The through-hole passive components market size is expected to see strong growth in the next few years. It will grow to $54.44 billion in 2030 at a compound annual growth rate (CAGR) of 6.4%. The growth in the forecast period can be attributed to growing shift toward hybrid smt and through hole assembly, increasing adoption in automotive electronics, rising demand for high temperature and high power components, expansion of industrial automation systems, increased use in telecom and data infrastructure. Major trends in the forecast period include growth in automated assembly and inspection, increasing integration of through hole components in industrial equipment, rising adoption in high reliability and rugged applications, expansion of customized passive component designs, growing demand for hybrid pcb assembly solutions.
Rising demand for consumer electronic devices is expected to propel the growth of the through-hole passive component market going forward. A consumer electronic device is any gadget that contains an electronic circuit board and is intended for everyday personal use. The increasing adoption of smart home gadgets, wearables, and other connected devices is driving demand for electronic components, thereby boosting the popularity of through-hole passive components. For instance, in May 2023, according to the Japan Electronics and Information Technology Industries Association, a Japan-based trade association, consumer electronics production reached $204.67 million (¥32,099 million), reflecting a 127% increase compared to the previous year. Therefore, the rising demand for consumer electronic devices is fueling the growth of the through-hole passive component market.
Major companies in the through-hole passive component market are focusing on developing innovative products such as ceramic disc capacitors to enhance high-voltage performance, improve energy efficiency, and ensure reliability. Ceramic disc capacitors are passive electronic components that store and release electrical energy using ceramic materials as the dielectric, commonly used in high-voltage and general-purpose electronic circuits. For example, in September 2025, Vishay Intertechnology, Inc., a US-based manufacturer of discrete semiconductors and passive electronic components, launched a new series of Class 1 radial-leaded high-voltage single-layer ceramic disc capacitors. These capacitors feature a low dissipation factor (DF) and DC bias suitable for industrial and medical applications, with a capacitance loss of less than 25% at 15 kV - approximately half the loss seen in typical Class 2 devices - and a dissipation factor below 1% at 1 kHz, enhancing energy efficiency by reducing power losses.
In August 2025, Wright Industries, a UK-based engineering investment company, acquired Exception PCB Ltd for an undisclosed amount. Through this acquisition, Wright Industries aims to strengthen domestic manufacturing capabilities and support the UK government’s focus on enhancing national industrial infrastructure across defense, aerospace, energy, and critical sectors. Exception PCB Ltd is a UK-based manufacturer of high-reliability printed circuit boards (PCBs).
Major companies operating in the through-hole passive components market are Panasonic Holdings Corporation, TE Connectivity Ltd., TDK Corporation, Murata Manufacturing Co Ltd., Rohm Co Ltd., YAGEO Corp, Vishay Intertechnology Inc., Bourns Inc., Taiyo Yuden Co Ltd., Würth Elektronik Group, AVX Corporation, Nichicon Corporation, KEMET Corporation, Nippon Chemi-Con Corporation, KYOCERA AVX Components Corporation, Rubycon Corporation, Holy Stone Enterprise Co Ltd., Lelon Electronics Corp, Elna Co Ltd., Sagami Elec Co Ltd., Cornell Dubilier Electronics Inc., KOA Speer Electronics Inc., NIC Components Corporation, WIMA GmbH & Co KG.
Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report’s Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.
Tariffs on electronic components, metals, and semiconductor materials have raised production and procurement costs for through hole passive components, impacting industries relying on large scale electronic assembly such as automotive, industrial, and aerospace. Regions heavily dependent on imported resistors, capacitors, and inductors face delays and higher sourcing expenses. However, tariffs have encouraged localized manufacturing, improved regional supply resilience, and driven innovation in cost effective component designs to reduce import dependency.
The through-hole passive component market research report is one of a series of new reports from. The Business Research Company that provides through-hole passive component market statistics, including through-hole passive component industry global market size, regional shares, competitors with a through-hole passive component market share, detailed through-hole passive component market segments, market trends and opportunities, and any further data you may need to thrive in the through-hole passive component industry. This through-hole passive component market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.
Through-hole passive components, mounted using leads and soldered onto PCBs, are integral parts of electronic assemblies, assembled either manually or through automated insertion machines.
Through-hole passive components consist of various essential elements including resistors, capacitors, inductors, diodes, transducers, sensors, and additional components. A resistor, specifically, functions as an electrical component that controls or regulates the flow of electrical current within an electronic circuit. It is accessible in lead models such as axial and radial configurations, catering to a wide array of applications spanning consumer electronics, automotive, industrial machinery, IT and telecommunications, aerospace and defense, healthcare, life sciences, and other diverse industries.Asia-Pacific was the largest region in the through-hole passive component market in 2025, is expected to be the fastest-growing region in the global through-hole passive component market report during the forecast period. The regions covered in the through-hole passive components market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the through-hole passive components market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
The through-hole passive component market consists of sales of electronics components such as axial lead and radial lead. Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
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Table of Contents
Executive Summary
Through-Hole Passive Components Market Global Report 2026 provides strategists, marketers and senior management with the critical information they need to assess the market.This report focuses through-hole passive components market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
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Description
Where is the largest and fastest growing market for through-hole passive components? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The through-hole passive components market global report answers all these questions and many more.The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, total addressable market (TAM), market attractiveness score (MAS), competitive landscape, market shares, company scoring matrix, trends and strategies for this market. It traces the market’s historic and forecast market growth by geography.
- The market characteristics section of the report defines and explains the market. This section also examines key products and services offered in the market, evaluates brand-level differentiation, compares product features, and highlights major innovation and product development trends.
- The supply chain analysis section provides an overview of the entire value chain, including key raw materials, resources, and supplier analysis. It also provides a list competitor at each level of the supply chain.
- The updated trends and strategies section analyses the shape of the market as it evolves and highlights emerging technology trends such as digital transformation, automation, sustainability initiatives, and AI-driven innovation. It suggests how companies can leverage these advancements to strengthen their market position and achieve competitive differentiation.
- The regulatory and investment landscape section provides an overview of the key regulatory frameworks, regularity bodies, associations, and government policies influencing the market. It also examines major investment flows, incentives, and funding trends shaping industry growth and innovation.
- The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
- The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.
- The total addressable market (TAM) analysis section defines and estimates the market potential compares it with the current market size, and provides strategic insights and growth opportunities based on this evaluation.
- The market attractiveness scoring section evaluates the market based on a quantitative scoring framework that considers growth potential, competitive dynamics, strategic fit, and risk profile. It also provides interpretive insights and strategic implications for decision-makers.
- Market segmentations break down the market into sub markets.
- The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
- Expanded geographical coverage includes Taiwan and Southeast Asia, reflecting recent supply chain realignments and manufacturing shifts in the region. This section analyzes how these markets are becoming increasingly important hubs in the global value chain.
- The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
- The company scoring matrix section evaluates and ranks leading companies based on a multi-parameter framework that includes market share or revenues, product innovation, and brand recognition.
Scope
Markets Covered:
1) By Component: Resistors; Capacitors; Inductors; Diodes; Transducers; Sensors; Other Components2) By Leads Model: Axial; Radial
3) By Application: Consumer Electronics; Automotive; Industrial; IT And Telecom; Aerospace And Defense; Healthcare And Life Sciences; Other Applications
Subsegments:
1) By Resistors: Fixed Resistors; Variable Resistors; Specialty Resistors2) By Capacitors: Ceramic Capacitors; Electrolytic Capacitors; Film Capacitors; Tantalum Capacitors
3) By Inductors: Air Core Inductors; Iron Core Inductors; Ferrite Core Inductors; Power Inductors
4) By Diodes: Rectifier Diodes; Zener Diodes; Schottky Diodes; Signal Diodes
5) By Transducers: Pressure Transducers; Temperature Transducers; Force Transducers
6) By Sensors: Temperature Sensors; Proximity Sensors; Light Sensors; Humidity Sensors
7) By Other Components: Filters; Ferrite Beads; Resistor Networks
Companies Mentioned: Panasonic Holdings Corporation; TE Connectivity Ltd.; TDK Corporation; Murata Manufacturing Co Ltd.; Rohm Co Ltd.; YAGEO Corp; Vishay Intertechnology Inc.; Bourns Inc.; Taiyo Yuden Co Ltd.; Würth Elektronik Group; AVX Corporation; Nichicon Corporation; KEMET Corporation; Nippon Chemi-Con Corporation; KYOCERA AVX Components Corporation; Rubycon Corporation; Holy Stone Enterprise Co Ltd.; Lelon Electronics Corp; Elna Co Ltd.; Sagami Elec Co Ltd.; Cornell Dubilier Electronics Inc.; KOA Speer Electronics Inc.; NIC Components Corporation; WIMA GmbH & Co KG
Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Taiwan; Russia; South Korea; UK; USA; Canada; Italy; Spain.
Regions: Asia-Pacific; South East Asia; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
Time Series: Five years historic and ten years forecast.
Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita.
Data Segmentation: Country and regional historic and forecast data, market share of competitors, market segments.
Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
Delivery Format: Word, PDF or Interactive Report + Excel Dashboard
Added Benefits:
- Bi-Annual Data Update
- Customisation
- Expert Consultant Support
Companies Mentioned
The companies featured in this Through-Hole Passive Components market report include:- Panasonic Holdings Corporation
- TE Connectivity Ltd.
- TDK Corporation
- Murata Manufacturing Co Ltd.
- Rohm Co Ltd.
- YAGEO Corp
- Vishay Intertechnology Inc.
- Bourns Inc.
- Taiyo Yuden Co Ltd.
- Würth Elektronik Group
- AVX Corporation
- Nichicon Corporation
- KEMET Corporation
- Nippon Chemi-Con Corporation
- KYOCERA AVX Components Corporation
- Rubycon Corporation
- Holy Stone Enterprise Co Ltd.
- Lelon Electronics Corp
- Elna Co Ltd.
- Sagami Elec Co Ltd.
- Cornell Dubilier Electronics Inc.
- KOA Speer Electronics Inc.
- NIC Components Corporation
- WIMA GmbH & Co KG
Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 250 |
| Published | January 2026 |
| Forecast Period | 2026 - 2030 |
| Estimated Market Value ( USD | $ 42.5 Billion |
| Forecasted Market Value ( USD | $ 54.44 Billion |
| Compound Annual Growth Rate | 6.4% |
| Regions Covered | Global |
| No. of Companies Mentioned | 25 |


