Thermal Interface Materials Market Report 2026

The thermal interface materials market size has grown rapidly in recent years. It will grow from $3.09 billion in 2025 to $3.44 billion in 2026 at a compound annual growth rate (CAGR) of 11.1%. The growth in the historic period can be attributed to increasing deployment in computer processors, early adoption in telecom cooling systems, rise in medical device thermal management, growth in industrial machinery applications, expanding use in consumer durables.

The thermal interface materials market size is expected to see rapid growth in the next few years. It will grow to $5.18 billion in 2030 at a compound annual growth rate (CAGR) of 10.8%. The growth in the forecast period can be attributed to rising demand for high-performance heat dissipation, expansion of electric vehicle electronics, development of advanced phase change materials, increasing adoption in high-density computing, growth of thermally conductive lightweight materials. Major trends in the forecast period include advancement of intelligent thermal management systems, growth of cloud-enhanced tim performance analytics, expansion of sustainable high-conductivity materials, rise of IoT-integrated heat dissipation solutions, adoption of tims in electrified mobility platforms.

The anticipated increase in demand for electronic devices is expected to drive the growth of the thermal interface materials market in the coming years. Electronic devices, encompassing a range of gadgets utilizing electrical energy for functions like computing, communication, or control, benefit from thermal interface materials due to their thermal conductive properties. These materials, present in devices like tablets, computers, smartphones, and gaming consoles, enhance efficiency and prolong the lifespan of electronic devices. For instance, in May 2023, the Japan Electronics and Information Technology Industries Association reported a total electronic equipment production value of $52,36,535 million (¥771,457 million) in Japan. Additionally, consumer electronics production rose from $1.71 trillion (¥25,268 million) in May 2022 to $2.17 trillion (¥32,099 million) in May 2023. Thus, the escalating demand for electronic devices is poised to drive increased revenue for the thermal interface materials market.

Prominent players in the thermal interface materials market are strategically focused on product innovation to broaden their product portfolios, meet the diverse needs of end-use industries, and maintain a competitive edge. In September 2023, Germany-based chemical company Henkel AG & Co. KGaA launched the Bergquist gap filler TGF 4400LVO, a next-generation thermal gap filler providing efficient heat transfer and a thin bond line for increased reliability in the face of thermal shock. Another offering, the Bergquist gap filler TGF 2900LVO, a silicone-based, 2-component room temperature curable gap filler, was also introduced in January 2023 for various electronic assembly applications.

In October 2024, Dow, a US-based materials science company, collaborated with Carbice to advance the development of high-performance thermal interface materials. This partnership aims to improve heat management solutions, accelerate the adoption of next-generation thermal technologies, and enhance reliability and efficiency in electronic devices. Carbice is a US-based company specializing in advanced thermal interface materials (TIMs) designed to optimize heat dissipation in electronics and high-power applications.

Major companies operating in the thermal interface materials market are The 3M Company, Zalman Tech Co. Ltd., Wakefield-Vette Inc., Indium Corporation, The Berquist Company Inc., Momentive Performance Materials Inc., Laird Technologies Inc., DOW Corning Corporation, Parker Hannifin Corporation, Henkel AG & Co. KGAA, Fujipoly Industries Co Ltd., DK Thermal Metal Circuit Technology Ltd., AI Technology Inc., AIM Specialty Materials, AOS Thermal Compounds LLC., Denka Company Limited., Universal Science, Dymax Corporation, Ellsworth Adhesives, Enerdyne Devices Private Limited., European Thermodynamics Ltd, Inkron Oy, Kitagawa Industries, LORD, M. A. Electronics Private Limited., MH&W International Corporation., Minerals Technologies Inc., Chomerics Inc., Robnor ResinLab Ltd., Schlegel Electronics Materials, Shin-Etsu Chemical Co. Ltd., Honeywell International Inc., Panasonic Corporation, Advanced Thermal Solutions Inc., MG Chemicals, Thermal Grizzly, Aavid Thermalloy LLC, Arctic Silver Inc., Thermalright Inc., Cooler Master Co. Ltd., GELID Solutions Ltd., Master Bond Inc., Kerafol Keramische Folien GmbH & Co. KG.

Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report’s Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.

Tariffs have increased the cost of imported metals, silicon-based compounds, and specialty conductive materials used in thermal interface materials, especially those sourced from Asian and European suppliers. Electronics, automotive, medical devices, and industrial sectors face higher production costs and prolonged sourcing cycles. Nevertheless, tariffs are encouraging domestic formulation, material innovation, and supplier diversification, supporting more resilient and cost-optimized TIM development for thermally demanding applications.

The thermal interface materials market research report is one of a series of new reports that provides thermal interface materials market statistics, including thermal interface materials industry global market size, regional shares, competitors with a thermal interface materials market share, detailed thermal interface materials market segments, market trends and opportunities, and any further data you may need to thrive in the thermal interface materials industry. This thermal interface materials market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenarios of the industry.

Thermal interface materials refer to substances comprised of conducting materials such as metals, silicon, and metal oxides. These materials are applied between solid surfaces to facilitate the efficient conduction of heat. Thermal interface materials find widespread applications, particularly in the fields of electronics, medical devices, and industrial machinery.

The primary types of thermal interface materials (TIMs) include greases and adhesives, tapes and films, gap fillers, metal-based TIMs, and phase change materials. Metal-based TIMs are characterized by their ability to absorb or release latent heat during a change in physical state from solid to liquid. TIMs are typically composed of silicone, epoxy, and polyimide, and their usage spans various sectors such as telecom, computer manufacturing, medical devices, industrial machinery, consumer durables, and automotive electronics.Asia-Pacific was the largest region in the thermal interface materials market in 2025. The regions covered in the thermal interface materials market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the thermal interface materials market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The thermal interface materials market consists of sales of thermal tapes, greases, elastomeric pads, solders, and other thermal interface materials. Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

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