The chemical dry etching equipment market size is expected to see strong growth in the next few years. It will grow to $3.15 billion in 2030 at a compound annual growth rate (CAGR) of 7.2%. The growth in the forecast period can be attributed to increasing demand for advanced semiconductor nodes, rising production of high-performance computing chips, growing demand for compound semiconductor devices, increasing need for finer circuit geometries, and rising investment in semiconductor fabrication facilities. Major trends in the forecast period include increasing adoption of high-precision dry etching processes, rising demand for improved etching uniformity, growing use of selective etching techniques, increasing demand for low-damage substrate processing, and rising adoption of advanced etching process control.
The growth in automotive electronics and electric vehicles is expected to drive the growth of the chemical dry etching equipment market in the coming years. Automotive electronics and electric vehicles refer to electronic systems, components, and electrically powered vehicles that enhance vehicle performance, safety, connectivity, and energy efficiency. The growth in automotive electronics and electric vehicles is driven by increasing demand for advanced safety, connectivity, and energy-efficient technologies, as modern vehicles require sophisticated electronic systems to improve performance, reduce emissions, and enhance the driving experience. Automotive electronics and electric vehicle demand drives the growth of chemical dry etching equipment by enabling the precise fabrication of semiconductor devices, sensors, power electronics, and microelectromechanical systems used in advanced driver assistance systems, battery management systems, electric powertrains, and in-vehicle electronics. For instance, in January 2024, according to a report published by Kelley Blue Book, a US-based Cox Automotive company, a record 1.2 million car buyers in the United States chose electric vehicles in 2023, accounting for 7.6% of the entire U.S. vehicle market, up from 5.9% in 2022. Therefore, the growth in automotive electronics and electric vehicles (EVs) is driving the growth of the chemical dry etching equipment market.
Major companies operating in the chemical dry etching equipment market are focusing on developing advanced plasma etching systems to enhance etching precision, process uniformity, and manufacturing efficiency for advanced semiconductor and display applications. Plasma etching systems use reactive gases and plasma to selectively remove materials from substrates with high precision, enabling the production of fine circuit patterns and display structures. For instance, in August 2023, Tokyo Electron Ltd., a Japan-based semiconductor manufacturing equipment company, launched the Betelex 2700 PICP EX Plus plasma etch module for 8.7th generation flat panel display production. The system incorporates enhanced plasma distribution and temperature control technologies that improve etch uniformity, increase production yield, reduce operating costs, and support high-precision OLED display manufacturing.
In February 2025, Accuron Technologies Limited, a Singapore-based technology investment and engineering company, acquired Trymax Holding B.V. for an undisclosed amount. Through this acquisition, Accuron Technologies aimed to broaden its semiconductor equipment portfolio and strengthen its position in the European semiconductor equipment industry by incorporating Trymax’s plasma-based semiconductor manufacturing technologies into its existing portfolio. Trymax Holding B.V. is a Netherlands-based company that provides dry etching equipment, with a specific focus on plasma-based isotropic etching and light or shallow etching applications.
Major companies operating in the chemical dry etching equipment market are Applied Materials Inc., Lam Research Corporation, Tokyo Electron Limited, Hitachi High-Tech Corporation, Nordson MARCH Inc., ULVAC Inc., Advanced Micro-Fabrication Equipment Inc. China, Oxford Instruments Plasma Technology Limited, Shibaura Mechatronics Corporation, Wonik IPS Co. Ltd., GigaLane Co. Ltd., SENTECH Instruments GmbH, Plasma-Therm LLC, PSK Inc., Samco Inc., SEMES Co. Ltd., Trion Technology Inc., Plasma Etch Inc., Piotech Inc., NAURA Technology Group Co. Ltd.
Asia-Pacific was the dominant region in the chemical dry etching equipment market in 2025. Asia-Pacific is expected to be the rapidly growing region in the forecast period. The regions covered in the chemical dry etching equipment market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
The countries covered in the chemical dry etching equipment market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
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Table of Contents
Executive Summary
Chemical Dry Etching Equipment Market Global Report 2026 provides strategists, marketers and senior management with the critical information they need to assess the market.This report focuses chemical dry etching equipment market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
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Description
Where is the largest and fastest growing market for chemical dry etching equipment? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The chemical dry etching equipment market global report answers all these questions and many more.The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, total addressable market (TAM), market attractiveness score (MAS), competitive landscape, market shares, company scoring matrix, trends and strategies for this market. It traces the market’s historic and forecast market growth by geography.
- The market characteristics section of the report defines and explains the market. This section also examines key products and services offered in the market, evaluates brand-level differentiation, compares product features, and highlights major innovation and product development trends.
- The supply chain analysis section provides an overview of the entire value chain, including key raw materials, resources, and supplier analysis. It also provides a list competitor at each level of the supply chain.
- The updated trends and strategies section analyses the shape of the market as it evolves and highlights emerging technology trends such as digital transformation, automation, sustainability initiatives, and AI-driven innovation. It suggests how companies can leverage these advancements to strengthen their market position and achieve competitive differentiation.
- The regulatory and investment landscape section provides an overview of the key regulatory frameworks, regularity bodies, associations, and government policies influencing the market. It also examines major investment flows, incentives, and funding trends shaping industry growth and innovation.
- The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
- The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.
- The total addressable market (TAM) analysis section defines and estimates the market potential compares it with the current market size, and provides strategic insights and growth opportunities based on this evaluation.
- The market attractiveness scoring section evaluates the market based on a quantitative scoring framework that considers growth potential, competitive dynamics, strategic fit, and risk profile. It also provides interpretive insights and strategic implications for decision-makers.
- Market segmentations break down the market into sub markets.
- The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
- Expanded geographical coverage includes Taiwan and Southeast Asia, reflecting recent supply chain realignments and manufacturing shifts in the region. This section analyzes how these markets are becoming increasingly important hubs in the global value chain.
- The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
- The company scoring matrix section evaluates and ranks leading companies based on a multi-parameter framework that includes market share or revenues, product innovation, and brand recognition.
Scope
Markets Covered:
1) By Product Type: Plasma Etching Systems; Reactive Ion Etching Systems; Deep Reactive Ion Etching Systems; Other Product Types2) By Chamber Configuration: Single-Chamber Equipment; Multi-Chamber Equipment
3) By Material: Silicon; Compound Semiconductors; Other Substrate Materials
4) By Automation Level: Manual Equipment; Semi-Automatic Equipment; Fully Automatic Equipment
5) By End-Use Industry: Semiconductor; Electronics; Automotive; Aerospace And Defense; Healthcare; Industrial Manufacturing; Other End-Use Industries
Subsegments:
1) By Plasma Etching Systems: Capacitively Coupled Plasma Etching Systems; Microwave Plasma Etching Systems; Downstream Plasma Etching Systems2) By Reactive Ion Etching Systems: Parallel Plate Reactive Ion Systems; Magnetically Enhanced Reactive Ion Systems; Pulsed Reactive Ion Systems; High-Density Reactive Ion Systems
3) By Deep Reactive Ion Etching Systems: Bosch Process Deep Etching Systems; Cryogenic Deep Etching Systems; Time-Multiplexed Deep Etching Systems; Fast Gas Switching Deep Etching Systems
4) By Other Product Types: Atomic Layer Etching Systems; Plasma Ashing Systems; Plasma Descum Systems; Isotropic Dry Etching Systems
Companies Mentioned: Applied Materials Inc.; Lam Research Corporation; Tokyo Electron Limited; Hitachi High-Tech Corporation; Nordson MARCH Inc.; ULVAC Inc.; Advanced Micro-Fabrication Equipment Inc. China; Oxford Instruments Plasma Technology Limited; Shibaura Mechatronics Corporation; Wonik IPS Co. Ltd.; GigaLane Co. Ltd.; SENTECH Instruments GmbH; Plasma-Therm LLC; PSK Inc.; Samco Inc.; SEMES Co. Ltd.; Trion Technology Inc.; Plasma Etch Inc.; Piotech Inc.; NAURA Technology Group Co. Ltd.
Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Taiwan; Russia; South Korea; UK; USA; Canada; Italy; Spain
Regions: Asia-Pacific; South East Asia; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
Time Series: Five years historic and ten years forecast.
Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita.
Data Segmentations: Country and regional historic and forecast data, market share of competitors, market segments.
Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
Delivery Format: Word, PDF or Interactive Report + Excel Dashboard
Added Benefits
- Bi-Annual Data Update
- Customisation
- Expert Consultant Support
Companies Mentioned
- Applied Materials Inc.
- Lam Research Corporation
- Tokyo Electron Limited
- Hitachi High-Tech Corporation
- Nordson MARCH Inc.
- ULVAC Inc.
- Advanced Micro-Fabrication Equipment Inc. China
- Oxford Instruments Plasma Technology Limited
- Shibaura Mechatronics Corporation
- Wonik IPS Co. Ltd.
- GigaLane Co. Ltd.
- SENTECH Instruments GmbH
- Plasma-Therm LLC
- PSK Inc.
- Samco Inc.
- SEMES Co. Ltd.
- Trion Technology Inc.
- Plasma Etch Inc.
- Piotech Inc.
- NAURA Technology Group Co. Ltd.

