Wafer Bonder and Debonder Market Report 2026

The wafer bonder and debonder market size has grown strongly in recent years. It will grow from $1.06 billion in 2025 to $1.16 billion in 2026 at a compound annual growth rate (CAGR) of 9.4%. The growth in the historic period can be attributed to growth of semiconductor fabrication, expansion of mems devices, demand for wafer thinning processes, advancement in bonding technologies, increase in electronic device production.

The wafer bonder and debonder market size is expected to see strong growth in the next few years. It will grow to $1.61 billion in 2030 at a compound annual growth rate (CAGR) of 8.5%. The growth in the forecast period can be attributed to growth of advanced packaging technologies, rising demand for power semiconductors, expansion of electric vehicle electronics, increasing semiconductor miniaturization, investment in high volume wafer manufacturing. Major trends in the forecast period include increasing adoption of advanced wafer bonding processes, growing demand for precision alignment and damage free debonding, rising use in advanced semiconductor packaging, expansion of mems and sensor manufacturing, higher focus on high volume automated wafer bonding.

The growing need for advanced semiconductor devices is expected to boost the wafer bonder and debonder market. Semiconductor devices are electronic components that utilize the electrical characteristics of semiconductor materials to regulate current flow. This rising demand is largely fueled by the adoption of emerging technologies such as artificial intelligence (AI), the Internet of Things (IoT), and fifth-generation (5G) wireless networks, all of which require faster processing and greater energy efficiency. Wafer bonders and debonders play a crucial role in semiconductor manufacturing by allowing precise joining and separation of wafers during packaging and fabrication processes. For example, in May 2024, global semiconductor sales reached $49.1 billion, reflecting a 19.3% increase from May 2023 and a 4.1% rise from April 2024, according to the Semiconductor Industry Association, highlighting the strong demand driving market growth.

Leading companies in the wafer bonder and debonder sector are investing in innovative technologies such as automated die-to-wafer (D2W) hybrid bonding systems to improve precision, throughput, and scalability for high-density 3D semiconductor integration. These systems enable accurate alignment and bonding of individual dies onto wafers using mechanical and chemical interconnections, supporting advanced packaging requirements. In May 2025, SUSS MicroTec SE launched the XBC300 Gen2 D2W platform, expanding its hybrid bonding portfolio. The system supports bonding on 200 mm and 300 mm substrates, offers up to 40% footprint savings, and achieves post-bond accuracy of less than ±200 nm, making it ideal for producing high-precision chips.

In April 2025, Applied Materials Inc. acquired a 9% stake in BE Semiconductor Industries N.V., a move aimed at accelerating hybrid bonding technology for next-generation chip packaging. This collaboration seeks to enhance chip performance, energy efficiency, and integration density. BE Semiconductor Industries, based in the Netherlands, specializes in wafer bonding equipment.

Major companies operating in the wafer bonder and debonder market are Canon Inc., Applied Materials Inc., Tokyo Electron Limited, Nitto Denko Corporation, ASM Pacific Technology Ltd., Shibaura Mechatronics Corporation, SÜSS MicroTec SE, EV Group, Palomar Technologies Inc., Toray Engineering Co. Ltd., Bondtech Co. Ltd., Applied Microengineering Ltd., Shanghai Micro Electronics Equipment Co. Ltd., Hybond Inc., SiSTEM Technology Ltd., Ayumi Industry Co. Ltd., Disco Corporation, Tokyo Seimitsu Co. Ltd., FINEPLACER, Test Research Inc., EVG Group, DNP.

Asia-Pacific was the largest region in the wafer bonder and debonder market in 2025, and it is expected to be the fastest-growing region in the forecast period. The regions covered in the wafer bonder and debonder market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the wafer bonder and debonder market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The wafer bonder and debonder market consists of sales of die attach systems, temporary bonding equipment, carrier wafers, and wafer alignment systems. Values in this market are ‘factory gate’ values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

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