Soft Chemical-Mechanical Polishing (CMP) Pad Market Report 2026

The soft chemical-mechanical polishing (cmp) pad market size has grown strongly in recent years. It will grow from $1.15 billion in 2025 to $1.24 billion in 2026 at a compound annual growth rate (CAGR) of 7.8%. The growth in the historic period can be attributed to semiconductor scaling, wafer surface uniformity needs, CMP process standardization, memory chip demand, electronics manufacturing growth.

The soft chemical-mechanical polishing (cmp) pad market size is expected to see strong growth in the next few years. It will grow to $1.69 billion in 2030 at a compound annual growth rate (CAGR) of 8%. The growth in the forecast period can be attributed to advanced logic chip production, AI hardware demand, automotive semiconductor growth, photonic device manufacturing, precision planarization requirements. Major trends in the forecast period include increasing use in advanced node fabrication, rising demand for defect free planarization, growth in memory device manufacturing, shift toward low pressure polishing solutions, advancements in pad material engineering.

The expanding semiconductor industry is expected to drive the growth of the soft chemical-mechanical polishing (CMP) pad market. This industry, which designs, manufactures, and sells semiconductor devices such as integrated circuits and transistors, is growing due to rising demand for advanced electronics such as smartphones, computers, and IoT devices that depend on sophisticated semiconductor components for optimal performance. Soft CMP pads play a critical role by enabling precise planarization, ensuring uniform wafer surfaces, and producing high-quality thin films. These pads help reduce defects and material inconsistencies, thereby enhancing device performance and manufacturing efficiency. For example, in July 2025, the Semiconductor Industry Association reported that semiconductor industry sales reached $630.5 billion and are projected to increase by 11.2% to $701 billion in 2025. As a result, the growth of the semiconductor industry is fueling demand for soft CMP pads.

The growing automotive industry is expected to drive the growth of the soft chemical-mechanical polishing (CMP) pad market in the coming years. The automotive industry encompasses the design, development, manufacture, marketing, and sale of motor vehicles, including cars, trucks, motorcycles, and their components. This growth is fueled by consumer demand for advanced, fuel-efficient, and technologically equipped vehicles. Soft CMP pads support the automotive industry by enabling precise polishing of semiconductor components used in modern vehicle electronics, enhancing component reliability and performance to meet the requirements of technology-driven automobiles. For instance, in May 2025, according to the European Automobile Manufacturers’ Association (ACEA), a Belgium-based organization, South American car production increased by 1.7% in 2024 compared to 2023, largely driven by Brazil, which recorded a 6.3% rise, producing approximately 1.9 million cars. Meanwhile, global bus production reached 362,005 units last year, marking a 10.3% increase from 2023. Therefore, the growing automotive industry is fueling the growth of the soft CMP pad market.

In April 2025, Enpulse Co. Ltd., a South Korea-based electronics company, acquired the CMP PAD Business Division from SKC Solmics Co., Ltd. for an undisclosed amount. Through this acquisition, Enpulse aims to expand its semiconductor materials portfolio and strengthen its position in the semiconductor manufacturing supply chain by integrating SKC Solmics’ CMP PAD technologies and expertise. SKC Solmics Co. Ltd. is a South Korea-based company specializing in chemical mechanical planarization (CMP) pads and related semiconductor process materials.

Major companies operating in the soft chemical-mechanical polishing (cmp) pad market are 3M Company, DuPont de Nemours Inc., Entegris Inc., Cabot Corporation, SKC Co. Ltd., Fujibo Holdings Inc., JSR Corporation, Hubei DingLong Chemical Co. Ltd., Beijing Grish Hitech Co. Ltd., Nitta Corporation, KPX Chemical Co. Ltd., Pureon AG, IV Technologies Inc., FNS TECH Co. Ltd., TWI Incorporated, Coorstek Inc., Resonac Corporation, KCTech Co. Ltd., Anji Microelectronics Co. Ltd., Jiangsu Nata Opto-electronic Material Co. Ltd.

Asia-Pacific was the largest region in the soft chemical-mechanical polishing (CMP) pad market in 2025. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the soft chemical-mechanical polishing (cmp) pad market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the soft chemical-mechanical polishing (cmp) pad market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The soft chemical-mechanical polishing (CMP) pad market consists of sales of oxide polishing pads, metal polishing pads, advanced slurry-compatible pads, hard texture pads, and soft texture pads. Values in this market are ‘factory gate’ values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

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