Integrated Passive Devices Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, 2021-2031

The Global Integrated Passive Devices Market is projected to expand from USD 2.26 Billion in 2025 to USD 3.79 Billion by 2031, registering a CAGR of 9.01%. Integrated Passive Devices (IPDs) are high-performance components in which passive elements like resistors, capacitors, and inductors are embedded directly into glass or semiconductor substrates instead of being packaged as individual units. This integration facilitates significantly reduced device footprints and improved electrical performance, satisfying critical industry needs for signal integrity and miniaturization in high-frequency environments. The market is primarily driven by the growing demand for compact consumer electronics and the stringent performance requirements of advanced automotive systems and 5G telecommunications, which demand lower parasitic inductance than traditional surface-mount technologies.

The market's progression is tightly connected to the broader semiconductor industry, which serves as the foundational platform for these integrated solutions. As reported by the Semiconductor Industry Association, global semiconductor sales hit $166.0 billion in the third quarter of 2024, marking a 23.2% increase over the same period in 2023. This strong growth in the underlying semiconductor sector highlights the increasing adoption of advanced component technologies, such as IPDs, to sustain data-intensive applications. However, a major obstacle to widespread market growth is the high non-recurring engineering costs and manufacturing complexity associated with IPDs, which can render them less cost-effective than standard discrete components for high-volume, low-margin applications.

Market Drivers

The swift rollout of 5G telecommunications infrastructure acts as a major catalyst for the adoption of Integrated Passive Devices (IPDs). As telecommunications providers move toward higher frequency bands, the need for components that preserve signal integrity while minimizing parasitic capacitance becomes increasingly critical. IPDs enable the direct integration of high-performance filters, couplers, and baluns onto substrates, which is vital for the effective operation of modern radio frequency front-end modules in massive MIMO implementations. According to Ericsson's June 2024 'Ericsson Mobility Report', global 5G subscriptions increased by 160 million in the first quarter of 2024. This ongoing network expansion drives hardware requirements for both small cells and macro base stations, thereby boosting the volume of integrated passive solutions that outperform traditional discrete components in radio frequency performance.

Simultaneously, the proliferation of miniaturized consumer electronics and connected wearables is accelerating market demand by placing strict space limitations on device architecture. Manufacturers are increasingly adopting System-in-Package technologies where passive components are embedded to save board space for larger processors and batteries. Apple Inc. reported in its fiscal 2024 third-quarter results that the Wearables, Home, and Accessories segment achieved net sales of $8.1 billion, demonstrating the vast scale of component usage in this sector. This demand for compact electronics is bolstered by a rebounding manufacturing ecosystem; SEMI reported that global silicon wafer shipments rose by 7.1% quarter-over-quarter in the second quarter of 2024, ensuring that substrate availability can meet the high volume needs of the consumer electronics market.

Market Challenges

Complex manufacturing requirements and high non-recurring engineering expenses pose a significant barrier to the growth of the Global Integrated Passive Devices Market. Unlike discrete components that rely on standard, low-cost production methods, integrated passive devices utilize advanced semiconductor fabrication techniques such as photolithography and thin-film deposition. This reliance necessitates substantial upfront capital investment during the development phase, resulting in a final unit cost that is considerably higher than traditional alternatives. Consequently, these elevated costs make integrated solutions less financially feasible for price-sensitive or low-margin applications, effectively limiting their adoption to high-performance sectors.

The financial challenge is further exacerbated by the significant operational costs required to maintain the necessary manufacturing infrastructure. The capital-intensive nature of sustaining such production environments directly influences the pricing structure of these components. This high cost of operation is evidenced by recent industry data regarding manufacturing expenditures; according to SEMI, worldwide semiconductor equipment billings reached $26.8 billion in the second quarter of 2024. Such massive spending on production tooling highlights the heavy financial overhead that manufacturers face, which sustains high entry barriers for integrated passive devices in mass-market segments.

Market Trends

The increasing adoption of glass-based substrates for high-frequency RF and high-performance computing applications is fundamentally altering the technological landscape of the market. Glass provides superior dimensional stability and significantly lower electrical loss compared to traditional organic cores, properties that are vital for the dense interconnects required by next-generation AI accelerators and 5G/6G modules using Through-Glass Via (TGV) technologies. This material shift is driving substantial industrial investment to build the necessary manufacturing infrastructure for these advanced integrated solutions. For instance, the U.S. Department of Commerce announced in May 2024 that Absolics was awarded up to $75 million under CHIPS Act incentives to support the construction of a commercial facility in Georgia dedicated to developing glass substrates for the semiconductor industry.

Concurrently, the expanding use of high-reliability IPDs in electric vehicle systems and automotive ADAS represents a critical new growth area. As vehicle architectures increasingly depend on complex sensor arrays for autonomous driving and high-voltage powertrains, manufacturers are transitioning to integrated passive devices that can withstand mechanical vibrations and extreme thermal cycles better than discrete surface-mount components. This shift is directly supported by the rapid electrification of the global fleet, which necessitates robust, space-efficient components for safety-critical hardware. Underscoring this demand, the International Energy Agency's 'Global EV Outlook 2024' projected that global electric car sales would reach approximately 17 million units in 2024, highlighting the massive scale of demand for automotive-grade electronic components.

Key Players Profiled in the Integrated Passive Devices Market

• Murata Manufacturing Co., Ltd.
• Infineon Technologies AG
• STMicroelectronics N.V.
• ON Semiconductor Corporation
• Broadcom Inc.
• NXP Semiconductors N.V.
• Texas Instruments Incorporated
• Qorvo, Inc.
• MACOM Technology Solutions Holdings Inc.
• CTS Corporation

Report Scope

In this report, the Global Integrated Passive Devices Market has been segmented into the following categories:

Integrated Passive Devices Market, by Application:

• EMS & EMI Protection IPD
• RF IPD
• LED Lighting
• Digital & Mixed Signal IPD

Integrated Passive Devices Market, by End-use:

• Automobile
• Consumer electronics
• Healthcare
• Others

Integrated Passive Devices Market, by Region:

• North America
• Europe
• Asia-Pacific
• South America
• Middle East & Africa

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Integrated Passive Devices Market.

Available Customization

The analyst offers customization according to your specific needs. The following customization options are available for the report:

• Detailed analysis and profiling of additional market players (up to five).

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