., Ltd.
  • KYOCERA AVX Components Corporation (Kyocera Corporation)
  • Panasonic Corporation
  • Bourns, Inc.
  • TDK Corporation
  • TE Connectivity
  • Microchip Technology, Inc.

Methodology

Loading
LOADING...