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Test & Measurement Equipment for Silicon Photonics & co-packaged Optics Market - Global Forecast 2025-2032

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    Report

  • 188 Pages
  • November 2025
  • Region: Global
  • 360iResearch™
  • ID: 6085533
UP TO OFF until Jan 01st 2026
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For stakeholders navigating the fast-evolving landscape of optical technologies, the Test & Measurement Equipment for Silicon Photonics & Co-Packaged Optics Market is becoming crucial in ensuring device performance and market readiness. Senior decision-makers face increasing pressure to deploy precision tools and robust strategies as complexity and integration escalate across industries.

Market Snapshot: Test & Measurement Equipment for Silicon Photonics & Co-Packaged Optics

The global market for test and measurement equipment in silicon photonics and co-packaged optics is entering a sustained growth phase. Market size is projected to rise from USD 1.28 billion in 2024 to USD 1.36 billion in 2025 and is set to reach USD 2.04 billion by 2032, driven by a compound annual growth rate (CAGR) of 5.91%. This expansion reflects not just greater device complexity but also urgent capacity demands in data-intensive sectors such as data centers, telecommunications, automotive, and defense.

Scope & Segmentation

This research provides a comprehensive analysis across multiple dimensions, covering product types, end-users, and geographies. Key segments include:

  • Type: Measurement equipment such as electrical probing systems, impedance analyzers, optical characterization systems, power meters, and spectrometers; and test equipment including bit error rate testers (BERT), optical power meters, optical spectrum analyzers (OSA), optical time domain reflectometers (OTDR), oscilloscopes, and signal integrity analyzers.
  • Testing Stage: Die-level testing (die sort handlers, integrated test systems, probe stations); final product/system testing (integrated test systems, package handlers); in-line production testing (die sort handlers, integrated test systems, package handlers, probe stations); package-level testing (integrated test systems, package handlers); R&D/prototype testing (integrated test systems, package handlers, probe stations); wafer-level testing (base wafer test, stacked wafer test).
  • End-User: Aerospace and defense (optical communication systems, radar and sensing systems), automotive (optical sensors, autonomous vehicle communication systems), consumer electronics (wearable device data transmission, smart devices, optical interconnects), semiconductors (chip manufacturers, optical IC manufacturers, foundries), and telecommunications (data centers, optical network operators).
  • Distribution Channel: Offline and online, including company websites and e-commerce platforms.
  • Geographic Regions: Americas (United States, Canada, Mexico, Brazil, Argentina, Chile, Colombia, Peru); Europe, Middle East, and Africa (United Kingdom, Germany, France, Russia, Italy, Spain, Netherlands, Sweden, Poland, Switzerland, United Arab Emirates, Saudi Arabia, Qatar, Turkey, Israel, South Africa, Nigeria, Egypt, Kenya); Asia-Pacific (China, India, Japan, Australia, South Korea, Indonesia, Thailand, Malaysia, Singapore, Taiwan).

Key Takeaways for Senior Decision-Makers

  • Advanced test and measurement solutions are foundational to quality assurance, enabling organizations to accelerate development cycles while ensuring device reliability in high-density integration environments.
  • Integration of AI-driven diagnostics, modular hardware, and cloud-native analytics is helping firms future-proof testing infrastructure and enhance operational efficiency across silicon photonics and co-packaged optics applications.
  • Adoption of new industry standards and higher data rates has prompted the development of next-generation measurement tools, such as specialized bit error rate testers and optical domain reflectometers.
  • Strategic collaborations between equipment vendors, research bodies, and industry consortia are central to the accelerated validation of emerging device architectures and protocols, enabling early adoption of leading-edge form factors.
  • Segment dynamics signal growing opportunities for original equipment manufacturers, component suppliers, and data center operators to differentiate through innovation-focused investments and agile supply chain strategies.

Tariff Impact and Supply Chain Strategies

Recent United States tariff measures are affecting procurement and operational costs for test and measurement equipment, primarily due to increased duties on precision components. In response, manufacturers are emphasizing local sourcing, adjusting assembly processes, and leveraging long-term contracts. End-users are placing higher importance on total cost of ownership and are diversifying partnerships to secure resilient, cost-effective testing environments.

Methodology & Data Sources

This research combines extensive secondary research—drawing on technical literature, standards, and white papers—with in-depth primary interviews from equipment vendors, end-users, integrators, and research groups. Quantitative insights are validated via supply chain and trade data analysis, supported by expert review panels to reflect current and future trends.

Why This Report Matters

  • Supports informed strategic investments in test and measurement infrastructure for expanding silicon photonics and co-packaged optics operations.
  • Offers guidance on adapting to evolving standards, compliance, and integration challenges across high-growth application sectors and regions.

Conclusion

With increasing device complexity and the steady rise in integration levels, robust test and measurement solutions remain vital for technology leadership. This research empowers decision-makers to design resilient, scalable strategies in a rapidly advancing optical ecosystem.

Table of Contents

1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Stakeholders
2. Research Methodology
3. Executive Summary
4. Market Overview
5. Market Insights
5.1. Expansion of multi-parameter characterization techniques to address complex co-packaged optics issues
5.2. Development of scalable wafer-level testing solutions to improve throughput in silicon photonics fabrication
5.3. Utilization of high-bandwidth test equipment to support next-generation silicon photonics data rates
5.4. Growing integration of machine learning algorithms to predict device performance in photonics testing
5.5. Adoption of advanced calibration methods to enhance measurement accuracy in photonics testing equipment
5.6. Rising shift toward automated testing systems to accelerate silicon photonics device validation
5.7. Increasing demand for high-precision optical testing in data center interconnects
5.8. Innovations in compact and portable measurement tools for on-site photonics testing
5.9. Growing adoption of real-time monitoring and diagnostic techniques in photonics manufacturing
5.10. Advancements in integrated silicon photonics for enhanced sensor accuracy and speed
6. Cumulative Impact of United States Tariffs 2025
7. Cumulative Impact of Artificial Intelligence 2025
8. Test & Measurement Equipment for Silicon Photonics & co-packaged Optics Market, by Type
8.1. Measurement Equipment
8.1.1. Electrical Probing Systems
8.1.2. Impedance Analyzers
8.1.3. Optical Characterization Systems
8.1.4. Power Meters
8.1.5. Spectrometers
8.2. Test Equipment
8.2.1. Bit Error Rate Testers (BERT)
8.2.2. Optical Power Meters
8.2.3. Optical Spectrum Analyzers (OSA)
8.2.4. Optical Time Domain Reflectometers (OTDR)
8.2.5. Oscilloscopes
8.2.6. Signal Integrity Analyzers
9. Test & Measurement Equipment for Silicon Photonics & co-packaged Optics Market, by Testing Stage
9.1. Die-Level Testing
9.1.1. Die Sort Handlers
9.1.2. Integrated Test Systems
9.1.3. Probe Stations
9.2. Final Product/System Testing
9.2.1. Integrated Test Systems
9.2.2. Package Handlers
9.3. In-Line Production Testing
9.3.1. Die Sort Handlers
9.3.2. Integrated Test Systems
9.3.3. Package Handlers
9.3.4. Probe Stations
9.4. Package-Level Testing
9.4.1. Integrated Test Systems
9.4.2. Package Handlers
9.5. R&D/Prototype Testing
9.5.1. Integrated Test Systems
9.5.2. Package Handlers
9.5.3. Probe Stations
9.6. Wafer-Level Testing
9.6.1. Base Wafer Test
9.6.2. Stacked Wafer Test
10. Test & Measurement Equipment for Silicon Photonics & co-packaged Optics Market, by End-User
10.1. Aerospace & Defense
10.1.1. Optical Communication Systems
10.1.2. Radar & Sensing Systems
10.2. Automotive
10.2.1. Automotive Optical Sensors
10.2.2. Autonomous Vehicle Communication Systems
10.3. Consumer Electronics
10.3.1. Data Transmission in Wearables
10.3.2. Smart Devices & Optical Interconnects
10.4. Semiconductors
10.4.1. Chip Manufacturers
10.4.2. Optical IC Manufacturers
10.4.3. Semiconductor Foundries
10.5. Telecommunications
10.5.1. Data Centers
10.5.2. Optical Network Operators
11. Test & Measurement Equipment for Silicon Photonics & co-packaged Optics Market, by Distribution Channel
11.1. Offline
11.2. Online Channels
11.2.1. Company Website
11.2.2. E-Commerce Platforms
12. Test & Measurement Equipment for Silicon Photonics & co-packaged Optics Market, by Region
12.1. Americas
12.1.1. North America
12.1.2. Latin America
12.2. Europe, Middle East & Africa
12.2.1. Europe
12.2.2. Middle East
12.2.3. Africa
12.3. Asia-Pacific
13. Test & Measurement Equipment for Silicon Photonics & co-packaged Optics Market, by Group
13.1. ASEAN
13.2. GCC
13.3. European Union
13.4. BRICS
13.5. G7
13.6. NATO
14. Test & Measurement Equipment for Silicon Photonics & co-packaged Optics Market, by Country
14.1. United States
14.2. Canada
14.3. Mexico
14.4. Brazil
14.5. United Kingdom
14.6. Germany
14.7. France
14.8. Russia
14.9. Italy
14.10. Spain
14.11. China
14.12. India
14.13. Japan
14.14. Australia
14.15. South Korea
15. Competitive Landscape
15.1. Market Share Analysis, 2024
15.2. FPNV Positioning Matrix, 2024
15.3. Competitive Analysis
15.3.1. ANRITSU CORPORATION
15.3.2. Bruker Corporation
15.3.3. Chroma ATE Inc.
15.3.4. Coherent Corp.
15.3.5. Dimension Technology CO.,LTD
15.3.6. EXFO Inc.
15.3.7. FeedLiTech
15.3.8. FormFactor, Inc.
15.3.9. Intel Corporation
15.3.10. JENOPTIK AG
15.3.11. Keysight Technologies, Inc.
15.3.12. Laser Components GmbH
15.3.13. Luna Innovations Incorporated
15.3.14. OptoSigma Corporation
15.3.15. Quantifi Photonics Ltd
15.3.16. Rohde & Schwarz GmbH & Co. KG
15.3.17. Santec Holdings Corporation
15.3.18. Synopsys, Inc.
15.3.19. Teradyne, Inc.
15.3.20. Thorlabs, Inc.
15.3.21. Viavi Solutions Inc.
15.3.22. Yokogawa Electric Corporation
15.3.23. MPI Corporation
15.3.24. ficonTEC Service GmbH

Companies Mentioned

The companies profiled in this Test & Measurement Equipment for Silicon Photonics & co-packaged Optics market report include:
  • ANRITSU CORPORATION
  • Bruker Corporation
  • Chroma ATE Inc.
  • Coherent Corp.
  • Dimension Technology CO.,LTD
  • EXFO Inc.
  • FeedLiTech
  • FormFactor, Inc.
  • Intel Corporation
  • JENOPTIK AG
  • Keysight Technologies, Inc.
  • Laser Components GmbH
  • Luna Innovations Incorporated
  • OptoSigma Corporation
  • Quantifi Photonics Ltd
  • Rohde & Schwarz GmbH & Co. KG
  • Santec Holdings Corporation
  • Synopsys, Inc.
  • Teradyne, Inc.
  • Thorlabs, Inc.
  • Viavi Solutions Inc.
  • Yokogawa Electric Corporation
  • MPI Corporation
  • ficonTEC Service GmbH

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