Chemical Mechanical Planarization (CMP) Slurry Market Global Report 2026

The chemical mechanical planarization (CMP) slurry market size has grown rapidly in recent years. It will grow from $5.01 billion in 2025 to $5.52 billion in 2026 at a compound annual growth rate (CAGR) of 10.1%. The growth during the historic period was driven by increasing semiconductor fabrication capacity expansion, growing demand for advanced integrated circuits, rising adoption of CMP processes in wafer manufacturing, increasing production of miniaturized electronic devices, and expanding use of semiconductor components across consumer electronics and automotive applications.

The chemical mechanical planarization (CMP) slurry market size is expected to see rapid growth in the next few years. It will grow to $8.18 billion in 2030 at a compound annual growth rate (CAGR) of 10.3%. The growth during the forecast period can be attributed to increasing demand for advanced node semiconductor manufacturing, rising adoption of CMP slurry for 3D semiconductor architectures, growing requirement for high-purity slurry formulations in advanced packaging, expanding semiconductor manufacturing investments across emerging regions, and increasing demand for next-generation electronic devices requiring improved wafer performance. Major trends during the forecast period include increasing demand for high-precision CMP slurry formulations in advanced semiconductor manufacturing, rising adoption of customized slurry solutions for advanced wafer materials and processes, growing development of low-defect and high-performance CMP slurry chemistries, expanding demand for ultra-fine abrasive particle technologies in wafer planarization, and increasing focus on improving CMP slurry efficiency for next-generation semiconductor fabrication.

The expansion of semiconductor manufacturing is expected to drive the growth of the chemical mechanical planarization (CMP) slurry market in the coming years. Semiconductor manufacturing involves the design, fabrication, and packaging of integrated circuits and semiconductor devices on silicon wafers for applications across electronic products and systems. The expansion of semiconductor manufacturing is being driven by the rising demand for artificial intelligence applications, which require advanced chips with enhanced processing capabilities and increased memory capacity. Chemical mechanical planarization (CMP) slurry supports semiconductor manufacturing by enabling precise wafer surface polishing and planarization, producing ultra-smooth and defect-free layers that are critical for reliable device performance and ongoing scaling of advanced chip fabrication. For instance, in June 2024, according to the Semiconductor Equipment and Materials International, a US-based industry association, semiconductor manufacturing capacity was expected to increase by 6% in 2024 and grow by 7% in 2025. Therefore, the expansion of semiconductor manufacturing is driving the growth of the chemical mechanical planarization (CMP) slurry market.

Major companies operating in the chemical mechanical planarization (CMP) slurry market are concentrating on developing innovative products, including advanced-material-compatible slurry formulations, to enhance planarization accuracy, defect reduction, and compatibility with next-generation semiconductor architectures. Advanced-material-compatible slurry formulations are CMP slurries specifically designed to effectively process emerging semiconductor materials, such as low-k dielectrics, copper, and advanced barrier metals, while preventing damage and maintaining precise polishing performance and surface uniformity. For instance, in September 2025, FUJIFILM Corporation, a Japan-based materials and technology company, introduced a new CMP slurry specifically developed for advanced packaging applications in semiconductor manufacturing. The product enables hybrid bonding processes by providing highly precise planarization of bonding surfaces, which is crucial for integrating multiple semiconductor chips into a single high-performance package. Additionally, the slurry is designed to achieve the extremely high surface flatness standards required for next-generation AI semiconductors, where nanoscale defects can impact device performance and production yield. The solution has already been adopted by a major semiconductor manufacturer, demonstrating its importance in enhancing manufacturing precision and supporting the transition toward multi-chip and high-density semiconductor architectures.

In October 2025, YCCHEM Co. Ltd., a South Korea-based manufacturing company, acquired SK Enpulse’s CMP slurry division for an undisclosed amount. Through this acquisition, YCCHEM aims to expand its semiconductor materials portfolio, strengthen its position in the global chemical mechanical planarization (CMP) slurry market, and enhance its technological capabilities for advanced node semiconductor manufacturing. SK Enpulse Co., Ltd. is a South Korea-based company that provides chemical mechanical planarization (CMP) slurry products and related precision polishing materials used in semiconductor wafer fabrication processes.

Major companies operating in the chemical mechanical planarization (cmp) slurry market are AGC Inc., Anji Microelectronics Technology Co. Ltd., BASF SE, Compagnie de Saint-Gobain S.A., DuPont de Nemours Inc., Entegris Inc., FUJIFILM Holdings Corporation, Fujimi Incorporated, Hubei Dinglong Co. Ltd., KC Tech Co. Ltd., Merck KGaA, Resonac Holdings Corporation, Soulbrain Co. Ltd., 3M Company.

Asia-Pacific was the dominating region in the chemical mechanical planarization (CMP) slurry market in 2025. Asia-Pacific is expected to be the rapidly growing region in the forecast period. The regions covered in the chemical mechanical planarization (CMP) slurry market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the chemical mechanical planarization (CMP) slurry market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

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