Chemical Mechanical Planarization (CMP) Slurries For Advanced Packaging Market Global Report 2026

The chemical mechanical planarization (CMP) slurries for advanced packaging market size has grown rapidly in recent years. It will grow from $1.42 billion in 2025 to $1.57 billion in 2026 at a compound annual growth rate (CAGR) of 11.0%. The growth in the historic period can be attributed to increasing adoption of advanced semiconductor packaging, rising demand for wafer-level packaging, growing semiconductor manufacturing capacity, increasing use of fine-particle abrasive formulations, and rising demand for improved surface planarity.

The chemical mechanical planarization (CMP) slurries for advanced packaging market size is expected to see rapid growth in the next few years. It will grow to $2.35 billion in 2030 at a compound annual growth rate (CAGR) of 10.6%. The growth in the forecast period can be attributed to expanding adoption of 3D packaging architectures, increasing demand for chiplet-based semiconductor designs, rising need for high-throughput planarization processes, growing use of heterogeneous integration, and increasing demand for low-defect packaging processes. Major trends in the forecast period include increasing adoption of high-precision CMP slurries for advanced packaging, rising demand for low-defect surface planarization, growing use of ultra-fine abrasive particle formulations, increasing development of selective material removal chemistries, and rising demand for slurries optimized for heterogeneous material stacks.

The expansion of artificial intelligence (AI) infrastructure is expected to drive the growth of the chemical mechanical planarization (CMP) slurries for advanced packaging market in the coming years. Artificial intelligence (AI) infrastructure refers to the specialized hardware, semiconductor components, data centers, and computing systems required to develop, deploy, and operate AI applications at scale. Artificial intelligence (AI) infrastructure is expanding due to the rising adoption of AI-driven applications, generative AI models, and high-performance computing systems, which require advanced semiconductor packages with improved performance, higher bandwidth, and greater processing efficiency. Artificial intelligence (AI) infrastructure supports chemical mechanical planarization (CMP) slurries for advanced packaging by increasing demand for advanced semiconductor packages that require precise planarization processes for high-performance AI chips. For instance, in November 2025, according to Deloitte, a UK-based professional services network provider, the majority of AI computations will continue to be performed using advanced, expensive, and power-intensive AI chips valued at over US$200 billion, which will primarily be deployed in large-scale data centers valued at more than US$400 billion and on-premise enterprise solutions worth approximately US$50 billion that use similar chips and rack architectures, rather than on chips used in edge devices. Therefore, the expansion of artificial intelligence (AI) infrastructure is driving the growth of the chemical mechanical planarization (CMP) slurries for advanced packaging market.

Major companies operating in the chemical mechanical planarization (CMP) slurries for advanced packaging market are focusing on technological advancements, such as hybrid bonding CMP slurry technology, to improve planarization accuracy, enable finer interconnect pitches, and support next-generation semiconductor packaging. Hybrid bonding CMP slurry technology refers to specialized chemical mechanical planarization formulations designed to produce ultra-flat copper and dielectric surfaces required for direct chip-to-chip or wafer-to-wafer bonding while minimizing surface defects, dishing, and erosion. For instance, in September 2025, FUJIFILM Corporation, a Japan-based imaging and semiconductor materials company, launched its Advanced Packaging CMP Slurry. The product provides high-precision planarization for hybrid bonding surfaces where copper and oxide films coexist, incorporates optimized abrasive, additive, and corrosion inhibitor formulations, and supports future advanced packaging applications, including redistribution layers (RDLs) and micro-bumps. These features enable higher packaging density, improved electrical performance, and greater reliability for AI and high-performance computing semiconductors.

In August 2024, Entegris Inc., a US-based supplier of advanced materials and process solutions for semiconductor and high-technology industries, partnered with onsemi to provide chemical mechanical planarization (CMP) solutions for silicon carbide (SiC) applications. Through this partnership, Entegris aims to support onsemi’s high-volume manufacturing of SiC wafers by providing co-optimized CMP solutions, including slurries, pads, brushes, and post-CMP cleaning products, to improve wafer polishing yields and reduce defects. Onsemi is a US-based semiconductor manufacturer that produces SiC-based semiconductors and other power semiconductor products but does not manufacture CMP slurries.

Major companies operating in the chemical mechanical planarization (CMP) slurries for advanced packaging market are Compagnie de Saint-Gobain S.A., Evonik Industries AG, AGC Inc., Entegris Inc., Tokuyama Corporation, Vibrantz Technologies Inc., Nissan Chemical Corporation, Dongjin Semichem Co. Ltd., Soulbrain Co. Ltd., Anji Microelectronics Technology (Shanghai) Co. Ltd., Fujimi Incorporated, Polysciences Inc., Beijing Grish Hitech Co. Ltd., Engis Corporation, KC Tech Co. Ltd., Hubei Dinglong Co. Ltd., Santoku Chemical Industries Co. Ltd., Signi Semiconductor Co. Ltd., Ace Nanochem Co. Ltd., Beijing Hangtian Saide Technology Development Co. Ltd., Shanghai Xinanna Electronic Technology Co. Ltd.

Asia-Pacific was the dominant region in the chemical mechanical planarization (CMP) slurries for advanced packaging market in 2025. Asia-Pacific is expected to be the rapidly growing region in the forecast period. The regions covered in the chemical mechanical planarization (CMP) slurries for advanced packaging market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the chemical mechanical planarization (CMP) slurries for advanced packaging market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

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