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North America Through-hole Passive Components Market Size, Share & Industry Trends Analysis Report By Leads Model (Axial and Radial), By Application, By Component (Capacitors, Resistors, Inductors, Sensors, Diodes, Transducers), By Country and Growth Forecast, 2022 - 2028

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    Report

  • 85 Pages
  • December 2022
  • Region: North America
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5723450
The North America Through-hole Passive Components Market should witness market growth of 5.7% CAGR during the forecast period (2022-2028).

The passive electronic industry has witnessed substantial development in the last few years. Much of this development is attributable to rising digitalization across numerous sectors, which has also facilitated the expansion of the consumer electronics industries along with the surge in demand for mobility and connectivity.

Consequently, the complexity and sophistication of electronic products have increased. Such developments also propel the demand for passive components in the industries like automotive and electronics. Furthermore, passive components are also required in devices that have to endure extreme temperatures, dust, liquid resistance requirements, vibration ratings, etc.

Hence, these equipment are extensively used in the oil & gas and aerospace industries as well. Additionally, the gradual growth of passive components like inductors is due to the rising product launches, developments in the consumer devices and electronics industry, increasing inductor use in automotive electronics, and the rising implementation of smart grids.

The United States has one of the biggest automotive industries in this region. To meet the requirement of statutory emission standards, there is immense pressure on manufacturers to develop efficient engine technology. Such elements have a considerable effect on the development of the electric vehicles sector. Additionally, the region has a sizeable number of OEMs that are establishing supportive policies that are in favor of the growth of electric vehicles. Furthermore, the younger generations heightened interest in luxury vehicles is creating a robust opportunity for this industry.

The US market dominated the North America Through-hole Passive Components Market by Country in 2021; thereby, achieving a market value of $10, 241.1 million by 2028. The Canada market is experiencing a CAGR of 8.1% during (2022-2028). Additionally, The Mexico market would exhibit a CAGR of 7.1% during (2022-2028).

Based on Leads Model, the market is segmented into Axial and Radial. Based on Application, the market is segmented into Consumer Electronics, Automotive, Industrial, IT & Telecom, Aerospace & Defense, Healthcare & Life Sciences and Others. Based on Component, the market is segmented into Capacitors, Resistors, Inductors, Sensors, Diodes, Transducers and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Vishay Intertechnology, Inc., Yageo Corporation, Murata Manufacturing Co., Ltd., KYOCERA AVX Components Corporation (Kyocera Corporation), Panasonic Corporation, Bourns, Inc., TDK Corporation, TE Connectivity and Microchip Technology, Inc.

Scope of the Study

By Leads Model

  • Axial
  • Radial

By Application

  • Consumer Electronics
  • Automotive
  • Industrial
  • IT & Telecom
  • Aerospace & Defense
  • Healthcare & Life Sciences
  • Others

By Component

  • Capacitors
  • Resistors
  • Inductors
  • Sensors
  • Diodes
  • Transducers
  • Others

By Country

  • US
  • Canada
  • Mexico
  • Rest of North America

Key Market Players

List of Companies Profiled in the Report:

  • Vishay Intertechnology, Inc
  • Yageo Corporation
  • Murata Manufacturing Co., Ltd.
  • KYOCERA AVX Components Corporation (Kyocera Corporation)
  • Panasonic Corporation
  • Bourns, Inc.
  • TDK Corporation
  • TE Connectivity
  • Microchip Technology, Inc.

Unique Offerings

  • Exhaustive coverage
  • The highest number of market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Through-hole Passive Components Market, by Leads Model
1.4.2 North America Through-hole Passive Components Market, by Application
1.4.3 North America Through-hole Passive Components Market, by Component
1.4.4 North America Through-hole Passive Components Market, by Country
1.5 Methodology for the research

Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints

Chapter 3. North America Through-hole Passive Components Market by Leads Model
3.1 North America Axial Market by Country
3.2 North America Radial Market by Country

Chapter 4. North America Through-hole Passive Components Market by Application
4.1 North America Consumer Electronics Market by Country
4.2 North America Automotive Market by Country
4.3 North America Industrial Market by Country
4.4 North America IT & Telecom Market by Country
4.5 North America Aerospace & Defense Market by Country
4.6 North America Healthcare & Life Sciences Market by Country
4.7 North America Other Application Market by Country

Chapter 5. North America Through-hole Passive Components Market by Component
5.1 North America Capacitors Market by Country
5.2 North America Resistors Market by Country
5.3 North America Inductors Market by Country
5.4 North America Sensors Market by Country
5.5 North America Diodes Market by Country
5.6 North America Transducers Market by Country
5.7 North America Others Market by Country

Chapter 6. North America Through-hole Passive Components Market by Country
6.1 US Through-hole Passive Components Market
6.1.1 US Through-hole Passive Components Market by Leads Model
6.1.2 US Through-hole Passive Components Market by Application
6.1.3 US Through-hole Passive Components Market by Component
6.2 Canada Through-hole Passive Components Market
6.2.1 Canada Through-hole Passive Components Market by Leads Model
6.2.2 Canada Through-hole Passive Components Market by Application
6.2.3 Canada Through-hole Passive Components Market by Component
6.3 Mexico Through-hole Passive Components Market
6.3.1 Mexico Through-hole Passive Components Market by Leads Model
6.3.2 Mexico Through-hole Passive Components Market by Application
6.3.3 Mexico Through-hole Passive Components Market by Component
6.4 Rest of North America Through-hole Passive Components Market
6.4.1 Rest of North America Through-hole Passive Components Market by Leads Model
6.4.2 Rest of North America Through-hole Passive Components Market by Application
6.4.3 Rest of North America Through-hole Passive Components Market by Component

Chapter 7. Company Profiles
7.1 Panasonic Corporation
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.4 Research & Development Expense
7.1.5 SWOT Analysis
7.2 TE Connectivity Ltd.
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expense
7.2.5 SWOT Analysis
7.3 TDK Corporation
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional & Segmental Analysis
7.3.4 Research & Development Expenses
7.4 Yageo Corporation
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Regional and Segmental Analysis
7.4.4 Recent strategies and developments:
7.4.4.1 Acquisition and Mergers:
7.5 Microchip Technology, Inc.
7.5.1 Company overview
7.5.2 Financial Analysis
7.5.3 Segmental and Regional Analysis
7.5.4 Research & Development Expenses
7.6 Murata Manufacturing Co., Ltd.
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 Research & Development Expense
7.7 Vishay Intertechnology, Inc.
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental and Regional Analysis
7.7.4 Research and Development Expense
7.7.5 Recent strategies and developments:
7.7.5.1 Product Launches and Product Expansions:
7.8 KYOCERA AVX Components Corporation (Kyocera Corporation)
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expense
7.9 Bourns, Inc.
7.9.1 Company Overview

Companies Mentioned

  • Vishay Intertechnology, Inc
  • Yageo Corporation
  • Murata Manufacturing Co., Ltd.
  • KYOCERA AVX Components Corporation (Kyocera Corporation)
  • Panasonic Corporation
  • Bourns, Inc.
  • TDK Corporation
  • TE Connectivity
  • Microchip Technology, Inc.

Methodology

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