Progress in Smart Grid ICT Development Technologies, Standards, and Markets

1.1 General
1.1.1 Smart Grid Definition
1.2 Issues
1.3 Vision: SG ICT
1.3.1 Neural Grid
1.4 U.S.
1.4.1 Objectives
1.4.2 Statistics
1.4.3 Conceptual Model
1.4.4 Plans
1.5 England
1.6 Italy
1.7 China
1.8 Scope
1.9 Research Methodology
1.10 Target Audience

2.1 Main Organizations - Technologies
2.2 Structure
2.2.1 SG Layers
2.2.1.1 ETSI Layering
2.2.2 ETSI Subnetworks Architecture
2.3 Requirements: SG Networking
2.3.1 View
2.4 Industry and User Groups Projects
2.4.1 ETSI
2.4.2 IEC
2.4.3 IEEE
2.4.4 Global Intelligent Utility Network Coalition
2.4.5 Smart Networks Council (SNC)
2.4.6 U-SNAP Alliance
2.4.6.1 Specification and HAN
2.4.6.2 Merge
2.4.6.3 Further Development
2.4.7 ESMIG
2.4.8 Demand Response and Smart Grid Coalition (DRSG)
2.4.9 EPRI (Electrical Power Research Institute)
2.4.10 ZigBee and Wi-Fi Alliances
2.4.11 NIST
2.4.12 OpenHAN
2.4.13 Federal Smart Grid Task Force
2.4.14 Open Smart Grid Users Group (OSGUG)
2.4.15 ITU
2.4.16 OpenADR
2.4.17 Comments

3.1 Function and Structure: SG ICT
3.2 Current Status
3.3 Current Objectives
3.4 Choices
3.5 Smart Meters
3.5.1 Objectives
3.5.2 Details
3.5.3 Functions
3.5.4 Components
3.5.4.1 Communications
3.6 Security
3.7 Market
3.7.1 Market Drivers
3.7.2 Market Projections: Smart Meters
3.8 Industry

• Aclara (Software and Systems, BPL)
• Aeris (Wireless Network Provider)
• BPL Global (Software Platform)
• Carlson Wireless (Radio Platforms)
• Cisco (IP-based Infrastructure)
• Eaton (Cooper Power Systems)
• Elster (AMI, AMR)-Honeywell
• Echelon (Smart Metering System)
• GridPoint (Network Platform)
• Itron (Intelligent Metering)
• Nokia (Infrastructure)
• Oracle (Software)
• Landis+Gyr (Metering Devices)
• Sensus (Data Collection and Metering)
• Silver Spring Networks (acquired by Itron in 2018)
• Siemens (Software, Hardware)
• Spinwave (Building Control, HAN)
• Tantalus (Networking and Devices)
• Tendril (System)
• TransData (Wireless AMI/AMR Meter)
• TI
• Trilliant (Intelligent Metering)

4.1 IEEE
4.1.1 IEEE 2030
4.1.2 IEEE-802.15.4g-Smart Utility Networks
4.1.2.1 General
4.1.2.2 Purpose
4.1.2.3 Need
4.1.2.4 Value
4.1.2.5 Overview - PHY
4.1.2.6 Regions
4.1.2.6.1 Frequencies Allocations
4.1.2.7 Details
4.1.2.7.1 Requirements: Major Characteristics
4.1.2.7.2 Considerations
4.1.2.7.3 PHY/MAC Modifications
4.1.2.8 Summary
4.1.2.9 Wi-SUN
4.1.3 IEEE 802.22
4.1.3.1 General
4.1.3.2 Group
4.1.3.2.1 IEEE 802.22
4.1.3.2.2 IEEE 802.22.1
4.1.3.2.3 IEEE 802.22.2-2012
4.1.3.2.4 IEEE 802.22a-2014
4.1.3.2.5 IEEE 802.22b-2015
4.1.3.3 Developments
4.1.3.4 IEEE 802.22-2011 Overview
4.1.3.5 Major Characteristics - 802.22
4.1.3.6 IEEE 802.22 Details
4.1.3.6.1 Physical Layer - Major Characteristics
4.1.3.6.2 MAC Layer
4.1.3.7 Cognitive Functions
4.1.3.8 IEEE 802.22 - Marketing Considerations
4.1.3.9 Major Applications
4.1.3.10 Summary
4.1.3.11 802.22 and Smart Grid
4.1.3.12 Usage Models
4.1.3.13 Benefits
4.2 3GPP LTE and SG
4.2.1 3GPP
4.2.2 LTE Objectives
4.2.3 Key Features of LTE
4.2.3.1 LTE Advanced
4.2.4 Benefits
4.2.5 Market
4.2.5.1 Drivers
4.2.5.2 LTE Market Projections
4.2.6 Vendors

• Cisco
• CommAgility
• Ericsson
• Fujitsu
• Huawei
• Motorola Solutions
• Nokia
• Qualcomm
• Sequans
• TI
• u-blox
• ZTE

4.2.7 LTE and Smart Grid
4.2.7.1 General
4.2.7.2 Examples
4.2.7.2.1 Ericsson
4.2.7.2.2 Cisco
4.2.7.2.3 Nokia and Tantalus
4.2.7.3 Details
4.2.7.3.1 Scalable LTE IoT Platform and SG
4.2.7.3.2 SM Specifics - LTE
4.2.7.3.2.1 Choices
4.2.7.3.2.2 Reasons
4.2.7.4 Summary
4.3 Wired ICT - SG
4.3.1 IEEE 1901.2
4.3.2 Choices - ITU
4.3.2.1 G3 PLC
4.3.2.1.1 Maxim-G3 PLC
4.3.2.1.2 G3 PLC Alliance
4.3.2.1.3 Approval
4.3.2.1.4 Details
4.3.2.1.4.1 Specification
4.3.2.1.4.2 PHY Layer
4.3.2.1.4.3 MAC Layer
4.3.2.1.4.4 Network and Transport Layers
4.3.2.1.4.5 Application Layer
4.3.2.2 PRIME
4.3.2.2.1 PRIME Alliance
4.3.2.2.2 Benefits
4.3.2.2.3 Specification
4.3.2.2.4 PRIME Industry

5.1 Weightless Technologies
5.1.1 Weightless SIG
5.1.2 Common Features
5.1.3 Weightless-W
5.1.3.1 White Spaces Communications - Principles
5.1.3.2 Definition
5.1.3.3 Rational
5.1.3.3.1 Ecosystem and Use Cases
5.1.3.3.2 Weightless-W Details
5.1.4 Changes
5.1.5 Weightless-N
5.1.5.1 General
5.1.5.2 Open Standard
5.1.5.3 Nwave
5.1.5.4 Initial Deployments
5.1.5.5 Summary
5.1.6 Weightless-P
5.1.6.1 General
5.1.6.2 Details
5.1.6.2.1 M2COMM
5.1.7 Comparison of Weightless Technologies
5.1.8 Example
5.2 RPMA
5.2.1 Major Features
5.2.2 Proliferation
5.2.3 Components and Structure
5.2.4 Use Cases
5.3 LoRa
5.3.1 Alliance
5.3.1.1 Open Protocol
5.3.2 Technology Building Blocks
5.3.2.1 Layered Structure - Illustration
5.3.2.2 Modulation
5.3.2.3 Long Range
5.3.2.4 Applications
5.3.2.5 Network Architecture
5.3.2.6 Classes
5.3.2.7 LoRaWAN
5.3.2.8 Major Characteristics
5.3.3 Industry

• Actility
• Advantech
• Amiho
• Cisco
• Embit
• Link Labs
• LORIOT.io
• Microchip Technology
• MultiTech
• Murata
• Sagemcom
• Semtech
• STMicroelectronics
• Tektelic

5.4 SigFox
5.4.1 Company
5.4.2 Technology - Details
5.4.2.1 Uplink
5.4.2.2 Downlink
5.4.2.3 SmartLNB
5.4.3 Coverage
5.4.4 Use Cases
5.4.5 Industry

• Adeunis RF
• Innocomm
• Microchip
• On Semiconductor
• Telit
• TI

Appendix I: IEEE802.15.4g Characteristics
Appendix II: Regulations - TVWS
Appendix III: Survey of 802.22 Patents (issued 2017-2018)

Figure 1: Smart Grid Networking
Figure 2: SG Developmental Stages
Figure 3: U.S. SG - NIST Conceptual Model
Figure 4: U.S. - Smart Meters Installed (Mil)
Figure 5: Organizations
Figure 6: Smart Grid and ICT
Figure 7: “Smart” Support Network
Figure 8: Smart Grid - Layered Structure
Figure 9: ETSI-SG Layers
Figure 10: Networks Requirements
Figure 11: Layered Hierarchy - SG/ICT Standards
Figure 12: ETSI Documents
Figure 14: Interoperability Framework
Figure 15: SG - ICT Infrastructure
Figure 16: Smart Grid Connectivity
Figure 17: Estimate: Electrical SM Global Market ($B)
Figure 18: Estimate: Electrical SM Global Market (Mil. Units)
Figure 19: SG ICT Market Components
Figure 20: U.S. - SMs Penetration (2013-2015)
Figure 21: IEEE 2030 Group
Figure 22: SUN Place
Figure 23: Major Characteristics: IEEE 802.22
Figure 24: IEEE 802.22 Network: Usage Scenarios
Figure 25: 3GPP Releases (up to R.15)
Figure 26: LTE Subscription (Bil)
Figure 27: Major LTE Characteristics - R.8.0
Figure 28: LTE Frequency Bands (original)
Figure 29: LTE - IP
Figure 30: Release 8 Users Equipment Categories
Figure 31: Estimate- LTE Equipment Global Sales ($B)
Figure 32: “NarrowBand” LTE
Figure 33: Rel. 12 Category 0 - SG
Figure 34: LTE for Low Complexity UE
Figure 35: IoT Communications Technologies Characteristics
Figure 36: G3-PLC Frequencies
Figure 37: Rates of Transmission
Figure 38: PRIME Benefits
Figure 39: Layers - Prime
Figure 40: Iceni Characteristics
Figure 41: Nwave Characteristics Comparison
Figure 42: Weightless Technologies Comparison
Figure 43: RPMA Use Cases
Figure 44: LoRa Protocol Architecture
Figure 45: LoRa Architecture
Figure 46: LoRa Classes
Figure 47: Battery Lifetime
Figure 48: Regional Differences
Figure 49: Uplink Frame Format
Figure 50: Downlink Frame Format