North America Glass Interposers Market Size, Share & Industry Analysis Report By Wafer Size, By Application, By Substrate Technology, By End Use Industry, By Country and Growth Forecast, 2025 - 2032

The North America Glass Interposers Market is expected to witness market growth of 11.6% CAGR during the forecast period (2025-2032).

The US market dominated the North America Glass Interposers Market by country in 2024, and is expected to continue to be a dominant market till 2032; thereby, achieving a market value of $55.9 million by 2032. The Canada market is experiencing a CAGR of 14.9% during 2025-2032. Additionally, the Mexico market is expected to exhibit a CAGR of 13.2% during 2025-2032. The US and Canada led the North America Glass Interposers Market by Country with a market share of 80.2% and 8.5% in 2024.



North America is a mature market for glass interposers that is driven by innovation. This is because advanced packaging technologies were adopted early on and there is a lot of demand from industries like high-performance computing, aerospace, telecommunications, and data centers. The region's emphasis on creating localized semiconductor ecosystems and digital sovereignty propels the advancement of glass interposer solutions for essential infrastructure. One of the most important trends is the move toward chiplet-based architectures. Glass interposers offer better electrical performance and signal integrity than traditional organic substrates.

There is also more interest in large panel glass substrates that can be used for high-density interconnect applications. This supports trends in advanced 2.5D/3D packaging and heterogeneous integration. To improve domestic fabrication capabilities and innovation in substrate manufacturing, regional strategies focus on research alliances and public-private partnerships. Investments are aimed at pilot-scale production lines and process improvements like through-glass vias (TGV), thin-film redistribution layers (RDL), and wafer-level packaging. The market is affected by the growing need for smaller, better-performing electronics, as well as government efforts to boost semiconductor manufacturing in North America.

Wafer Size Outlook

Based on Wafer Size, the market is segmented into 300 mm, 200 mm, and Less than 200 mm. Among various US Glass Interposers Market by Wafer Size; The 300 mm market achieved a market size of USD $31.7 Million in 2024 and is expected to grow at a CAGR of 10.4 % during the forecast period. The Less than 200 mm market is predicted to experience a CAGR of 11.8% throughout the forecast period from (2025 - 2032).

Application Outlook

Based on Application, the market is segmented into 2.5D Packaging, 3D Packaging, and Fan-Out Packaging. The 2.5D Packaging market segment dominated the Canada Glass Interposers Market by Application is expected to grow at a CAGR of 14.3 % during the forecast period thereby continuing its dominance until 2032. Also, The Fan-Out Packaging market is anticipated to grow as a CAGR of 16.2 % during the forecast period during 2025-2032.

Country Outlook

The United States leads the North America glass interposers market, fueled by significant investments in semiconductor research, AI, 5G, and high-performance computing. The market is supported by a concentration of technology companies and strong demand from data centers, automotive, and medical sectors. Key trends include transitioning from silicon to advanced 2.5D and 3D glass interposers featuring through-glass vias for better performance. Major industry players drive innovation, although high production costs and supply chain limitations pose challenges. Ongoing research and efforts to scale manufacturing are expected to reduce costs and increase adoption, solidifying the U.S. as a global leader in this technology.

List of Key Companies Profiled

• Corning Incorporated
• AGC Inc.
• Schott AG (Carl-Zeiss-Stiftung)
• Dai Nippon Printing Co., Ltd.
• Tecnisco, LTD. (Disco Corporation)
• Samtec, Inc.
• RENA Technologies GmbH
• PLANOPTIK AG
• 3DGS Inc.
• Workshop of Photonics

Market Report Segmentation

By Wafer Size

• 300 mm
• 200 mm
• Less than 200 mm

By Application

• 2.5D Packaging
• 3D Packaging
• Fan-Out Packaging

By Substrate Technology

• Through-Glass Vias (TGV)
• Redistribution Layer (RDL)-First/Last
• Glass Panel Level Packaging (PLP)

By End Use Industry

• Consumer Electronics
• Telecommunications
• Automotive
• Defense & Aerospace
• Healthcare
• Other End Use Industry

By Country

• US
• Canada
• Mexico
• Rest of North America