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Global Electrically Conductive Adhesives Market: Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028

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    Report

  • 142 Pages
  • November 2023
  • Region: Global
  • IMARC Group
  • ID: 5911784
The global electrically conductive adhesives market size reached US$ 2,436.1 Billion in 2022. Looking forward, the market is expected to reach US$ 3,246.1 Billion by 2028, exhibiting a growth rate (CAGR) of 4.90% during 2022-2028.

Electrically conductive adhesives refer to the materials used for connecting electrical and electronic wires and circuits. They are also used for the dispersion of metallic particles and inducing conductivity in a polymeric matrix. Some of the commonly used electrically conductive adhesives include polyurethane, acetates, epoxies, silicones and polyimides. They are widely used in electronic touch panels, coatings, radio frequency identification (RFID) chips and mounting light-emitting diodes (LEDs). They exhibit various advantageous properties, such as low curing temperatures, compatibility with non-solderable materials, superior adhesion and enhanced fatigue and moisture resistance. They can also block the electromagnetic radiations emitting from various electronic devices. As a result, these adhesives are widely used across various industries, including aerospace, medical, automotive and electronics.

Electrically Conductive Adhesives Market Trends

Significant growth in the electronics industry across the globe is one of the key factors creating a positive outlook for the market. Electrically conductive adhesives are widely used as filler components in silver, copper, aluminum and iron products for superior adhesion and enhanced durability. Moreover, the increasing demand for single-part and two-part epoxy adhesives in power electronics is providing a thrust to the market growth. The adhesives are used for circuit assembly and altering heat curing or hot soldering. They also aid in eliminating the requirement for additional fasteners and bolts. In line with this, the launch of miniaturized electronic devices with light, thin and small-sized components is also contributing to the growth of the market. Various product innovations, such as the development of paste-based electrically conductive adhesives, are acting as other growth-inducing factors. Product manufacturers are also developing premixed frozen syringes for convenient adhesive application on screens and small electronic components. Other factors, including the implementation of stringent safety regulations, along with extensive research and development (R&D) activities, are anticipated to drive the market toward growth.

Key Market Segmentation

This research provides an analysis of the key trends in each sub-segment of the global electrically conductive adhesives market report, along with forecasts at the global, regional and country level from 2023-2028. The report has categorized the market based on type, chemistry, filler material and application.

Breakup by Type:

  • Isotropic Conductive Adhesives
  • Anisotropic Conductive Adhesives

Breakup by Chemistry:

  • Epoxy
  • Silicone
  • Acrylic
  • Polyurethane

Breakup by Filler Material:

  • Silver Fillers
  • Carbon Fillers
  • Copper Fillers

Breakup by Application:

  • Automotive
  • Consumer Electronics
  • Aerospace
  • Biosciences

Breakup by Region:

  • North America
  • United States
  • Canada
  • Asia-Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
  • Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
  • Russia
  • Latin America
  • Brazil
  • Mexico
  • Middle East and Africa

Competitive Landscape

The competitive landscape of the industry has also been examined along with the profiles of the key players being 3M Company, Aremco Products Inc., Creative Materials Inc., Dow Inc., H.B. Fuller Company, Henkel AG & Co. KGaA, Kemtron Ltd., Master Bond Inc., MG Chemicals, Panacol-Elosol GmbH (Dr. Hönle AG), Parker-Hannifin Corporation and Permabond LLC.

Key Questions Answered in This Report:

  • How has the global electrically conductive adhesives market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the global electrically conductive adhesives market?
  • What are the key regional markets?
  • What is the breakup of the market based on the type?
  • What is the breakup of the market based on the chemistry?
  • What is the breakup of the market based on the filler material?
  • What is the breakup of the market based on the application?
  • What are the various stages in the value chain of the industry?
  • What are the key driving factors and challenges in the industry?
  • What is the structure of the global electrically conductive adhesives market and who are the key players?
  • What is the degree of competition in the industry?

Table of Contents

1 Preface
2 Scope and Methodology
2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
2.3.1 Primary Sources
2.3.2 Secondary Sources
2.4 Market Estimation
2.4.1 Bottom-Up Approach
2.4.2 Top-Down Approach
2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
4.1 Overview
4.2 Key Industry Trends
5 Global Electrically Conductive Adhesives Market
5.1 Market Overview
5.2 Market Performance
5.3 Impact of COVID-19
5.4 Market Forecast
6 Market Breakup by Type
6.1 Isotropic Conductive Adhesives
6.1.1 Market Trends
6.1.2 Market Forecast
6.2 Anisotropic Conductive Adhesives
6.2.1 Market Trends
6.2.2 Market Forecast
7 Market Breakup by Chemistry
7.1 Epoxy
7.1.1 Market Trends
7.1.2 Market Forecast
7.2 Silicone
7.2.1 Market Trends
7.2.2 Market Forecast
7.3 Acrylic
7.3.1 Market Trends
7.3.2 Market Forecast
7.4 Polyurethane
7.4.1 Market Trends
7.4.2 Market Forecast
7.5 Others
7.5.1 Market Trends
7.5.2 Market Forecast
8 Market Breakup by Filler Material
8.1 Silver Fillers
8.1.1 Market Trends
8.1.2 Market Forecast
8.2 Carbon Fillers
8.2.1 Market Trends
8.2.2 Market Forecast
8.3 Copper Fillers
8.3.1 Market Trends
8.3.2 Market Forecast
8.4 Others
8.4.1 Market Trends
8.4.2 Market Forecast
9 Market Breakup by Application
9.1 Automotive
9.1.1 Market Trends
9.1.2 Market Forecast
9.2 Consumer Electronics
9.2.1 Market Trends
9.2.2 Market Forecast
9.3 Aerospace
9.3.1 Market Trends
9.3.2 Market Forecast
9.4 Biosciences
9.4.1 Market Trends
9.4.2 Market Forecast
9.5 Others
9.5.1 Market Trends
9.5.2 Market Forecast
10 Market Breakup by Region
10.1 North America
10.1.1 United States
10.1.1.1 Market Trends
10.1.1.2 Market Forecast
10.1.2 Canada
10.1.2.1 Market Trends
10.1.2.2 Market Forecast
10.2 Asia-Pacific
10.2.1 China
10.2.1.1 Market Trends
10.2.1.2 Market Forecast
10.2.2 Japan
10.2.2.1 Market Trends
10.2.2.2 Market Forecast
10.2.3 India
10.2.3.1 Market Trends
10.2.3.2 Market Forecast
10.2.4 South Korea
10.2.4.1 Market Trends
10.2.4.2 Market Forecast
10.2.5 Australia
10.2.5.1 Market Trends
10.2.5.2 Market Forecast
10.2.6 Indonesia
10.2.6.1 Market Trends
10.2.6.2 Market Forecast
10.2.7 Others
10.2.7.1 Market Trends
10.2.7.2 Market Forecast
10.3 Europe
10.3.1 Germany
10.3.1.1 Market Trends
10.3.1.2 Market Forecast
10.3.2 France
10.3.2.1 Market Trends
10.3.2.2 Market Forecast
10.3.3 United Kingdom
10.3.3.1 Market Trends
10.3.3.2 Market Forecast
10.3.4 Italy
10.3.4.1 Market Trends
10.3.4.2 Market Forecast
10.3.5 Spain
10.3.5.1 Market Trends
10.3.5.2 Market Forecast
10.3.6 Russia
10.3.6.1 Market Trends
10.3.6.2 Market Forecast
10.3.7 Others
10.3.7.1 Market Trends
10.3.7.2 Market Forecast
10.4 Latin America
10.4.1 Brazil
10.4.1.1 Market Trends
10.4.1.2 Market Forecast
10.4.2 Mexico
10.4.2.1 Market Trends
10.4.2.2 Market Forecast
10.4.3 Others
10.4.3.1 Market Trends
10.4.3.2 Market Forecast
10.5 Middle East and Africa
10.5.1 Market Trends
10.5.2 Market Breakup by Country
10.5.3 Market Forecast
11 SWOT Analysis
11.1 Overview
11.2 Strengths
11.3 Weaknesses
11.4 Opportunities
11.5 Threats
12 Value Chain Analysis
13 Porters Five Forces Analysis
13.1 Overview
13.2 Bargaining Power of Buyers
13.3 Bargaining Power of Suppliers
13.4 Degree of Competition
13.5 Threat of New Entrants
13.6 Threat of Substitutes
14 Price Analysis
15 Competitive Landscape
15.1 Market Structure
15.2 Key Players
15.3 Profiles of Key Players
15.3.1 3M Company
15.3.1.1 Company Overview
15.3.1.2 Product Portfolio
15.3.1.3 Financials
15.3.1.4 SWOT Analysis
15.3.2 Aremco Products Inc.
15.3.2.1 Company Overview
15.3.2.2 Product Portfolio
15.3.3 Creative Materials Inc.
15.3.3.1 Company Overview
15.3.3.2 Product Portfolio
15.3.4 Dow Inc.
15.3.4.1 Company Overview
15.3.4.2 Product Portfolio
15.3.4.3 Financials
15.3.4.4 SWOT Analysis
15.3.5 H.B. Fuller Company
15.3.5.1 Company Overview
15.3.5.2 Product Portfolio
15.3.5.3 Financials
15.3.5.4 SWOT Analysis
15.3.6 Henkel AG & Co. KGaA
15.3.6.1 Company Overview
15.3.6.2 Product Portfolio
15.3.6.3 Financials
15.3.6.4 SWOT Analysis
15.3.7 Kemtron Ltd.
15.3.7.1 Company Overview
15.3.7.2 Product Portfolio
15.3.8 Master Bond Inc.
15.3.8.1 Company Overview
15.3.8.2 Product Portfolio
15.3.9 MG Chemicals
15.3.9.1 Company Overview
15.3.9.2 Product Portfolio
15.3.10 Panacol-Elosol GmbH (Dr. Hönle AG)
15.3.10.1 Company Overview
15.3.10.2 Product Portfolio
15.3.11 Parker-Hannifin Corporation
15.3.11.1 Company Overview
15.3.11.2 Product Portfolio
15.3.11.3 Financials
15.3.11.4 SWOT Analysis
15.3.12 Permabond LLC
15.3.12.1 Company Overview
15.3.12.2 Product Portfolio

Companies Mentioned

  • 3M Company
  • Aremco Products Inc.
  • Creative Materials Inc.
  • Dow Inc.
  • H.B. Fuller Company
  • Henkel AG & Co. KGaA
  • Kemtron Ltd.
  • Master Bond Inc.
  • MG Chemicals
  • Panacol-Elosol GmbH (Dr. Hönle AG)
  • Parker-Hannifin Corporation
  • Permabond LLC

Methodology

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Table Information