Integrated Circuit (IC) Chemical Mechanical Planarization (CMP) Slurries And Pads Market Global Report 2026

The integrated circuit (IC) chemical mechanical planarization (CMP) slurries and pads market size has grown strongly in recent years. It will grow from $3.78 billion in 2025 to $4.12 billion in 2026 at a compound annual growth rate (CAGR) of 9.1%. The growth in the historic period can be attributed to expansion of semiconductor manufacturing capacity, increasing production of integrated circuits, growing adoption of CMP in wafer fabrication, rising demand for high-quality wafer surfaces, and increasing complexity of semiconductor devices.

The integrated circuit (IC) chemical mechanical planarization (CMP) slurries and pads market size is expected to see strong growth in the next few years. It will grow to $5.73 billion in 2030 at a compound annual growth rate (CAGR) of 8.6%. The growth during the forecast period can be attributed to the proliferation of advanced semiconductor nodes, rising demand for high-performance computing chips, increasing production of AI semiconductors, growing adoption of 3D semiconductor architectures, and expansion of semiconductor foundry capacity. Major trends during the forecast period include increasing demand for advanced CMP materials, growing adoption of ultra-fine abrasive particles, rising demand for high-uniformity polishing pads, increasing need for low-defect wafer planarization, and development of next-generation CMP slurries for advanced nodes.

The rising demand for advanced semiconductor devices is expected to drive the growth of the integrated circuit (IC) chemical mechanical planarization (CMP) slurries and pads market going forward. Advanced semiconductor devices are high-performance integrated circuits produced using advanced process nodes and packaging technologies to provide higher computing power, improved energy efficiency, and enhanced functionality for applications including artificial intelligence (AI), high-performance computing (HPC), 5G, automotive electronics, and data centers. The demand for advanced semiconductor devices is growing due to the increasing adoption of artificial intelligence and high-performance computing applications, which require greater processing capabilities and more complex chip designs. The rising demand for advanced semiconductor devices increases the need for IC CMP slurries and pads by requiring highly precise wafer planarization to create defect-free multilayer structures and tighter circuit geometries necessary for high-performance chip manufacturing. For instance, in December 2025, according to the International Trade Administration (ITA), a US-based government agency, Taiwan's IC design industry generated an estimated $25.5 billion in 2023, compared with $23.1 billion in 2022, while AI chip design represented approximately 15%-20% of total IC design output, reaching an estimated $3.8 billion to $5.1 billion in 2023. Therefore, the rising demand for advanced semiconductor devices is driving the growth of the integrated circuit (IC) chemical mechanical planarization (CMP) slurries and pads market.

The growing adoption of artificial intelligence (AI) and high-performance computing (HPC) is expected to drive the growth of the integrated circuit (IC) chemical mechanical planarization (CMP) slurries and pads market going forward. Artificial intelligence (AI) refers to computer systems capable of performing tasks that typically require human intelligence, whereas high-performance computing (HPC) refers to the use of advanced computing systems to process large and complex workloads at extremely high speeds. The adoption of artificial intelligence (AI) and high-performance computing (HPC) is increasing due to the rising demand for data-intensive computing across various industries. The growing adoption of artificial intelligence (AI) and high-performance computing (HPC) increases the demand for IC CMP slurries and pads by requiring advanced semiconductor chips with complex multilayer architectures that rely on precise wafer planarization to maintain high yields and dependable performance. For instance, in April 2025, according to the Stanford Institute for Human-Centered Artificial Intelligence (Stanford HAI), a US-based academic research institute, 78% of organizations used AI in 2024, compared with 55% in 2023, representing a 23% increase within one year. Therefore, the increasing adoption of artificial intelligence (AI) and high-performance computing (HPC) is driving the growth of the integrated circuit (IC) chemical mechanical planarization (CMP) slurries and pads market.

In August 2024, Entegris Inc., a US-based company that provides integrated circuit (IC) chemical mechanical planarization (CMP) slurries and pads, entered into a long-term supply agreement with onsemi to enhance Entegris’ CMP solutions for silicon carbide wafer manufacturing and support onsemi’s high-volume semiconductor production. Under the partnership, Entegris will supply co-optimized CMP slurries and pads to onsemi for silicon carbide applications. The agreement is designed to improve wafer manufacturing yields, minimize defects, and address the increasing demand for SiC power semiconductors. onsemi is a US-based semiconductor manufacturer that produces silicon carbide-based power semiconductors and related solutions.

Major companies operating in the integrated circuit (IC) chemical mechanical planarization (CMP) slurries and pads market are DuPont de Nemours Inc., Merck KGaA, FUJIFILM Holdings Corporation, 3M Company, Resonac Corporation, Saint-Gobain Ceramics & Plastics Inc., Entegris Inc., AGC Inc., Evonik Industries AG, Nissan Chemical Corporation, Dongjin Semichem Co. Ltd., Soulbrain Co. Ltd., Fujimi Incorporated, Fuso Chemical Co. Ltd., Hubei Dinglong Co. Ltd., Sakai Chemical Industry Co. Ltd., Fujibo Holdings Inc., KC Tech Co. Ltd., Kinik Company, Saesol Diamond Ind. Co. Ltd., Anji Microelectronics Technology (Shanghai) Co. Ltd., CeramTec GmbH.

North America was the dominating region in the integrated circuit (IC) chemical mechanical planarization (CMP) slurries and pads market in 2025. Asia-Pacific is expected to be the rapidly growing region in the forecast period. The regions covered in the integrated circuit (IC) chemical mechanical planarization (CMP) slurries and pads market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the integrated circuit (IC) chemical mechanical planarization (CMP) slurries and pads market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

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