Liquid Crystal Polymer (LCP)-Based Molded Interconnect Device Global Market Report 2025

The liquid crystal polymer (LCP)-based molded interconnect device market size has grown rapidly in recent years. It will grow from $0.64 billion in 2024 to $0.75 billion in 2025 at a compound annual growth rate (CAGR) of 17.3%. The growth in the historic period is attributed to the increasing adoption of miniaturized electronic components, the growing demand for high-performance materials, the rising need for lightweight and compact electronic designs, the expanding demand in the automotive industry, and the growth of consumer electronics production.

The liquid crystal polymer (LCP)-based molded interconnect device market size is expected to see rapid growth in the next few years. It will grow to $1.41 billion in 2029 at a compound annual growth rate (CAGR) of 17%. The growth in the forecast period is driven by the increasing demand for 5G and IoT-enabled devices, the growing adoption of smart manufacturing solutions, the rising use of automation in electronic assembly, the expansion of wearable and medical device applications, and the increasing preference for sustainable production materials. Key trends in the forecast period include advancements in laser direct structuring, innovation in multi-layer circuit integration, developments in high-frequency and high-speed connectivity, innovations in miniaturized circuitry, and research and development in eco-friendly LCP materials.

The increasing adoption of 5G connections is expected to drive the growth of the liquid crystal polymer (LCP)-based molded interconnect device market in the coming years. 5G connections are fifth-generation wireless networks that provide ultra-fast data transmission, low latency, and enhanced connectivity for a wide range of devices. The growing adoption of 5G is fueled by rising wireless data demand, as consumers increasingly rely on mobile networks for streaming, remote work, and connected applications, requiring advanced network infrastructure to support unprecedented data volumes. The adoption of 5G connections increases demand for LCP-based molded interconnect devices, as these components offer superior high-frequency signal transmission and thermal stability essential for efficient 5G antenna systems and communication modules. For example, in May 2025, according to Ericsson, a Sweden-based telecommunications company, 5G mobile subscriptions are projected to rise from 1.62 billion in 2023 to 6.29 billion by 2030. Therefore, the increasing adoption of 5G connections is propelling the growth of the liquid crystal polymer (LCP)-based molded interconnect device market.

Key companies in the liquid crystal polymer (LCP)-based molded interconnect devices market are focusing on developing bio-based monomer synthesis technology to enhance material sustainability and improve overall performance. Bio-based monomer synthesis technology involves producing polymer monomers from renewable biomass through biochemical or catalytic processes, enabling sustainable, carbon-neutral, high-performance materials such as liquid crystal polymer. For instance, in June 2025, Sumitomo Chemical Co., Ltd., a Japan-based chemical manufacturing company, established mass production technology for super engineering plastic, specifically liquid crystal polymer (LCP), using biomass-derived monomers. This technology leverages biomanufacturing techniques to produce eco-friendly LCP, known for its heat and fire resistance, and widely used in electric and electronic components in smartphones, automotive parts, and office automation equipment.

In January 2024, Biesterfeld AG, a Germany-based distributor specializing in plastics, rubber, and specialty chemicals, partnered with Celanese Corporation to expand the distribution of engineered materials. Through this partnership, Biesterfeld and Celanese aim to strengthen portfolio collaboration and extend distribution rights globally, enhancing market reach, product diversification, and regional expansion in EMEA, Southeast Asia, and Brazil. Celanese Corporation is a US-based provider of Vectra liquid crystal polymer (LCP), designed for the miniaturization of antennas, sensors, and connectors.

Major players in the liquid crystal polymer (LCP)-based molded interconnect device market are Sumitomo Electric Industries Ltd, Toray Industries Inc., TE Connectivity Ltd, Amphenol Corporation, Celanese Corporation, Chiyoda Integre Co Ltd, HARTING Technology Group, Sunway Communication Co Ltd, Ensinger GmbH, RTP Company, JAE Electronics Inc, LPKF Laser & Electronics SE, Matrix Tool Inc, JG Plastics Group LLC, UENO Fine Chemicals Industry Ltd, 2E mechatronic GmbH & Co KG, TEPROSA GmbH, Sodick Co Ltd, Chang Chun Plastics Co Ltd, and De Monchy International BV.

Asia-Pacific was the largest region in the liquid crystal polymer (LCP)-based molded interconnect device market in 2024. The regions covered in liquid crystal polymer (LCP)-based molded interconnect device report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa. The countries covered in the liquid crystal polymer (LCP)-based molded interconnect device market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report’s Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.

The rapid rise in U.S. tariffs and the subsequent trade frictions in spring 2025 are having a major impact on the electrical and electronics sector, with semiconductors, display panels, and rare-earth metals (essential for batteries and motors) subject to steep duties. Consumer electronics brands face profit erosion, as competitive markets limit their ability to pass costs to buyers. Industrial electronics manufacturers, meanwhile, grapple with delayed projects due to shortages of tariff-impacted components like printed circuit boards. Companies are responding by relocating assembly to tariff-exempt countries, increasing inventory buffers, and redesigning products to reduce dependency on restricted materials.

The liquid crystal polymer (LCP)-based molded interconnect device market research report is one of a series of new reports that provides liquid crystal polymer (LCP)-based molded interconnect device market statistics, including liquid crystal polymer (LCP)-based molded interconnect device industry global market size, regional shares, competitors with a liquid crystal polymer (LCP)-based molded interconnect device market share, detailed liquid crystal polymer (LCP)-based molded interconnect device market segments, market trends and opportunities, and any further data you may need to thrive in the liquid crystal polymer (LCP)-based molded interconnect device industry. The liquid crystal polymer (LCP)-based molded interconnect device market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenarios of the industry.

Liquid crystal polymer (LCP)-based molded interconnect devices are advanced components that combine mechanical and electronic functionalities within a single three-dimensional structure made of LCP material. They enable precise circuit integration directly onto molded surfaces, reducing size and weight while improving overall performance. The inherent thermal stability, chemical resistance, and dimensional precision of LCP make these devices suitable for demanding, high-reliability electronic applications.

The key product types of liquid crystal polymer (LCP)-based molded interconnect devices are sensor housings, antennas, connectors, interconnects, and others. Sensor housings are protective enclosures that integrate sensors with circuit pathways, providing high precision, heat resistance, and miniaturization for compact electronic assemblies. The process types include laser direct structuring, two-shot molding, and others, and they are employed across several end-use industries, including healthcare, automotive, consumer electronics, telecommunication, aerospace and defense, and others.

The liquid crystal polymer (LCP)-based molded interconnect devices market consist of sales of switch assemblies, LED packages, circuit modules, and microelectronic components. Values in this market are ‘factory gate’ values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

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