Wafer Bonder and Debonder Market Report 2025

The wafer bonder and debonder market size has grown strongly in recent years. It will grow from $0.97 billion in 2024 to $1.06 billion in 2025 at a compound annual growth rate (CAGR) of 9%. The expansion observed during the historical period is driven by increased use of silicon-on-insulator (SOI) technology, wider adoption of MEMS in automotive applications, greater deployment of CMOS image sensors in mobile devices, heightened focus on enhancing yield and throughput in wafer processing, and rising demand for durable packaging in challenging environments.

The wafer bonder and debonder market size is expected to see strong growth in the next few years. It will grow to $1.48 billion in 2029 at a compound annual growth rate (CAGR) of 8.7%. The anticipated growth during the forecast period is driven by a stronger focus on heterogeneous integration in 2.5D packaging, rising demand for compound semiconductors, expanding use of AI and high-performance computing devices, increased adoption of fan-out wafer-level packaging, and ongoing development of advanced photonics and quantum computing chips. Key trends expected include progress in wafer-level heterogeneous integration, improvements in thermal compression bonding techniques, development of AI-optimized wafer processing systems, and innovations in debonding technologies.

The growing need for advanced semiconductor devices is expected to boost the wafer bonder and debonder market. Semiconductor devices are electronic components that utilize the electrical characteristics of semiconductor materials to regulate current flow. This rising demand is largely fueled by the adoption of emerging technologies such as artificial intelligence (AI), the Internet of Things (IoT), and fifth-generation (5G) wireless networks, all of which require faster processing and greater energy efficiency. Wafer bonders and debonders play a crucial role in semiconductor manufacturing by allowing precise joining and separation of wafers during packaging and fabrication processes. For example, in May 2024, global semiconductor sales reached $49.1 billion, reflecting a 19.3% increase from May 2023 and a 4.1% rise from April 2024, according to the Semiconductor Industry Association, highlighting the strong demand driving market growth.

Leading companies in the wafer bonder and debonder sector are investing in innovative technologies such as automated die-to-wafer (D2W) hybrid bonding systems to improve precision, throughput, and scalability for high-density 3D semiconductor integration. These systems enable accurate alignment and bonding of individual dies onto wafers using mechanical and chemical interconnections, supporting advanced packaging requirements. In May 2025, SUSS MicroTec SE launched the XBC300 Gen2 D2W platform, expanding its hybrid bonding portfolio. The system supports bonding on 200 mm and 300 mm substrates, offers up to 40% footprint savings, and achieves post-bond accuracy of less than ±200 nm, making it ideal for producing high-precision chips.

In April 2025, Applied Materials Inc. acquired a 9% stake in BE Semiconductor Industries N.V., a move aimed at accelerating hybrid bonding technology for next-generation chip packaging. This collaboration seeks to enhance chip performance, energy efficiency, and integration density. BE Semiconductor Industries, based in the Netherlands, specializes in wafer bonding equipment.

Major players in the wafer bonder and debonder market are Canon Inc., Applied Materials Inc., Tokyo Electron Limited (TEL), Nitto Denko Corporation, ASM Pacific Technology Ltd., Kulicke & Soffa Industries Inc., Shibaura Mechatronics Corporation, SÜSS MicroTec SE, EV Group (EVG), TAZMO Inc., Palomar Technologies Inc., Toray Engineering Co. Ltd., ClassOne Technology Inc., Bondtech Co. Ltd., Applied Microengineering Ltd., ERS electronic GmbH, Shanghai Micro Electronics Equipment Co. Ltd., Hybond Inc., SiSTEM Technology Ltd., and Ayumi Industry Co. Ltd.

Asia-Pacific was the largest region in the wafer bonder and debonder market in 2024, and it is expected to be the fastest-growing region in the forecast period. The regions covered in wafer bonder and debonder report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa. The countries covered in the wafer bonder and debonder market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report’s Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.

The swift increase in U.S. tariffs and the ensuing trade tensions in spring 2025 are significantly affecting the machinery sector by increasing costs for steel, hydraulic systems, and precision bearings critical components often imported from tariff-affected regions. Manufacturers of construction, agricultural, and industrial machinery now face squeezed margins, as many long-term contracts prevent immediate price adjustments. The uncertainty has also delayed investment in automation and smart machinery technologies, slowing productivity gains. To adapt, firms are accelerating local supplier development, redesigning products to use alternative materials, and leveraging predictive maintenance to extend equipment lifespans amid higher replacement costs.

A wafer bonder and debonder is a semiconductor processing system designed to join wafers temporarily or permanently (bonding) for processes such as thinning or handling, and then separate them (debonding) without causing damage, maintaining precise alignment throughout.

The primary types of wafer bonders and debonders include manual, semi-automatic, and fully automatic models. Manual wafer bonders require operator input to align and bond wafers, and are typically used in research, prototyping, and low-volume production. These systems utilize technologies such as eutectic, anodic, fusion, and adhesive bonding. Applications include MEMS devices, power devices, optoelectronic devices, RF devices, and interposers. Key end-use industries are semiconductors, electronics, automotive, healthcare, and telecommunications.

The wafer bonder and debonder market research report is one of a series of new reports that provides wafer bonder and debonder market statistics, including the wafer bonder and debonder industry global market size, regional shares, competitors with the wafer bonder and debonder market share, detailed wafer bonder and debonder market segments, market trends, and opportunities, and any further data you may need to thrive in the wafer bonder and debonder industry. This wafer bonder and debonder market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenarios of the industry.

The wafer bonder and debonder market consists of sales of die attach systems, temporary bonding equipment, carrier wafers, and wafer alignment systems. Values in this market are ‘factory gate’ values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

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