Non-UV Dicing Tapes Market Global Report 2026

The non-UV dicing tapes market size has grown strongly in recent years. It will grow from $0.99 billion in 2025 to $1.08 billion in 2026 at a compound annual growth rate (CAGR) of 9.2%. The growth in the historic period can be attributed to growth in semiconductor manufacturing capacity, rising demand for consumer electronics devices, increasing adoption of precision wafer processing, expansion of integrated circuit production, advancements in adhesive film technologies.

The non-UV dicing tapes market size is expected to see strong growth in the next few years. It will grow to $1.55 billion in 2030 at a compound annual growth rate (CAGR) of 9.5%. The growth in the forecast period can be attributed to increasing investment in advanced chip fabrication facilities, rising demand for miniaturized electronic components, growing adoption of AI-enabled semiconductor devices, expansion of electric vehicle electronics manufacturing, increasing focus on defect-free wafer dicing processes. Major trends in the forecast period include increasing demand for ultra-thin dicing tapes, rising adoption of high precision wafer singulation processes, growing focus on low residue adhesive technologies, expansion of advanced semiconductor packaging applications, increasing use of high cleanliness dicing materials.

The increasing demand for consumer electronics is expected to drive the growth of the non-ultraviolet dicing tapes market going forward. Consumer electronics demand refers to the rising purchase and usage of electronic devices such as smartphones, tablets, laptops, and wearable devices for personal and professional applications. The growing demand for consumer electronics is increasing due to rising digitalization, increasing disposable incomes, rapid technological advancements, and the expanding adoption of smart and connected devices. Non-ultraviolet dicing tapes support the increasing demand for consumer electronics by enabling precise wafer dicing, protecting semiconductor components during manufacturing, and improving yield and efficiency in chip production, thereby enhancing the reliability and performance of electronic devices. For instance, in February 2026, according to the International Trade Administration, a UK-based government organization, In 2024-2025, UK eCommerce sales grew by nearly 30%, with electronics being one of the key product categories driving this growth. Therefore, the increasing demand for consumer electronics is driving the growth of the non-ultraviolet dicing tapes market.

The rising investments in 5G infrastructure are expected to drive the growth of the non-ultraviolet dicing tapes market going forward. 5G infrastructure refers to the increasing allocation of funds by governments, telecom operators, and private enterprises to build, expand, and upgrade 5G networks, including towers, base stations, and supporting semiconductor technology. The rising investments in 5G infrastructure are increasing due to the global push for high-speed connectivity, the growing adoption of IoT devices, and the requirement for low-latency, high-reliability communication networks. Non-ultraviolet dicing tapes support the rising investments in 5G infrastructure by enabling precise wafer dicing, protecting semiconductor components during the production of 5G chips and modules, and improving yield and efficiency in semiconductor manufacturing, thereby ensuring the performance, reliability, and scalability of 5G-enabled devices and networks. For instance, in April 2023, according to the Department for Science, Innovation and Technology, a UK-based government statistics source, the UK announced an investment package worth nearly £150 million, with up to £100 million allocated for future research and £40 million specifically dedicated to boosting 5G technology adoption. Therefore, the rising investments in 5G infrastructure are driving the growth of the non-ultraviolet dicing tapes market.

Leading operating in the non-UV dicing tapes market are focusing on developing innovative solutions, such as advancements in pressure-sensitive adhesive materials, to meet the rising demand for high-precision wafer handling and advanced semiconductor packaging processes. Pressure-sensitive adhesive materials for non-UV dicing tapes are engineered polymer films designed to provide strong and stable adhesion during wafer singulation without requiring ultraviolet curing. This offers advantages over traditional UV-based tapes by reducing process complexity, eliminating the need for UV exposure equipment, and minimizing the risk of wafer warpage or damage. For example, in October 2024, Furukawa Electric Co., Ltd., a Japan-based semiconductor materials company, filed a patent application (PCT/JP2024/009977) for Pressure-Sensitive Adhesive Tape for Dicing and published as WO/2024/203387. This innovative adhesive tape is engineered for ultra-thin wafers, providing consistent debonding, reduced wafer warpage, and precise die separation, making it suitable for next-generation AI and fan-out packaging applications where mechanical stability and clean release are critical. The development demonstrates how pressure-sensitive adhesives are evolving to support complex semiconductor manufacturing by ensuring controlled release without UV exposure, thereby improving yield and reliability in high-volume production.

Major companies operating in the non-uv dicing tapes market are 3M Company, Henkel AG & Co. KGaA, Mitsui Chemicals Inc., Resonac Holdings Corporation, Sekisui Chemical Co. Ltd., Furukawa Electric Co. Ltd., Nitto Denko Corporation, Denka Company Limited, Sumitomo Bakelite Co. Ltd., Lintec Corporation, Maxell Ltd., Shanghai Sinyang Semiconductor Materials Co. Ltd., Teraoka Seisakusho Co. Ltd., Daehyun ST Co. Ltd., Toyo Adtec Co. Ltd., AI Technology Inc., S3 Alliance GmbH, Daest Coating India Pvt. Ltd., Loadpoint Limited, KGK Chemical Corporation.

North America was the largest region in the non-ultraviolet dicing tapes market in 2025. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the non-UV dicing tapes market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the non-UV dicing tapes market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The non-UV dicing tapes market consists of sales of polyolefin-based dicing tapes, PVC dicing tapes, polyethylene dicing tapes, pressure-sensitive adhesive tapes, high-adhesion dicing tapes, low-adhesion dicing tapes, and specialty non-UV tapes for semiconductor and electronic component applications. Values in this market are ‘factory gate’ values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

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