The global 3D IC and 2.5D IC packaging market is expected to reach an estimated $81.1 billion by 2028 with a CAGR of 11% from 2023 to 2028.
The future of the global 3D IC and 2.5D IC packaging market looks promising with opportunities in the consumer electronic, industrial, telecommunication, automotive, military & aerospace, and medical device industries. The major drivers for this market are growing demand for miniaturized IoT based devices, emergence of 5G technologies, and the widespread use of high-end computation, servers, and data centers.
Answer: The global 3D IC and 2.5D IC packaging market is expected to reach an estimated $81.1 billion by 2028.
Q2. What is the growth forecast for 3D IC and 2.5D IC packaging market?
Answer: The global 3D IC and 2.5D IC packaging market is expected to grow with a CAGR of 11% from 2023 to 2028.
Q3. What are the major drivers influencing the growth of the 3D IC and 2.5D IC packaging market?
Answer: The major drivers for this market are growing demand for miniaturized IoT based devices, the emergence of 5G technologies, and the widespread use of high-end computation, servers, and data centers.
Q4. What are the major segments for 3D IC and 2.5D IC packaging market?
Answer: The future of the 3D IC and 2.5D IC packaging market looks promising with opportunities in the consumer electronic, industrial, telecommunication, automotive, military & aerospace, and medical device industries.
Q5. Who are the key 3D IC and 2.5D IC packaging companies?
Answer: Some of the key 3D IC and 2.5D IC packaging companies are as follows:
Answer: It is forecast that MEMS/sensor is expected to witness the highest growth over the forecast period due to the widespread use of 2.5D and 3D IC packaging in advanced MEMS and miniaturized sensors, such as microphones, accelerometers, gyroscopes, digital compasses, inertial modules, pressure sensors, humidity sensors, and smart sensors.
Q7. In 3D IC and 2.5D IC packaging market, which region is expected to be the largest in next 5 years?
Answer: APAC is expected to witness the highest growth over the forecast period due to the huge adoption of electronic gadgets among increasing population, growing demand for ICs in the telecommunication and automotive industries, and presence of key manufacturers in the region.
Q8. Do we receive customization in this report?
Answer: Yes, 10% customization is provided without any additional cost.
Q2. Which segments will grow at a faster pace and why?
Q3. Which region will grow at a faster pace and why?
Q4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
Q5. What are the business risks and competitive threats in this market?
Q6. What are the emerging trends in this market and the reasons behind them?
Q7. What are some of the changing demands of customers in the market?
Q8. What are the new developments in the market? Which companies are leading these developments?
Q9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
Q10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
Q11. What M&A activity has occurred in the last five years and what has its impact been on the industry?
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The future of the global 3D IC and 2.5D IC packaging market looks promising with opportunities in the consumer electronic, industrial, telecommunication, automotive, military & aerospace, and medical device industries. The major drivers for this market are growing demand for miniaturized IoT based devices, emergence of 5G technologies, and the widespread use of high-end computation, servers, and data centers.
3D IC and 2.5D IC Packaging Market by Segment
The study includes trends and forecast for the global 3D IC and 2.5D IC packaging market by packaging technology, application, end-use industry, and region, as follows:3D IC and 2.5D IC Packaging Market by Packaging Technology [Shipment Analysis by Value from 2017 to 2028]:
- 3D Wafer-Level Chip-Scale Packaging (WLCSP)
- 3D Through-Silicon Via (TSV)
- 2.5D
3D IC and 2.5D IC Packaging Market by Application [Shipment Analysis by Value from 2017 to 2028]:
- Logic
- Imaging & Optoelectronics
- Memory
- MEMS/Sensors
- LED
- Others
3D IC and 2.5D IC Packaging Market by End-use Industry [Shipment Analysis by Value from 2017 to 2028]:
- Consumer Electronics
- Industrial
- Telecommunications
- Automotive
- Military & Aerospace
- Medical Devices
- Others
3D IC and 2.5D IC Packaging Market by Region [Shipment Analysis by Value from 2017 to 2028]:
- North America
- Europe
- Asia Pacific
- The Rest of the World
List of 3D IC and 2.5D IC Packaging Companies
Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies, 3D IC and 2.5D IC packaging companies cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the 3D IC and 2.5D IC packaging companies profiled in this report include:- Taiwan Semiconductor Manufacturing
- Samsung Electronics
- Toshiba
- Advanced Semiconductor Engineering
- Amkor Technology
3D IC and 2.5D IC Packaging Market Insights
- It is forecast that the MEMS/sensor segment is expected to witness the highest growth over the forecast period due to the widespread use of 2.5D and 3D IC packaging in advanced MEMS and miniaturized sensors, such as microphones, accelerometers, gyroscopes, digital compasses, inertial modules, pressure sensors, humidity sensors, and smart sensors.
- Consumer electronics is expected to remain the largest segment due to the increasing adoption of 3D IC and 2.5D IC packaging based innovative memories, such as double-data-rate (DDR) DRAM and flash memory in the electronic devices, like smartphones and tablets.
- APAC is expected to witness the highest growth over the forecast period due to the huge adoption of electronic gadgets among increasing population, growing demand for ICs from the telecommunication and automotive industries, and the presence of key manufacturers in the region.
Features of the 3D IC and 2.5D IC Packaging Market
- Market Size Estimates: 3D IC and 2.5D IC packaging market size estimation in terms of value ($B)
- Trend and Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
- Segmentation Analysis: 3D IC and 2.5D IC packaging market size by various segments, such as by packaging technology, application, end-use industry, and region
- Regional Analysis: 3D IC and 2.5D IC packaging market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
- Growth Opportunities: Analysis on growth opportunities in different packaging technologies, applications, end-use industries, and regions for the 3D IC and 2.5D IC packaging market.
- Strategic Analysis: This includes M&A, new product development, and competitive landscape for the 3D IC and 2.5D IC packaging market.
- Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
FAQs
Q1. What is the 3D IC and 2.5D IC packaging market size?Answer: The global 3D IC and 2.5D IC packaging market is expected to reach an estimated $81.1 billion by 2028.
Q2. What is the growth forecast for 3D IC and 2.5D IC packaging market?
Answer: The global 3D IC and 2.5D IC packaging market is expected to grow with a CAGR of 11% from 2023 to 2028.
Q3. What are the major drivers influencing the growth of the 3D IC and 2.5D IC packaging market?
Answer: The major drivers for this market are growing demand for miniaturized IoT based devices, the emergence of 5G technologies, and the widespread use of high-end computation, servers, and data centers.
Q4. What are the major segments for 3D IC and 2.5D IC packaging market?
Answer: The future of the 3D IC and 2.5D IC packaging market looks promising with opportunities in the consumer electronic, industrial, telecommunication, automotive, military & aerospace, and medical device industries.
Q5. Who are the key 3D IC and 2.5D IC packaging companies?
Answer: Some of the key 3D IC and 2.5D IC packaging companies are as follows:
- Taiwan Semiconductor Manufacturing
- Samsung Electronics
- Toshiba
- Advanced Semiconductor Engineering
- Amkor Technology
Answer: It is forecast that MEMS/sensor is expected to witness the highest growth over the forecast period due to the widespread use of 2.5D and 3D IC packaging in advanced MEMS and miniaturized sensors, such as microphones, accelerometers, gyroscopes, digital compasses, inertial modules, pressure sensors, humidity sensors, and smart sensors.
Q7. In 3D IC and 2.5D IC packaging market, which region is expected to be the largest in next 5 years?
Answer: APAC is expected to witness the highest growth over the forecast period due to the huge adoption of electronic gadgets among increasing population, growing demand for ICs in the telecommunication and automotive industries, and presence of key manufacturers in the region.
Q8. Do we receive customization in this report?
Answer: Yes, 10% customization is provided without any additional cost.
This report answers following 11 key questions:
Q1. What are some of the most promising, high-growth opportunities for the global 3D IC and 2.5D IC packaging market by packaging technology (3D wafer-level chip-scale packaging (WLCSP), 3D through-silicon via (TSV), and 2.5D), application (logic, imaging & optoelectronics, memory, MEMS/sensors, LED, and others), end-use industry (consumer electronics, industrial, telecommunications, automotive, military & aerospace, medical devices, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?Q2. Which segments will grow at a faster pace and why?
Q3. Which region will grow at a faster pace and why?
Q4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
Q5. What are the business risks and competitive threats in this market?
Q6. What are the emerging trends in this market and the reasons behind them?
Q7. What are some of the changing demands of customers in the market?
Q8. What are the new developments in the market? Which companies are leading these developments?
Q9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
Q10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
Q11. What M&A activity has occurred in the last five years and what has its impact been on the industry?
This product will be delivered within 1-3 business days.
Table of Contents
1. Executive Summary
2. Global 3D IC and 2.5D IC Packaging Market: Market Dynamics
3. Market Trends and Forecast Analysis from 2017 to 2028
4. Market Trends and Forecast Analysis by Region from 2017 to 2028
5. Competitor Analysis
6. Growth Opportunities and Strategic Analysis
7. Company Profiles of Leading Players
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Taiwan Semiconductor Manufacturing
- Samsung Electronics
- Toshiba
- Advanced Semiconductor Engineering
- Amkor Technology
Methodology
The analyst has been in the business of market research and management consulting since 2000 and has published over 600 market intelligence reports in various markets/applications and served over 1,000 clients worldwide. Each study is a culmination of four months of full-time effort performed by the analyst team. The analysts used the following sources for the creation and completion of this valuable report:
- In-depth interviews of the major players in the market
- Detailed secondary research from competitors’ financial statements and published data
- Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
- A compilation of the experiences, judgments, and insights of professionals, who have analyzed and tracked the market over the years.
Extensive research and interviews are conducted in the supply chain of the market to estimate market share, market size, trends, drivers, challenges and forecasts.
Thus, the analyst compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. The analyst then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process.
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