Results for tag: "Die Bonder"

The Die Bonder market within the semiconductor industry is a specialized segment of the larger semiconductor equipment market. Die Bonders are used to attach semiconductor dies to a substrate, such as a printed circuit board, and are used in the production of a variety of electronic components. Die Bonders are used in the production of integrated circuits, memory chips, and other semiconductor devices. Die Bonders are typically used in the assembly of semiconductor packages, such as ball grid arrays, chip scale packages, and flip chips. Die Bonders are typically used in the production of high-volume, high-reliability semiconductor components. They are used in the production of components for a variety of applications, including consumer electronics, automotive, medical, and industrial. Some of the companies in the Die Bonder market include ASM Pacific Technology, Kulicke & Soffa Industries, Palomar Technologies, and Nordson MARCH. Show Less Read more