3D TSV (Through Silicon Via) is a technology used in semiconductor manufacturing that involves the vertical interconnection of multiple layers of integrated circuits. It is a form of 3D integration that allows for the stacking of multiple chips in a single package, allowing for increased performance and reduced power consumption. This technology is used in a variety of applications, including high-performance computing, mobile devices, and automotive electronics. 3D TSV technology is becoming increasingly popular in the semiconductor industry due to its ability to reduce the size and cost of semiconductor packages. It also allows for increased performance and power efficiency, as well as improved thermal management. This technology is expected to continue to grow in the coming years as more companies adopt it for their products. Some of the companies in the 3D TSV market include Intel, Samsung, TSMC, GlobalFoundries, and UMC. Show Less Read more
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