The technologies in PCB market have undergone significant change in recent years, with traditional low density to advance high density PCBs. The rising wave of new technologies, such as rigid-flex and HDI are creating significant potential for advanced PCBs in smartphone and automotive applications, and driving the demand for PCB technologies.
In PCB market, various technologies, such as rigid 1-2 sided, standard multilayer, flexible circuits, rigid-flex, HDI/Microvia/build-up, and IC substrate are used in various applications. Increasing demand for PCB in the communication industry, growth in connected devices, and advancement in automotive electronics are creating new opportunities for various PCB technologies.
This report analyzes technology maturity, degree of disruption, competitive intensity, market potential, and other parameters of various technologies in the PCB market.
The study includes technology readiness, competitive intensity, regulatory compliance, disruption potential, trends, forecasts and strategic implications for the global PCB technology by application, technology, and region as follows:
Q.2 Which technology will grow at a faster pace and why?
Q.3 What are the key factors affecting dynamics of different technologies? What are the drivers and challenges of these technologies in PCB market?
Q.4 What are the levels of technology readiness, competitive intensity and regulatory compliance in this technology space?
Q.5 What are the business risks and threats to these technologies in PCB market?
Q.6 What are the latest developments in PCB technologies? Which companies are leading these developments?
Q.7 Which technologies have potential of disruption in this market?
Q.8 Who are the major players in this PCB market? What strategic initiatives are being implemented by key players for business growth?
Q.9 What are strategic growth opportunities in this PCB technology space?
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In PCB market, various technologies, such as rigid 1-2 sided, standard multilayer, flexible circuits, rigid-flex, HDI/Microvia/build-up, and IC substrate are used in various applications. Increasing demand for PCB in the communication industry, growth in connected devices, and advancement in automotive electronics are creating new opportunities for various PCB technologies.
This report analyzes technology maturity, degree of disruption, competitive intensity, market potential, and other parameters of various technologies in the PCB market.
The study includes technology readiness, competitive intensity, regulatory compliance, disruption potential, trends, forecasts and strategic implications for the global PCB technology by application, technology, and region as follows:
- Technology Readiness by Technology Type
- Competitive Intensity and Regulatory Compliance
- Disruption Potential by Technology Type
Trends and Forecasts by Technology Type [$M shipment analysis from 2024 to 2030]:
- Rigid 1-2 Sided
- Standard Multilayer
- Flexible Circuits
- Rigid-flex
- HDI/Microvia/Build-up
- IC Substrate
Technology Trends and Forecasts by Application [$M shipment analysis from 2024 to 2030]:
- Computer/Peripherals
- Rigid 1-2 Sided
- Standard Multilayer
- Flexible Circuits
- Rigid-flex
- HDI/Microvia/Build-up
- IC Substrate
- Communications
- Rigid 1-2 Sided
- Standard Multilayer
- Flexible Circuits
- Rigid-flex
- HDI/Microvia/Build-up
- IC Substrate
- Consumer Electronics
- Rigid 1-2 Sided
- Standard Multilayer
- Flexible Circuits
- Rigid-flex
- HDI/Microvia/Build-up
- IC Substrate
- Industrial Electronics
- Rigid 1-2 Sided
- Standard Multilayer
- Flexible Circuits
- Rigid-flex
- HDI/Microvia/Build-up
- IC Substrate
- Automotive
- Rigid 1-2 Sided
- Standard Multilayer
- Flexible Circuits
- Rigid-flex
- HDI/Microvia/Build-up
- IC Substrate
- Military/Aerospace
- Rigid 1-2 Sided
- Standard Multilayer
- Flexible Circuits
- Rigid-flex
- HDI/Microvia/Build-up
- IC Substrate
- Others
- Rigid 1-2 Sided
- Standard Multilayer
- Flexible Circuits
- Rigid-flex
- HDI/Microvia/Build-up
- IC Substrate
Technology Trends and Forecasts by Region [$M shipment analysis for 2024 to 2030]:
- North America
- United States
- Canada
- Mexico
- Europe
- United Kingdom
- Germany
- France
- Asia Pacific
- Japan
- China
- South Korea
- India
- The Rest of the World
Latest Developments and Innovations in the PCB Technologies
Companies / Ecosystems
Strategic Opportunities by Technology Type
Some of the PCB companies profiled in this report include Zhen Ding Technology Holding, NOK Corporation, TTM Technologies, Unimicron Technology, Compeq Manufacturing, Young Poong Electronics, Samsung Electro-Mechanics, Tripod Technology, and Ibiden Co.This report answers the following 9 key questions:
Q.1 What are some of the most promising and high-growth technology opportunities for the PCB market?Q.2 Which technology will grow at a faster pace and why?
Q.3 What are the key factors affecting dynamics of different technologies? What are the drivers and challenges of these technologies in PCB market?
Q.4 What are the levels of technology readiness, competitive intensity and regulatory compliance in this technology space?
Q.5 What are the business risks and threats to these technologies in PCB market?
Q.6 What are the latest developments in PCB technologies? Which companies are leading these developments?
Q.7 Which technologies have potential of disruption in this market?
Q.8 Who are the major players in this PCB market? What strategic initiatives are being implemented by key players for business growth?
Q.9 What are strategic growth opportunities in this PCB technology space?
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Table of Contents
1. Executive Summary6. Latest Developments and Innovations in the PCB Technologies
2. Technology Landscape
3. Technology Readiness
4. Technology Trends and Forecasts Analysis from 2018-2030
5. Technology Opportunities (2018-2030) by Region
7. Companies / Ecosystem
8. Strategic Implications
9. Company Profiles of Leading Players
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Zhen Ding Technology Holding
- NOK Corporation
- TTM Technologies
- Unimicron Technology
- Compeq Manufacturing
- Young Poong Electronics
- Samsung Electro-Mechanics
- Tripod Technology
Methodology
The analyst has been in the business of market research and management consulting since 2000 and has published over 600 market intelligence reports in various markets/applications and served over 1,000 clients worldwide. Each study is a culmination of four months of full-time effort performed by the analyst team. The analysts used the following sources for the creation and completion of this valuable report:
- In-depth interviews of the major players in the market
- Detailed secondary research from competitors’ financial statements and published data
- Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
- A compilation of the experiences, judgments, and insights of professionals, who have analyzed and tracked the market over the years.
Extensive research and interviews are conducted in the supply chain of the market to estimate market share, market size, trends, drivers, challenges and forecasts.
Thus, the analyst compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. The analyst then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process.
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