The Latin America, Middle East and Africa Glass Interposers Market is expected to witness market growth of 13.2% CAGR during the forecast period (2025-2032).
The Brazil market dominated the LAMEA Glass Interposers Market by country in 2024, and is expected to continue to be a dominant market till 2032; thereby, achieving a market value of $5.8 million by 2032. The Argentina market is showcasing a CAGR of 15.1% during 2025-2032. Additionally, the UAE market would register a CAGR of 12.2% during 2025-2032. The Brazil and UAE led the LAMEA Glass Interposers Market by Country with a market share of 21.2% and 15.9% in 2024.
LAMEA’s glass interposers market is in its early stages but shows promising growth potential driven by investments in digital infrastructure and industrial upgrades. The region is gradually adopting advanced electronic packaging for telecom, consumer electronics, and automotive applications. Emerging trends include using glass interposers in test and sensor modules and industrial automation tools that require high thermal and electrical stability.
Strategic efforts in LAMEA focus on building local capacity through technical training, pilot projects, and collaborations with academic and research institutions. Several countries are developing semiconductor policies and partnerships to enhance precision packaging expertise within local ecosystems. Key growth drivers include rising internet and mobile penetration, expanding digitization in public and industrial sectors, and increasing demand for durable electronics in challenging environments like oil and gas, logistics, and defense.
The Brazil market dominated the LAMEA Glass Interposers Market by country in 2024, and is expected to continue to be a dominant market till 2032; thereby, achieving a market value of $5.8 million by 2032. The Argentina market is showcasing a CAGR of 15.1% during 2025-2032. Additionally, the UAE market would register a CAGR of 12.2% during 2025-2032. The Brazil and UAE led the LAMEA Glass Interposers Market by Country with a market share of 21.2% and 15.9% in 2024.
LAMEA’s glass interposers market is in its early stages but shows promising growth potential driven by investments in digital infrastructure and industrial upgrades. The region is gradually adopting advanced electronic packaging for telecom, consumer electronics, and automotive applications. Emerging trends include using glass interposers in test and sensor modules and industrial automation tools that require high thermal and electrical stability.
Strategic efforts in LAMEA focus on building local capacity through technical training, pilot projects, and collaborations with academic and research institutions. Several countries are developing semiconductor policies and partnerships to enhance precision packaging expertise within local ecosystems. Key growth drivers include rising internet and mobile penetration, expanding digitization in public and industrial sectors, and increasing demand for durable electronics in challenging environments like oil and gas, logistics, and defense.
Wafer Size Outlook
Based on Wafer Size, the market is segmented into 300 mm, 200 mm, and Less than 200 mm. Among various UAE Glass Interposers Market by Wafer Size; The 300 mm market achieved a market size of USD $2.7 Million in 2024 and is expected to grow at a CAGR of 11.7 % during the forecast period. The Less than 200 mm market is predicted to experience a CAGR of 13.3% throughout the forecast period from (2025 - 2032).Application Outlook
Based on Application, the market is segmented into 2.5D Packaging, 3D Packaging, and Fan-Out Packaging. The 2.5D Packaging market segment dominated the Brazil Glass Interposers Market by Application is expected to grow at a CAGR of 10.8 % during the forecast period thereby continuing its dominance until 2032. Also, The Fan-Out Packaging market is anticipated to grow as a CAGR of 12.7 % during the forecast period during 2025-2032.Country Outlook
Brazil’s glass interposers market is still in its infancy, with minimal commercial activity and early-stage adoption of semiconductor packaging technologies. While strong electronics manufacturing in automotive, aerospace, and telecom sectors offers future potential, current efforts focus on research and pilot projects, especially in sensor and telecom applications. Barriers include limited substrate infrastructure, high fabrication costs, and scarce supply of ultra-thin glass. Despite these challenges, Brazil may evolve as a system integrator using imported glass interposers, supported by government R&D and growing interest in 5G and IoT technologies.List of Key Companies Profiled
- Corning Incorporated
- AGC Inc.
- Schott AG (Carl-Zeiss-Stiftung)
- Dai Nippon Printing Co., Ltd.
- Tecnisco, LTD. (Disco Corporation)
- Samtec, Inc.
- RENA Technologies GmbH
- PLANOPTIK AG
- 3DGS Inc.
- Workshop of Photonics
Market Report Segmentation
By Wafer Size- 300 mm
- 200 mm
- Less than 200 mm
- 2.5D Packaging
- 3D Packaging
- Fan-Out Packaging
- Through-Glass Vias (TGV)
- Redistribution Layer (RDL)-First/Last
- Glass Panel Level Packaging (PLP)
- Consumer Electronics
- Telecommunications
- Automotive
- Defense & Aerospace
- Healthcare
- Other End Use Industry
- Brazil
- Argentina
- UAE
- Saudi Arabia
- South Africa
- Nigeria
- Rest of LAMEA
Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market at a Glance
Chapter 3. Market Overview
Chapter 6. Competition Analysis - Global
Chapter 11. LAMEA Glass Interposers Market by Wafer Size
Chapter 12. LAMEA Glass Interposers Market by Application
Chapter 13. LAMEA Glass Interposers Market by Substrate Technology
Chapter 14. LAMEA Glass Interposers Market by End Use Industry
Chapter 15. LAMEA Glass Interposers Market by Country
Chapter 16. Company Profiles
Companies Mentioned
- Corning Incorporated
- AGC Inc.
- Schott AG (Carl-Zeiss-Stiftung)
- Dai Nippon Printing Co., Ltd.
- Tecnisco, LTD. (Disco Corporation)
- Samtec, Inc.
- RENA Technologies GmbH
- PLANOPTIK AG
- 3DGS Inc.
- Workshop of Photonics
