EUV Pellicle - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026-2031)

The EUV pellicle market size was valued at USD 0.75 billion in 2025 and is estimated to grow from USD 0.85 billion in 2026 to reach USD 1.60 billion by 2031, at a CAGR of 13.47% during the forecast period (2026-2031). This report is segmented by Product Type (Membrane Pellicles, Non-Membrane Pellicles, and Others), End-User (Semiconductor Foundries, Integrated Device Manufacturers, Memory Manufacturers, Photomask Manufacturers, and Others), and Geography (Asia-Pacific, North America, Europe, South America, and Middle East and Africa). The Market Forecasts are Provided in Terms of Value (USD).

Global EUV Pellicle Market Trends and Insights

Expansion of EUV Lithography in 5 nm, 3 nm and 2 nm Production

Each successive logic node requires more EUV patterning steps than its predecessor, increasing recurring use requirements in the EUV pellicle market. This creates a direct increase in exposure activity and pellicle use per wafer across logic production, which gives the EUV pellicle market a demand base. Taiwan Semiconductor Manufacturing Company Limited placed its 2 nm technology into production in Q4 2025 with nanosheet transistors that require tighter overlay control than 3 nm FinFET production. The company’s A16 technology is production-ready in 2H 2026 and is intended for high-performance computing and artificial intelligence applications. Existing 5 nm equipment can also be adapted to add 3 nm capacity over a 6-to-12-month cycle, which creates further demand because the newer process uses more EUV patterning steps and tighter process tolerances. Samsung’s Taylor, Texas, facility, which targets advanced-node production, adds a North American location for this demand.

Rising AI, High-Performance Computing and Advanced Logic Demand

Artificial intelligence infrastructure supports sustained investment in leading-edge semiconductor capacity and supports more consistent utilization across the EUV pellicle market. Advanced processors carry a high value per wafer, which increases the importance of avoiding interruptions caused by mask contamination and makes proven pellicle protection more operationally relevant for high-throughput fabs. ASML stated in its Q2 2026 results that it is expanding EUV capacity for 2027 in response to demand linked to artificial intelligence infrastructure. This demand comes from customers including TSMC, Samsung, and Intel, whose advanced-node capacity plans influence the EUV pellicle market across the wider materials supply chain. It supports continued use of established membrane materials while newer carbon nanotube (CNT) materials move through qualification. It also gives pellicle suppliers an incentive to improve productivity because higher scanner availability can translate into more advanced-chip output.

Stringent Defectivity, Lifetime and Uniformity Qualification

EUV pellicles face a demanding qualification process that governs entry into the EUV pellicle market, which limits the speed of supplier entry. Membranes that are 30 to 50 nm thick must maintain transmittance uniformity within a half-range of 0.4% across a 110 mm × 144 mm area. They must also survive 20,000 or more wafer exposures in hydrogen plasma conditions. Hydrogen exposure can gradually reduce optical transmission and embrittle the membrane after thousands of exposures, which makes lifetime prediction a production-critical engineering requirement. The challenge affects both CNT and silicon-based materials, as durability work on metal-silicide pellicles has shown. Production also requires cleanroom controls and particle limits that restrict the number of facilities able to support qualified output, including the ISO 14644 Class 1 conditions used in this manufacturing workflow.

Other drivers and restraints analyzed in the detailed report include:

• High-NA EUV Adoption Requiring Higher-Transmittance Pellicles
• Higher EUV Source Power Increasing Pellicle Replacement Requirements
• High Pellicle Cost Relative to Conventional DUV Alternatives

Segment Analysis

Membrane pellicles held a 59.85% share of the EUV pellicle market in 2025. Their position was supported by the installed base of ASML NXE 0.33 NA scanners operating at source powers up to 400 W. Silicon-based and metal-silicide composite membranes have accumulated production exposure data at TSMC, Samsung, and SK hynix fabs. That operating history remains important because customers require extensive evidence before approving another pellicle material. Their established compatibility with scanner, mask, and reticle-handling processes supports continued demand, while the EUV pellicle industry depends on material consistency as much as laboratory transmittance.

Non-membrane pellicles in the EUV pellicle market are projected to advance at a 14.74% CAGR through 2031. This category includes CNT membrane pellicles and other non-patterned protection approaches. CANATU’s Floating Catalyst Chemical Vapor Deposition (FC-CVD) CNT reactor technology is licensed to FST, while Mitsui Chemicals, Inc. is building its own CNT pellicle capability. Other commercially early approaches include photomask-integrated protection concepts and experimental materials, while metal-silicide composites demonstrate more than 90% transmittance and survival through 20,000 wafer exposures at 400 W in controlled testing. Both established composites and CNT options are, therefore, likely to remain relevant through 2031.

Complete Report Scope:

• By Product Type
  • Membrane Pellicles
  • Non-Membrane Pellicles
  • Others
• By End-User
  • Semiconductor Foundries
  • Integrated Device Manufacturers
  • Memory Manufacturers
  • Photomask Manufacturers
  • Others
• By Geography
  • Asia-Pacific
    • China
    • India
    • Japan
    • South Korea
    • ASEAN Countries
    • Rest of Asia-Pacific
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • Germany
    • United Kingdom
    • France
    • Italy
    • NORDIC Countries
    • Rest of Europe
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Middle East and Africa
    • Saudi Arabia
    • South Africa
    • Rest of Middle East and Africa

Geography Analysis

Asia-Pacific held 62.78% of the EUV pellicle market share in 2025 and is projected to advance at a 14.31% CAGR through 2031. The region hosts the major EUV-capable chipmakers and much of the related materials supply chain, so installed scanner capacity and qualified membrane production are closely linked geographically. South Korea is a major demand center because Samsung and SK Hynix operate leading logic and memory fabs. Taiwan is central to foundry consumption because TSMC is ramping multiple 2 nm fabs.

Japan combines local demand with supply from Mitsui Chemicals and Shin-Etsu Chemical, while China’s EUV pellicle market demand remains constrained by export controls on EUV scanner shipments. Domestic chipmakers are expanding DUV capacity, which can support related pellicle demand through photomask operations. India, ASEAN countries, and the rest of the Asia-Pacific region remain at earlier stages of advanced semiconductor investment. India’s semiconductor incentive program is attracting downstream assembly capacity that may become a future demand signal if the regional manufacturing base moves further into wafer fabrication.

North America’s demand is supported by announced logic and memory investments that widen its role in advanced semiconductor manufacturing. Intel’s EUV-enabled fabs in Oregon and Arizona, Samsung’s Taylor facility, and Micron’s U.S. expansion support regional demand. U.S. primary membrane supply is limited, while Entegris provides reticle-handling and contamination-control infrastructure. Europe has a strategic role because ASML is based in the Netherlands and Carl Zeiss SMT produces optical columns in Germany, while South America and Middle East and Africa have low demand because neither region operates EUV-capable fabs. Saudi Arabia’s chip investment plans remain focused on packaging and design rather than leading-edge wafer fabrication in the near term.

List of Companies Covered in this Report:

• AGC Inc.
• ASML
• CANATU
• Dai Nippon Printing Co., Ltd.
• Entegris
• FST
• FUJIFILM Group
• HOYA Corporation
• Mitsui Chemicals, Inc.
• S & S Technologies
• Shin-Etsu Chemical Co., Ltd.
• SKC Co., Ltd.
• Sumitomo Chemical Co., Ltd.
• Toppan Inc.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support