The Global Power Electronics Market 2026-2036

Global power electronics market accelerates as electrification, data centers, and wide bandgap semiconductors drive a new era of high-efficiency energy conversion

Power electronics is no longer confined to specialist applications. Its influence now spans electric vehicles, renewable energy systems, industrial automation, data-centre infrastructure and advanced consumer equipment. What links these sectors is the need to move energy more efficiently and at higher power densities.

The global power electronics market is experiencing unprecedented growth and transformation, driven by the electrification of transportation, renewable energy expansion, and surging demand for data center infrastructure. This dynamic sector encompasses the critical components that convert and control electrical power across virtually every modern application, from electric vehicle powertrains to grid-scale energy storage systems. At the heart of this market evolution is a fundamental technology transition from traditional silicon-based devices to wide bandgap (WBG) semiconductors, specifically silicon carbide (SiC) and gallium nitride (GaN). This paradigm shift represents the most significant advancement in power electronics since the introduction of IGBTs in the 1980s. SiC MOSFETs offer compelling advantages over silicon IGBTs, including higher temperature operation, superior thermal conductivity, switching speeds up to five times faster, and the potential to increase electric vehicle range by approximately 7%. These characteristics enable more compact, efficient power conversion systems with smaller passive components and reduced cooling requirements.

The electric vehicle sector stands as the primary growth driver for power electronics demand. Key components include traction inverters, onboard chargers (OBCs), and DC-DC converters, with the market increasingly adopting 800V architectures to enable faster charging and improved efficiency. SiC MOSFETs are rapidly gaining market share in EV inverters, with projections indicating they will become the majority technology by 2035. Meanwhile, GaN devices are making significant inroads in lower-power applications such as onboard chargers and DC-DC converters, where their high-frequency switching capabilities enable dramatic reductions in size and weight.

The supply chain for power electronics is undergoing significant restructuring, with vertical integration emerging as a key strategic trend. Major automotive OEMs and semiconductor suppliers are securing supply through acquisitions, partnerships, and in-house development of SiC capabilities. The transition from 150mm to 200mm SiC wafers represents a critical milestone that will substantially increase production capacity and reduce costs, with multiple suppliers worldwide scaling up 200mm wafer production. Chinese manufacturers have entered the market aggressively, with four Chinese companies now ranking among the top 20 global power device suppliers.

Data centers represent another rapidly expanding application, driven by artificial intelligence workloads that demand unprecedented power levels. Power supply units are evolving to meet stringent efficiency standards, with the 80 PLUS Ruby certification requiring up to 96.5% efficiency. Wide bandgap adoption is accelerating in this sector, with hybrid designs combining silicon, SiC, and GaN emerging as the preferred approach for maximizing efficiency across different power conversion stages.

The industry is also witnessing a conceptual evolution from discrete converter design toward integrated system-level approaches. This "Power Electronics 2.0" paradigm emphasizes energy management over simple power conversion, incorporating smart grid integration, distributed control architectures, and mission-oriented efficiency metrics. Multi-cell converter architectures are gaining traction, offering advantages including switching frequency multiplication, improved redundancy, and standardization benefits.

Despite the rapid advancement of WBG technologies, silicon devices continue to hold significant market share due to their maturity, established supply chains, and cost advantages. The market is characterized by intense cost pressure, particularly in price-sensitive segments like solar inverters and battery energy storage systems. Looking forward, the global power electronics market is projected to grow with a compound annual growth rate exceeding 8%, adding more than $15 billion in market value by 2030, driven by the continued expansion of electric mobility, renewable energy deployment, and digital infrastructure requirements.

The Global Power Electronics Market 2026-2036 provides comprehensive analysis of the rapidly evolving power semiconductor industry, examining the transformative shift from silicon-based devices to wide bandgap (WBG) technologies including silicon carbide (SiC) MOSFETs and gallium nitride (GaN) HEMTs. This in-depth market intelligence report delivers granular 10-year forecasts covering market size in US dollars and gigawatts across key segments including electric vehicle inverters, onboard chargers, DC-DC converters, data center power supply units, renewable energy systems, and industrial applications.

The report analyzes critical technology trends driving market growth, including the transition from 400V to 800V EV architectures, the evolution from 150mm to 200mm SiC wafer production, and the emergence of integrated power electronics modules. Detailed supply chain analysis covers the complete value chain from raw materials and wafer production through device manufacturing, packaging, and system integration, with particular focus on vertical integration strategies and the rising influence of Chinese manufacturers in the global market.

Regional market analysis examines growth dynamics across China, Europe, North America, Japan, South Korea, and emerging markets, while competitive landscape assessment provides market share rankings, M&A activity tracking, and strategic partnership analysis. The report includes over 90 detailed company profiles spanning semiconductor device manufacturers, GaN specialists, SiC wafer suppliers, tier-1 automotive suppliers, automotive OEMs, and system integrators.

Report contents include:

Market Analysis & Forecasts
- Global power electronics market size and 10-year growth projections (2026-2036)
- Device-level forecasts for Si IGBTs, SiC MOSFETs, and GaN devices by voltage class
- Application-level forecasts for EV inverters, onboard chargers, and DC-DC converters in units, GW, and US$
- Regional market forecasts for China, Europe, North America, and Asia-Pacific
- Price trend analysis and cost reduction projections for WBG semiconductors
Technology Analysis
- Comprehensive comparison of Si, SiC, and GaN semiconductor properties and performance
- Technology S-curve analysis and paradigm shift to Power Electronics 2.0
- Multi-cell converter architectures including parallel and series interleaving
- Packaging evolution including single-sided and double-sided cooling technologies
- 150mm to 200mm SiC wafer transition timeline and cost advantages
Application Markets
- Electric vehicle power electronics including 400V vs 800V architecture analysis
- Traction inverter, onboard charger, and DC-DC converter technology benchmarking
- Data center PSU market including AI server power requirements
- Renewable energy applications covering solar PV, wind, and battery energy storage
- Grid infrastructure including smart grid, solid-state transformers, and HVDC systems
Supply Chain Analysis
- Complete Si, SiC, and GaN supply chain mapping from raw materials to end applications
- SiC wafer supplier market share and 200mm production roadmap
- Vertical integration trends and OEM acquisition strategies
- Packaging and assembly supply chain including die attach technologies
- Passive component technology roadmap for capacitors and magnetics
Competitive Landscape
- Top 20 power device supplier rankings and market share analysis
- Recent mergers, acquisitions, and strategic partnerships
- Manufacturing capacity expansion plans by region and technology
- OEM-supplier relationship mapping for SiC MOSFETs and Si IGBTs
Future Technology Trends
- Power Electronics 2.0 vision: from converters to systems
- SiC and GaN technology roadmaps through 2035
- Emerging WBG materials including Ga₂O₃ and diamond
- Virtual prototyping and digital twin design methodologies

CHAPTER 1: EXECUTIVE SUMMARY

1.1 Report Introduction and Scope
1.2 Key Findings and Market Highlights
1.3 Global Power Electronics Market Overview 2026-2036
1.4 Technology Evolution: From Silicon to Wide Bandgap
1.5 Market Size and Growth Projections Summary
1.6 Regional Market Analysis Overview
1.7 Key Market Drivers and Challenges
1.8 Strategic Recommendations

CHAPTER 2: MARKET OVERVIEW AND DEFINITIONS

2.1 Power Electronics Fundamentals
2.1.1 What is Power Electronics?
2.1.2 Key Applications and End Markets
2.1.3 Power Conversion Technologies Overview
2.2 Market Segmentation Framework
2.2.1 By Product Type (Inverters, Converters, Rectifiers)
2.2.2 By Semiconductor Material (Si, SiC, GaN)
2.2.3 By Application Sector
2.2.4 By Voltage Class
2.3 Performance Indices and Metrics
2.3.1 Power Density (kW/dm³)
2.3.2 Efficiency and Loss Analysis
2.3.3 Cost per kW Trends
2.3.4 Reliability and Failure Rate Metrics

CHAPTER 3: TECHNOLOGY ANALYSIS

3.1 Evolution of Power Electronics Technology
3.1.1 Historical Development: SCRs to WBG
3.1.2 Technology S-Curve Analysis
3.1.3 Paradigm Shift to Power Electronics 2.0
3.2 Silicon-Based Power Devices
3.2.1 Silicon IGBT Technology and Performance
3.2.2 Silicon MOSFET Applications
3.2.3 Super-Junction Technology Advances
3.2.4 Si Device Roadmap and Limitations
3.3 Silicon Carbide (SiC) Technology
3.3.1 SiC Material Properties and Advantages
3.3.2 SiC MOSFET Technology Development
3.3.3 SiC vs Si IGBT Performance Comparison
3.3.4 SiC Device Packaging Evolution
3.3.5 150mm to 200mm Wafer Transition
3.3.6 SiC Cost Reduction Roadmap
3.4 Gallium Nitride (GaN) Technology
3.4.1 GaN Material Properties and Potential
3.4.2 GaN HEMT and FET Technologies
3.4.3 GaN-on-Si vs Alternative Substrates
3.4.4 GaN Voltage Limitations and Solutions
3.4.5 GaN Device Roadmap for Automotive
3.5 Converter Topology Analysis
3.5.1 Multi-Cell Converter Architectures
3.5.2 Parallel and Series Interleaving
3.5.3 DC-Transformer Concepts
3.5.4 Three-Level Inverter Designs
3.6 Packaging and Thermal Management
3.6.1 Power Module Packaging Evolution
3.6.2 Single-Sided vs Double-Sided Cooling
3.6.3 Thermal Interface Materials (TIM)
3.6.4 Advanced Packaging Technologies (P4, p²pack)

CHAPTER 4: APPLICATION MARKETS ANALYSIS

4.1 Electric Vehicles (EVs)
4.1.1 EV Market Overview and Growth Trends
4.1.2 Traction Inverter Technologies
4.1.3 Onboard Charger (OBC) Systems
4.1.4 DC-DC Converter Requirements
4.1.5 400V vs 800V Architecture Analysis
4.1.6 Power Electronics Integration Trends
4.1.7 Heavy-Duty Vehicle Applications
4.2 Renewable Energy
4.2.1 Solar PV Inverter Market
4.2.2 Wind Power Converters
4.2.3 Battery Energy Storage Systems (BESS)
4.3 Industrial Applications
4.3.1 Motor Drives and Variable Frequency Drives
4.3.2 Industrial Power Supplies
4.3.3 Welding and Process Equipment
4.4 Data Centers and Computing
4.4.1 Power Supply Unit (PSU) Market
4.4.2 AI Server Power Requirements
4.4.3 48V to 400V Architecture Transition
4.4.4 UPS and Backup Power Systems
4.5 Grid Infrastructure
4.5.1 Smart Grid and Energy Management
4.5.2 Solid-State Transformers
4.5.3 HVDC Transmission Systems
4.6 Consumer Electronics and Telecommunications
4.6.1 Fast Charging Technologies
4.6.2 Telecom Power Systems

CHAPTER 5: REGIONAL MARKET ANALYSIS

5.1 China
5.1.1 Market Size and Growth
5.1.2 Domestic Manufacturing Expansion
5.1.3 SiC Wafer Production Scale-up
5.1.4 Key Chinese Players Analysis
5.2 Europe
5.2.1 Market Overview and Regulations
5.2.2 EU Emissions Targets Impact
5.2.3 European Semiconductor Initiatives
5.3 United States
5.3.1 Market Trends and Policy Drivers
5.3.2 CHIPS Act and Manufacturing Incentives
5.3.3 US-Based Supply Chain Analysis
5.4 Japan and South Korea
5.4.1 Technology Leadership Positions
5.4.2 Automotive OEM Strategies
5.5 Rest of World
5.5.1 India Market Potential
5.5.2 Southeast Asia Manufacturing Hub

CHAPTER 6: SUPPLY CHAIN ANALYSIS

6.1 Silicon Supply Chain
6.1.1 Si Wafer Suppliers
6.1.2 Si IGBT Production Flow
6.1.3 Market Shares and Capacity
6.2 SiC Supply Chain
6.2.1 SiC Raw Materials to Wafers
6.2.2 SiC Wafer Suppliers Global Analysis
6.2.3 SiC MOSFET Manufacturing Process
6.2.4 200mm SiC Wafer Production Roadmap
6.2.5 Vertical Integration Trends
6.3 GaN Supply Chain
6.3.1 GaN Substrate Options and Suppliers
6.3.2 GaN Device Manufacturing
6.3.3 GaN vs Si Manufacturing Comparison
6.4 Packaging and Assembly
6.4.1 Power Module Packaging Supply Chain
6.4.2 Die Attach Technologies
6.4.3 OSAT Providers Analysis
6.5 Passive Components
6.5.1 Capacitor Supply Chain
6.5.2 Magnetic Components
6.5.3 Expected Technology Progress
6.6 Supply Chain Challenges
6.6.1 Chip Shortage Impact Analysis
6.6.2 Geopolitical Considerations
6.6.3 Multi-sourcing Strategies

CHAPTER 7: MARKET FORECASTS 2026-2036

7.1 Global Market Overview
7.1.1 Total Market Size (US$ Billion)
7.1.2 Market Growth by Segment
7.1.3 CAGR Analysis by Technology
7.2 Device-Level Forecasts
7.2.1 Si IGBT Market Forecast
7.2.2 SiC MOSFET Market Forecast
7.2.3 GaN Device Market Forecast
7.2.4 Market Share Transitions: Si vs SiC vs GaN
7.3 Application-Level Forecasts
7.3.1 EV Inverter Forecast (Units, GW, US$)
7.3.2 Onboard Charger Forecast
7.3.3 DC-DC Converter Forecast
7.3.4 Data Center PSU Forecast
7.3.5 Renewable Energy Forecast
7.3.6 Industrial Applications Forecast
7.4 Wafer and Material Forecasts
7.4.1 Si Wafer Market Forecast
7.4.2 SiC Wafer Market Forecast
7.4.3 GaN Substrate Market Forecast
7.5 Regional Forecasts
7.5.1 China Market Forecast
7.5.2 Europe Market Forecast
7.5.3 North America Market Forecast
7.5.4 Asia-Pacific Market Forecast
7.6 Price and Cost Forecasts
7.6.1 Si IGBT vs SiC MOSFET Price Trends
7.6.2 SiC Cost Reduction Projections
7.6.3 GaN Device Pricing Outlook

CHAPTER 8: COMPETITIVE LANDSCAPE

8.1 Market Share Analysis
8.1.1 Top 20 Power Device Suppliers Ranking
8.1.2 Market Share by Technology Segment
8.1.3 Regional Market Share Distribution
8.2 Competitive Strategies
8.2.1 Vertical Integration Approaches
8.2.2 OEM Partnership Models
8.2.3 Technology Licensing Strategies
8.3 Mergers, Acquisitions, and Partnerships
8.3.1 Recent M&A Activity Analysis
8.3.2 Strategic Partnerships Overview
8.3.3 Joint Ventures and Collaborations
8.4 Capacity Expansion Plans
8.4.1 Si Fab Expansion Projects
8.4.2 SiC Manufacturing Investments
8.4.3 GaN Production Scale-up

CHAPTER 9: FUTURE TECHNOLOGY TRENDS

9.1 Power Electronics 2.0 Vision
9.1.1 From Converters to Systems
9.1.2 Energy Management Paradigm
9.1.3 Smart Grid Integration
9.2 Device Technology Roadmap
9.2.1 SiC Technology Evolution
9.2.2 GaN High-Voltage Development
9.2.3 Emerging Materials (Ga2O3, Diamond)
9.3 System-Level Innovations
9.3.1 Integrated Power Electronics Modules
9.3.2 Multi-Cell and Modular Architectures
9.3.3 Virtual Prototyping and Digital Twins
9.4 Passives and EMI Challenges
9.4.1 Advanced Magnetic Materials
9.4.2 Capacitor Technology Trends
9.4.3 EMI Reduction Strategies

CHAPTER 10: STRATEGIC OUTLOOK AND CONCLUSIONS

10.1 Market Evolution Summary
10.2 Technology Adoption Timelines
10.3 Investment Opportunities
10.4 Risk Factors and Mitigation
10.5 Key Takeaways and Recommendations

CHAPTER 11: COMPANY PROFILES

11.1 Semiconductor Device Manufacturers (16 company profiles)
11.2 GaN Specialists (11 company profiles)
11.3 SiC Wafer and Material Suppliers (6 company profiles)
11.4 Tier-1 Automotive Suppliers (10 company profiles)
11.5 Automotive OEMs with In-House Development (10 company profiles)
11.6 Chinese Power Electronics Companies (9 company profiles)
11.7 Module and System Integrators (6 company profiles)
11.8 Data Center and Industrial Power (6 company profiles)
11.9 Specialty and Emerging Companies (8 company profiles)

CHAPTER 12: APPENDICES

12.1 Methodology
12.2 Glossary of Terms
12.3 Abbreviations
12.4 Data Sources and References

LIST OF TABLES

Table 1: Global Power Electronics Market Summary 2026-2036
Table 2: Key Market Metrics by Segment
Table 3: Technology Comparison: Si vs SiC vs GaN
Table 4: Regional Market Share Distribution
Table 5: Material Properties Comparison: Si, SiC, GaN
Table 6: SiC MOSFET vs Si IGBT Performance Benchmarks
Table 7: SiC Device Packaging Technologies Comparison
Table 8: 150mm vs 200mm SiC Wafer Cost Advantages
Table 9: GaN HEMT Specifications by Manufacturer
Table 10: GaN Substrate Options and Trade-offs
Table 11: Multi-Cell Converter Advantages and Challenges
Table 12: Thermal Interface Material Properties
Table 13: Single vs Double-Sided Cooling Comparison
Table 14: EV Power Electronics Specifications by OEM
Table 15: Traction Inverter Benchmarking (Si, SiC, GaN)
Table 16: Onboard Charger Power Levels by Vehicle Segment
Table 17: 400V vs 800V Architecture Comparison
Table 18: 800V Platform Adoption by OEM (2022-2025)
Table 19: Heavy-Duty Vehicle Power Electronics Requirements
Table 20: Data Center PSU Efficiency Standards (80 PLUS)
Table 21: AI Server Power Requirements by Generation
Table 22: China Power Electronics Market Size 2026-2036
Table 23: Chinese SiC Wafer Manufacturers Capacity
Table 24: European Power Electronics Regulatory Framework
Table 25: US Semiconductor Manufacturing Incentives
Table 26: Top 10 Si Wafer Suppliers by Revenue
Table 27: SiC Wafer Supplier Market Share Analysis
Table 28: 200mm SiC Wafer Production Timeline by Supplier
Table 29: Vertical Integration: OEM Acquisitions and Partnerships
Table 30: GaN Device Manufacturers and Capacities
Table 31: Die Attach Technologies Comparison
Table 32: Passive Component Technology Roadmap
Table 33: Global Power Electronics Market Forecast (US$ Billion)
Table 34: Market Size by Technology Segment 2026-2036
Table 35: CAGR Comparison by Market Segment
Table 36: Si IGBT Market Forecast by Application
Table 37: SiC MOSFET Market Forecast by Voltage Class
Table 38: GaN Device Market Forecast by Application
Table 39: EV Inverter Forecast: Units, GW, Revenue
Table 40: OBC Market Forecast by Semiconductor Type
Table 41: DC-DC Converter Forecast by Technology
Table 42: Data Center PSU Market Forecast
Table 43: Si Wafer Market Forecast (Munits, US$)
Table 44: SiC Wafer Market Forecast by Diameter
Table 45: Regional Market Forecasts 2026-2036
Table 46: Si IGBT vs SiC MOSFET Price Comparison
Table 47: Cost Assumptions by Device Type (US$/kW)
Table 48: Top 20 Power Device Suppliers 2024 Ranking
Table 49: Market Share by Technology: Si, SiC, GaN
Table 50: SiC MOSFET Suppliers to Leading OEMs
Table 51: Si IGBT Suppliers to Automotive OEMs
Table 52: Recent M&A Transactions in Power Electronics
Table 53: Strategic Partnerships 2023-2025
Table 54: Manufacturing Capacity Expansion Plans
Table 55: Power Electronics 2.0 Key Characteristics
Table 56: SiC Technology Roadmap 2025-2035
Table 57: GaN Voltage Progression Timeline
Table 58: Emerging WBG Materials Comparison
Table 59: Company Profile Summary Matrix
Table 60: Infineon SiC and GaN Portfolio
Table 61: STMicroelectronics OEM Design Wins
Table 62: Tesla Power Electronics Evolution
Table 63: BYD Vertical Integration Structure

LIST OF FIGURES

Figure 1: Global Power Electronics Market Evolution 2026-2036
Figure 2: Technology S-Curve: Evolution of Power Electronics
Figure 3: Market Share Transition: Si to WBG Semiconductors
Figure 4: Regional Market Distribution 2026 vs 2036
Figure 5: Key Market Drivers Influence Diagram
Figure 6: Power Electronics Technology S-Curve Evolution
Figure 7: Paradigm Shift: Power Electronics 1.0 to 2.0
Figure 8: Si IGBT Performance Improvements 1990-2025
Figure 9: Super-Junction Technology Cross-Section
Figure 10: Pareto Front: Si Semiconductor Trade-offs
Figure 11: SiC vs Si Material Properties Comparison
Figure 12: SiC MOSFET Switching Loss Reduction
Figure 13: ?-?-Pareto Front Analysis
Figure 14: 150mm to 200mm SiC Wafer Die Count Advantage
Figure 15: GaN HEMT Structure Schematic
Figure 16: GaN vs SiC Potential in Inverter Applications
Figure 17: Multi-Cell Converter Basic Concept
Figure 18: Parallel Interleaving Benefits Diagram
Figure 19: Series Interleaving Loss Reduction
Figure 20: R_DS(on) Scaling with Blocking Voltage
Figure 21: VIENNA Rectifier Generation Comparison
Figure 22: Single vs Double-Sided Cooling Schematic
Figure 23: P4 Planar Power Packaging Technology
Figure 24: EV Power Electronics System Architecture
Figure 25: Traction Inverter Power Density Benchmarking
Figure 26: IDTechEx Inverter Benchmarking: Si, SiC, GaN
Figure 27: Onboard Charger Block Diagram
Figure 28: 400V vs 800V Architecture Comparison
Figure 29: 800V Platform Charging Speed Advantages
Figure 30: Power Electronics Integration Levels
Figure 31: Integrated OBC with DC-DC Converter
Figure 32: Smart Grid Energy Control Center Concept
Figure 33: Solid-State Transformer Architecture
Figure 34: Data Center PSU Power Density Trends
Figure 35: AI Server Power Consumption Growth
Figure 36: China EV Market Growth and Power Electronics
Figure 37: Chinese SiC Wafer Production Roadmap
Figure 38: European EV Sales and Regulatory Impact
Figure 39: US Power Electronics Market by Application
Figure 40: Si IGBT Production Flow: Raw Material to EV
Figure 41: SiC MOSFET Production Flow Diagram
Figure 42: 200mm SiC Wafer Production Worldwide
Figure 43: Vertical Integration: Acquisitions Map
Figure 44: GaN vs Si: Die to Vehicle Level Comparison
Figure 45: Power Module Packaging Supply Chain
Figure 46: Silver Sintering vs Solder Reliability
Figure 47: Passive Component Technology S-Curve
Figure 48: Global Power Electronics Market 2026-2036 (US$B)
Figure 49: Power Device Market Split by Technology
Figure 50: Si IGBT Market Trend 2026-2036
Figure 51: SiC MOSFET Market Growth Projection
Figure 52: GaN Device Market Adoption Curve
Figure 53: Inverter Market Share: Si vs SiC vs GaN 2023-2036
Figure 54: EV Inverter Forecast (GW)
Figure 55: OBC Forecast by Semiconductor Type (GW)
Figure 56: DC-DC Converter Forecast (GW)
Figure 57: Inverter, OBC, DC-DC Combined Forecast (US$B)
Figure 58: Data Center PSU Market by Power Level
Figure 59: SiC Wafer Market Forecast by Diameter
Figure 60: Regional Market Comparison 2026 vs 2036
Figure 61: SiC vs Si IGBT Price Trend 2020-2036
Figure 62: Top 20 Power Device Suppliers Market Share
Figure 63: Market Share Evolution: 2020-2024
Figure 64: Chinese Companies Rising Market Presence
Figure 65: Manufacturing Capacity Expansion Map
Figure 66: Power Electronics 2.0 Vision Framework
Figure 67: From Converter to System Analysis
Figure 68: FREEDM Smart Grid Architecture
Figure 69: Virtual Prototyping Design Process Evolution
Figure 70: Research Topics: Components, Converters, Systems
Figure 71: Infineon CoolSiC Product Portfolio
Figure 72: STMicroelectronics ACEPACK Technology
Figure 73: Wolfspeed SiC Manufacturing Roadmap
Figure 74: Tesla Model 3/Y Inverter Architecture
Figure 75: Hyundai E-GMP 800V Platform Diagram
Figure 76: Nvidia Influence on Data Center Power Supply Chain

Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

ABB
Advanced Electric Machines
Advanced Energy Industries
AMETS Power Electronics. BMW
BorgWarner
Bosch
BYD
Cambridge GaN Devices
Coherent (II-VI)
Continental
CR Micro
CRRC Corporation
Dana Incorporated
Delta Electronics
Denso
Diamond Foundry
Diodes Incorporated
Dynex Semiconductor
Eaton
Efficient Power Conversion (EPC)
Equipmake
Fuji Electric
GaN Systems
General Motors
Helix Technologies
Hitachi Astemo
Hitachi Energy
Huawei
Hyundai Motor Group
Infineon Technologies

Report contents include:

Table of Contents

Companies Mentioned (Partial List)

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