3D TSV And 2.5D Market Report and Forecast 2025-2034

The global 3D TSV And 2.5D market size reached approximately USD 57.98 Billion in 2024 . The market is further projected to grow at a CAGR of 8.80% between 2025 and 2034, reaching a value of USD 134.76 Billion by 2034 .

Key Trends in the Market

3D TSV And 2.5D is enhances the functioning and performance of electronic devices by enabling the integration of semiconductor dies and chips. The 3D TSV allows direct connection between the multiple layers of the chip enabling high speed communication, while the 2.5 D utilises organic interposers that bridge the gap between the chips.

• The increased adoption of machine learning and artificial intelligence is a key trend aiding the 3D TSV And 2.5D market growth as they provide memory stacking abilities and aid in performance improvement of devices that are machine learning and artificial intelligence based.
• 3D TSV semiconductor packaging technology enables reduced data transmission time between chips resulting in faster speed and decreased power consumption, boosting the market growth. Due to the rising complexities of semiconductor devices the demand for 3D TSV AND 2.5D is increasing as they allow high integration levels and enhanced functionality.
• The growing requirement for advanced memory solutions is another major factor supporting the market expansion as 3D TSV AND 2.5D facilitates high memory capacity and bandwidth, resulting in their increased incorporation in various electronic devices.

Global 3D TSV And 2.5D Market Segmentation

Market Breakup by Packaging Type

• 2.5D Interposer
• 3D SoC
• 3D Stacked Memory
• CIS with TSV
• Others

Market Breakup by End Use

• Consumer Electronics
• Automotive
• High Performance Computing (HPC) and Networking
• Others

Market Breakup by Region

• North America
• Europe
• Asia Pacific
• Latin America
• Middle East and Africa

Market Share by End Use

Consumer electronics are expected to account for a significant 3D TSV And 2.5D market share due to the increasing adoption of tablets and smartphones, among other handheld devices. Due to the technological advancements, the production of miniaturised devices and touch screens along with other advanced features such as pressure and fingerprint sensors have increased, boosting consumer convenience. The growing penetration of online video streaming platforms is boosting television viewership and ownership, supporting the segment growth.

Market Share by Region

The Asia Pacific is anticipated to witness significant growth over the forecast period owing to the increased adoption of smartphones in the region. The rising investments in internet of things to support smart city infrastructure and the growing requirement for miniaturised IoT devices is supporting the market expansion in the Asia Pacific. The growing requirement for enhance memory solutions is further boosting the 3D TSV And 2.5D market demand.

Competitive Landscape

The comprehensive report provides an in-depth assessment of the market based on the Porter's five forces model along with giving a SWOT analysis. The report gives a detailed analysis of the following key players in the global market, covering their competitive landscape and latest developments like mergers, acquisitions, investments, and expansion plans.

Samsung Electronics Co. Ltd

Samsung Electronics Co. Ltd is a multinational corporation that is headquartered in Suwon-si, South Korea. The company is known for manufacturing various industrial and consumer electronic products and equipment personal computers and semiconductors, among others.

Toshiba Corp.

Toshiba Corp., headquartered in Tokyo, Japan, is known for manufacturing a wide range of business and consumer products including laptops, printers and copiers, HD television, and LCD devices, among others.

ASE Group

ASE Group is known for providing independent semiconductor assembling and test manufacturing services and for proliferating sophisticated electronics geared towards improving efficiency and lifestyle. The company was founded in 1984 and is headquartered in Kaohsiung, Taiwan.

Other 3D TSV And 2.5D market key players include Amkor Technology, Inc., Jiangsu Changing Electronics Technology Co. Ltd, United Microelectronics Corporation, ACM Research, Inc., and Powertech Technology Inc., among others.